The IEEE T RANSACTIONS ON C OMPUTER -A IDED D ESIGN OF I NTEGRATED C IRCUITS AND S YSTEMS publishes manuscripts focusing on methods, algorithms, and human-machine interfaces for physical and logical design, including: planning, synthesis, partitioning, modeling, simulation, layout, veriﬁcation, testing, and documentation of integrated-circuit and systems designs of all complexities. Practical applications of aids resulting in producible analog, digital, optical, or microwave integrated circuits are emphasized.TheIEEE T RANSACTIONS ON C OMPUTER -A IDED D ESIGN OF I NTEGRATED C IRCUITS AND S YSTEMS is published by the IEEE Council on Electronic Design Au- tomation. The IEEE Council on Electronic Design Automation (CEDA) is an organizational unit of the IEEE that has six IEEE member societies, namely, Antennas and Propagation, Circuits and Systems, Computer, Electron Devices, Microwave Theory and Techniques, and the Solid-State Circuits Societies. The objectives of CEDA include fostering design automation of electronic circuits and systems at all levels, by means of publications, conferences/workshops and volunteer activities. For membership and subscription information and pricing, please visit www.ieee.org/membership-catalog. Member copies of Transactions/Journals are for personal use only.

IEEE transactions on computer-aided design of integrated circuits and systems : a publication of the IEEE Circuits and Systems Society

A new low-power (LP) scan-based built-in self-test (BIST) technique is proposed based on weighted pseudorandom test pattern generation and reseeding. A new LP scan architecture is proposed, which supports both pseudorandom testing and deterministic BIST. During the pseudorandom testing phase, an LP weighted random test pattern generation scheme is proposed by disabling a part of scan chains. During the deterministic BIST phase, the design-for-testability architecture is modified slightly while the linear-feedback shift register is kept short. In both the cases, only a small number of scan chains are activated in a single cycle. Sufficient experimental results are presented to demonstrate the performance of the proposed LP BIST approach.

Low-Power Scan-Based Built-In Self-Test Based on Weighted Pseudorandom Test Pattern Generation and Reseeding

Here, this paper completely examines the crosstalk noise of Through-Silicon-Vias (TSVs) in high speed operations by means of a novel 3-Dimensional-IC Test structural design. In order to decline the crosstalk, the fast rise time devices have to be circumvented except they are essential for performance in some certain circuit parts. It must be noted that this system simultaneously examines the TSVs and the memory and does not require spending additional area for a test pattern generator in case of the TSV test. With the intention of reprocessing the test patterns of new-fangled memory BIST, the value of “data” or “address” need to be fixed to some specific values. In accordance with the outcomes of the TSV grouping, here also implemented a high-efficiency, low-area-overhead TSV test structural design. The amount of test cycles essential for the purpose of finding failing TSVs and regulate the fault category effectively than that in related work.

/pdf/a-novel-3-d-ic-test-architecture-a-review-32m12m3kko.pdf

A novel 3-D-IC test architecture-a review

To address the abating performance improvements from device scaling, innovative 2.5-D and 3-D integrated circuits with vertical interconnects called through-silicon vias (TSVs) have been widely explored. This paper reviews TSVs with focus on the following: 1) key drivers for TSV-based integration; 2) TSV fabrication techniques; 3) TSV electrical and thermomechanical performance fundamentals and characterization techniques; and 4) novel technologies to attain enhanced performance beyond the state-of-the-art TSVs.

Through-Silicon Vias: Drivers, Performance, and Innovations

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Analysis And Design Of Digital Integrated Circuits

Interposer-based 2.5D integrated circuits (ICs) are seen today as a precursor to 3D ICs based on through-silicon vias (TSVs). All the dies and the interposer in a 2.5D IC must be adequately tested for product qualification. We present an efficient built-in self-test (BIST) architecture for targeting defects in dies and in the interposer interconnects. The proposed BIST architecture can also be used for fault diagnosis during interconnect testing. To reduce the overall test cost, we describe a test scheduling and optimization technique under power constraints. We present simulation results to validate the BIST architecture and demonstrate fault detection, synthesis results to evaluate the area overhead of the proposed BIST architecture, and test scheduling results to highlight the effectiveness of the optimization approach.

