Introduction to Electromagnetic Compatibility

We propose an efficient method to suppress the crosstalk based on the mode mismatch between spoof surface plasmon polariton (SPP) transmission line (TL) and microstrip. Since microstrip and spoof SPP TL support quasi-transverse electromagnetic (quasi-TEM) wave and transverse magnetic (TM) wave, respectively, the transmitting electromagnetic (EM) energy can hardly be coupled between these two kinds of TLs, which helps to reduce the crosstalk. For the cases of weak and strong coupling, two kinds of structures of spoof SPP TLs are designed. To verify the performance of crosstalk suppression, two samples of the coupled TLs are presented and fabricated. Simulated and experimental results show that the crosstalk of both strong and weak coupling is reduced by approximately 35 and 30 dB, respectively, by introducing the spoof SPP TL into the microstrip pair. Thus, crosstalk in traditional circuits can be alleviated by the mode mismatch between spoof SPP TLs and microstrips, which is significant for high-speed and high-density integrated systems.

Crosstalk Suppression Based on Mode Mismatch Between Spoof SPP Transmission Line and Microstrip

Stochastic electromagnetic fields with Gaussian amplitude probability distribution can be fully described by auto- and cross correlation spectra of the field components. The cross correlation spectra have to be known for the pairs of field components taken at different spatial points. Integrated electric dipole and magnetic loop probes together with active electronics in AlGaAs/GaAs-HEMT and SiGe:C-HBT technologies are presented. While the probes allow for a spatial resolution in the 100 μm range, integrated amplifiers provide about 30 dB gain over a bandwidth of about 10 GHz.

Near-field measurement of stochastic electromagnetic fields

In this work we introduce the Correlation Transmission Line Matrix (CTLM) method for time-domain computation of the auto- and cross correlation functions (ACFs and CCFs) of stationary stochastic electromagnetic fields. These ACFs and CCFs are computed from the Johns matrices, i.e. the discrete-time TLM Green's functions and are directly related to the EMI power spectra.

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Correlation Transmission Line Matrix (CTLM) modeling of stochastic electromagnetic fields

In this paper, we investigate the influence of the excitation of improper radiating modes (leaky modes) in the propagation characteristics of coupled microstrip transmission lines. We calculate the crosstalk noise excited in the victim line and evaluate the impact of the presence of a metallic top cover due to the circuit packaging. The time domain propagation of pulses of different widths and rise times are computed in order to study the effect of the separation between the coupled strips on the crosstalk noise currents. We show that both even and odd leaky modes can be simultaneously excited on the covered microstrip structure at low frequencies. This can seriously compromise the signal integrity on the line because of the appearance of effects such as radiation, power loss, and interference, which are usually found in microstrip transmission lines at high frequencies. Our results are compared with those provided by a conventional analysis based on the quasi-TEM approximation and transmission line theory. For an open microstrip structure, we have found that the transmission line model accounts properly for the crosstalk current on the victim line. However, on covered coupled microstrip lines with a sufficiently low top-cover height, the crosstalk noise is higher than expected and cannot be accurately predicted by the transmission line model, even at frequencies where the cross section of the line is much smaller than the wavelength.

Crosstalk in Coupled Microstrip Lines With a Top Cover

Due to the continually rising demands for high-speed, high-density and broadband applications, signal integrity modeling and analysis has become imperative for design and validation of modern VLSI designs. In this review article, basic concepts of high-speed interconnect modeling were discussed. Also recent advances in interconnect modeling, such as MRA, DEPACT and WR-TP were reviewed.

Modeling of High-Speed Interconnects for Signal Integrity Analysis¿ Part I

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Modeling of High-Speed Interconnects for Signal Integrity Analysis¿ Part I