pdf/the-environmental-impacts-of-preparation-for-reuse-a-case-25urk2667k.pdf

The environmental impacts of preparation for reuse: A case study of WEEE reuse in Germany

Repurposing end of life notebook computers from consumer WEEE as thin client computers – A hybrid end of life strategy for the Circular Economy in electronics

Circular economy has gained increasing attention the last decade, and more often the main focus is on the large  global circles addressing recycling of materials rather than the “inner circles” that address maintenance/repair and reuse. In this article we investigate one such inner circle ofthe circular economy namely repair of smartphones which extends the lifetime of products and adds to a local economy. Local repair of smartphones has increased in the resent years in Denmark. These loop-closing businesses not only extend the useful lifetime of smartphones; they also entail both environmental benefits and economic value creation. We map the extent ofthe repair sector and investigate the drivers and barriers for its emergence. The study builds on desk studies for identification of repair companiesand telephone interviews with 33 out of 90 identified companies. The mapping of the businessesshows that the repair of smartphones constitute viable business opportunities, and that the main driversarerelated to the economic business potentials as well as motivated entrepreneurs who spot a market potential.The study concludes that the local circular economy within smartphone repair is due to large consumer willingness-to-pay for repair and maintenance services, and this can extend the lifetime of the smartphones. There are some special characteristics that limit the possibility to apply the results directly to other product groups, but further analysis of how to facilitate repair shops within other product groups are interesting in order to facilitate the development of local circles in a circular economy not only in Denmark but also in other countries.   Keywords : Circular economy; Smartphone;Repair; Remanufacturing.

/pdf/local-circles-in-a-circular-economy-the-case-of-smartphone-1pe4mdsjmx.pdf

Local circles in a circular economy: - the case of smartphone repair in Denmark

Understanding lifetimes and failure modes of defective washing machines and dishwashers.

Determination of the life-cycle environmental and human health impacts of semiconductor logic is essential to a better understanding of the role information technology can play in achieving energy efﬁciency or global warming potential reduction goals.This study provides a life-cycle assessment for digital logic chips over seven technology generations, spanning from 1995 through 2010. Environmental indicators include global warming potential, acidiﬁcation, eutrophication, ground level ozone (smog) formation, potential human cancer and non-cancer health effects, ecotoxicity and water use. While impacts per device area related to fabrication infrastructure and use-phase electricity have increased steadily, those due to transportation and fabrication direct emissions have fallen as a result of changes in process technology, device and wafer sizes and yields over the generations. Electricity, particularly in the use phase, and direct emissions from fabrication are the most important contributors to life-cycle impacts. Despite the large quantities of water used in fabrication, across the life cycle, the largest fraction of water is consumed in generation of electricity for use-phase power. Reducing power consumption in the use phase is the most effective way to limit impacts, particularly for the more recent generations of logic.

Life-cycle assessment of computational logic produced from 1995 through 2010

Effects of Structure and Surface Properties on the Performance of Zno Towards Photocatalytic Degradation of Methylene Blue

The current hype for product carbon footprints of IT, policy initiatives, such as the European ecodesign directive and several research activities recently lead to the publication of numerous LCA results of laptop computers. A comparison of the various studies unveils a broad variance among the results, which cannot be explained solely by technical differences: LCA for IT products still faces severe shortcomings and methodological uncertainties due to the complexity of the products, and assumptions to be made. This paper addresses the component level in the case of integrated circuits (ICs) to reveal the challenges in the data collection. The paper discusses the various approaches under consideration as reference units for IC-datasets, in order to contribute towards creating a harmonised reference unit of IC dataset.

State of the Art in Life Cycle Assessment of Laptops and Remaining Challenges on the Component Level: The Case of Integrated Circuits

Early replacement of EEE has often been argued in conjunction with the continuous improvement of energy efficiency in the use phase. Recent LCA studies show that the raw materials and manufacturing phase of many EEE have a proportionally increasing environmental impact. For mobile electronic products, an early replacement due to improved energy efficiency in the use phase is to some extent not reasonable anymore. This paper shows that the production, with about 56% of the GWP of a notebook has a significantly higher impact than the use phase. Moreover, GWP of the production of a notebook are so high, that they cannot be compensated in realistic time-periods by energy efficiency gains of new products. The paper recommends decision-makers to give attention to hardware upgrading, modular and repair-friendly product design, availability of spare parts, standardisation of components and minimum warranty periods while defining mandatory product policy for ICT.

/pdf/early-replacement-of-notebooks-considering-environmental-30xohekez0.pdf

Early replacement of notebooks considering environmental impacts

Heat shock transcription factor (Hsf) exists widely in eukaryotes and responds to various abiotic stresses by regulating the expression of downstream transcription factors, functional enzymes, and molecular chaperones. In this study, TaHsfA2-13, a heat shock transcription factor belonging to A2 subclass, was cloned from wheat (Triticum aestivum) and its function was analyzed. TaHsfA2-13 encodes a protein containing 368 amino acids and has the basic characteristics of Hsfs. Multiple sequence alignment analysis showed that TaHsfA2-13 protein had the highest similarity with TdHsfA2c-like protein from Triticum dicoccoides, which reached 100%. The analysis of tissue expression characteristics revealed that TaHsfA2-13 was highly expressed in root, shoot, and leaf during the seedling stage of wheat. The expression of TaHsfA2-13 could be upregulated by heat stress, low temperature, H2O2, mannitol, salinity and multiple phytohormones. The TaHsfA2-13 protein was located in the nucleus under the normal growth conditions and showed a transcriptional activation activity in yeast. Further studies found that overexpression of TaHsfA2-13 in Arabidopsis thaliana Col-0 or athsfa2 mutant results in improved tolerance to heat stress, H2O2, SA and mannitol by regulating the expression of multiple heat shock protein (Hsp) genes. In summary, our study identified TaHsfA2-13 from wheat, revealed its regulatory function in varieties of abiotic stresses, and will provide a new target gene to improve stress tolerance for wheat breeding.

https://www.frontiersin.org/articles/10.3389/fpls.2022.922561/pdf

Characteristics and Regulating Roles of Wheat TaHsfA2-13 in Abiotic Stresses

Effect of electroless Cu depositions for micro-via structure and thermal cycling reliability

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