Built-In Self-Test and Test Scheduling for Interposer-Based 2.5D IC

Interposer-based 2.5D integrated circuits (ICs) are seen today as a first step towards the eventual industry adoption of 3D ICs based on through-silicon vias (TSVs). The TSVs and the redistribution layer (RDL) in the silicon interposer, and micro-bumps in the assembled chip must be adequately tested for product qualification. We present an efficient interconnect-test solution that targets TSVs, RDL wires, and micro-bumps for shorts, opens, and delay faults. The proposed test technique is fully compatible with the IEEE 1149.1 Standard. To reduce test cost, we also present a test-path design and scheduling technique that minimizes a composite cost function based on test time and the design-for-test overhead in terms of additional TSVs and micro-bumps needed for test access. We present simulation results to demonstrate the effectiveness fault detection, and synthesis results to evaluate the hardware cost per die relative to 1149.1. We also present test-path design and test-scheduling results to highlight the effectiveness of the optimization technique.

At-speed interconnect testing and test-path optimization for 2.5D ICs

Despite the promise and benefits offered by 3D integration, testing remains a major obstacle that hinders its widespread adoption. Test techniques and design-for-testability (DfT) solutions for 3D ICs are now being studied in the research community, and experts in industry have identified a number of hard problems related to the lack of probe access for wafers, test access in stacked dies, yield enhancement, and new defects arising from unique processing steps. We describe a number of testing and DfT challenges, and present some of the solutions being advocated for these challenges. Techniques highlighted in this paper include: (i) pre-bond testing of TSVs and die logic, including probing and non-invasive test using DfT; (ii) post-bond testing and DfT innovations related to the optimization of die wrappers, test scheduling, and access to dies and inter-die interconnects; (iii) interconnect testing in interposer-based 2.5D ICs; (iv) fault diagnosis and TSV repair; (v) cost modeling and test-flow selection.

Test and Design-for-Testability Solutions for 3D Integrated Circuits

We present a programmable method for shift-clock stagger assignment to reduce power supply noise during system-on-chip (SoC) testing. An SoC design is typically composed of several blocks and two neighboring blocks that share the same power rails should not be toggled at the same time during shift. Therefore, the proposed programmable method does not assign the same stagger value to neighboring blocks. The positions of all blocks are first analyzed and the shared boundary length between blocks is then calculated. Based on the position relationships between the blocks, a mathematical model is presented to derive optimal result for small-to-medium sized problems. For larger designs, a heuristic algorithm is proposed and evaluated. We present assignment results as well as power-analysis results and silicon data for industry designs to highlight the effectiveness of the proposed method.

A programmable method for low-power scan shift in SoC integrated circuits

2.5-D integration is emerging as the precursor to stacked 3-D ICs. Since the silicon interposer and micro-bumps in 2.5-D integration can suffer from fabrication and assembly defects, post-bond testing is necessary for product qualification. This paper proposes and evaluates an interposer test architecture based on extensions to the IEEE 1149.1 standard. The proposed method enables access to interconnects inside the interposer by probing on the C4 bumps. It provides an effective test method for opens, shorts, and interconnect delay defects in the interposer. Moreover, micro-bumps can be tested through test paths that include dies on the interposer. The proposed test technique is fully compatible with the IEEE 1149.1 architecture and can be controlled by the test-access port controller. We present HSPICE and ModelSim simulation results to demonstrate the effectiveness of fault detection. Simulation results show that a large range of defects can be detected, diagnosed, and characterized using the proposed approach. We also present synthesis results to evaluate the hardware cost per die relative to the IEEE 1149.1 standard. Synthesis results show that the cost of implementation of the architecture is negligible.

Scan-Based Testing of Post-Bond Silicon Interposer Interconnects in 2.5-D ICs

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