Reinhold H. Dauskardt
Stanford University
429 Papers
3.5K Citations
Reinhold H. Dauskardt is an academic researcher from Stanford University. The author has contributed to research in topics: Fracture mechanics & Fracture toughness. The author has an hindex of 59, co-authored 409 publications. Previous affiliations of Reinhold H. Dauskardt include University of California, Berkeley & Center for Advanced Materials.
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Papers
Perspectives on intrinsic toughening strategies and passivation of perovskite films with organic additives
Matthew Gutwald,Nicholas Rolston,Adam D. Printz,Oliver Zhao,Hannah Elmaraghi,Yichuan Ding,Jinbao Zhang,Reinhold H. Dauskardt +7 more
TL;DR: In this paper, 5-aminovaleric acid (5-AVA) was used as an additive to enhance the mechanical integrity of hybrid perovskite films, which increased plasticity and crack deflection around grain boundaries.
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Improved Adhesion of Dense Silica Coatings on Polymers by Atmospheric Plasma Pretreatment
TL;DR: It is found that adhesion enhancement was achieved through improved chemical bonding, chain interdiffusion, and mechanical interlocking at the coating/substrate interface, after a short atmospheric plasma treatment.
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Fracture properties of hydrogenated amorphous silicon carbide thin films
TL;DR: In this paper, the cohesive fracture properties of hydrogenated amorphous silicon carbide (a-SiC:H) thin films in moist environments are reported, and a new atomistic fracture model is presented to describe the observed moisture-assisted cracking in terms of the limited Si O Si suboxide bond formation that occurs in the films.
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Adhesion Measurement of Interfaces in Multilayer Interconnect Structures
TL;DR: In this article, a sandwich structure 4-point bend test was developed for measuring the adhesion between interlayer dielectric and metal interfaces, which offers well defined and easily controllable fracture processes and simple analyses based rigorously on fracture mechanics.
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Encapsulant Adhesion to Surface Metallization on Photovoltaic Cells
TL;DR: Using a fracture mechanics based metrology, the adhesion of an ethylene vinyl acetate (EVA) encapsulant to screen-printed silver metallization was evaluated in this paper.
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