The effects of 0.05 wt%Ni additions on In-35 wt%Sn (In–35Sn) alloy on the ex-situ interfacial reactions, in-situ microstructures formation during solidification, and mechanical properties during reflow soldering on Cu substrate were systematically studied. Reaction of In–35Sn with Cu resulted in the formation of two intermetallic Cu3(Sn,In) layers were found at the interface. When Ni is added, Ni is participated in the interfacial (Cu,Ni)3(Sn,In) layer formed at the In–35Sn-0.05Ni/Cu interface, causing the morphology of the IMC layer at the solder side to become more refined. Adding Ni resulted in the degree of undercooling In–35Sn decreasing close to zero. The in-situ real-time synchrotron x-ray imaging confirmed that the presence of Ni is responsible for the spontaneous β-In3Sn grain nucleation and formation of equiaxed grain in the solder joint. The grain refinement on the (Cu,Ni)3(Sn,In) IMC layer in In–35Sn-0.05Ni/Cu solder joint leads to minor increment in the shear strength. This study demonstrated the effectiveness of Ni microalloying in low temperature In–35Sn/Cu solder joint in modifying the β-In3Sn dendrite growth at the bulk solder and the microstructure refinement at the interface of the solder joints, which could potentially enhance the overall joint strength. 

The effectiveness of Ni microalloying on the microstructure and mechanical properties of low temperature In-35 wt%Sn/Cu solder joint

The Effectiveness of Ni Microalloying on the Microstructure and Mechanical Properties of Low Temperature In-35 Wt%Sn/Cu Solder Joint

Composite materials such as metal glasses or alloys combine the useful properties and compensate for the shortcomings of the constituent materials. Therefore, a composite material has improved attributes relative to its individual constituents and therefore, more functionalities. This makes alloys very attractive for radiation shielding in many extreme radiation environments. In this report, different gamma-photon interaction parameters of four SnX alloys (where, X = As, Bi, P, and Sb) were evaluated and analyzed at 0.2, 0.662, and 1.25 MeV. The mass attenuation coefficients (μ⁄ρ) of the materials were calculated using the XCOM. Furthermore, other parameters such as the effective atomic number (Zeff), electron density (Neff), mass energy absorption, the specific gamma constant, absorbed gamma dose rate, and buildup factors were also estimated. The values of μρ decreased with energy from 0.2844 cm2/g to 0.0518 cm2/g for SnP, 0.2664 cm2/g to 0.0510 cm2/g for SnAs, 0.3321 cm2/g to 0.0509 cm2/g for SnSb, and 0.7771 cm2/g to 0.0664 cm2/g for SnBi. Also, (Zeff)SnX and (Neff)SnX decreased with photon energy within the ranges of 33.01–41.25 and 2.66–3.32 1023 electrons/g for SnP; 41.68–44.30 and 2.59–2.76 1023 electrons/g for SnAs; 56.50–56.51 and 2.329–2.53 1023 electrons/g for SnSb; and 68.26–75.43 and 2.51–2.77 1023 electrons/g for SnBi, respectively. The exposure buildup factor of SnP, SnAs, SnSb, and SnBi at a depth of 40 mfp for 1,25 MeV photons were 27, 30, 17, and 16, respectively. Based on the computed quantities, it is clear that SnBi interact more with photons compared to the other three SnX materials. Moreover, the SnX materials can perform better than some commercial and well-known glass shields, especially at low photon energies. Being Pb-free, the SnX shields are preferable to commercial glass shields containing Pb for radiation protection purposes. 

Gamma attenuation and radiation shielding performance of SnX (X = As, Bi, P, and Sb) monolayers

Abstract Indium-based solder alloys are considered candidates for the next generation of low-temperature solder materials, especially for superconducting joints because of the properties of the β -In 3 Sn phase. The temperature-dependent phase transformation and thermal expansion behaviour of two different solder compositions including In-35Sn (in wt.%) and In-25.6Sn have been characterised using an in situ synchrotron powder X-ray diffraction method. The c-axis of the β -In 3 Sn unit cell in the In-35Sn alloy exhibited a complex relationship with increasing temperature compared to the positive increasing trend in In-25.6Sn due to the temperature-dependent solubility of Sn in β -In 3 Sn and change in the volume fraction of phases commencing at 80°C. In situ heating scanning electron microscopy recorded a real-time melting-solidification microstructure variation and phase transition during annealing at 90°C that was further analysed using energy dispersive X-ray spectroscopy. The observations are discussed with respect to the lattice parameters of the γ -InSn 4 and β -In 3 Sn phases and the proportions and composition of both phases present within the alloys. 

/pdf/the-temperature-dependent-phase-transformation-and-145clr0p.pdf

The Temperature-Dependent Phase Transformation and Microstructural Characterisation in In-Sn Solder Alloys

The Effect of Temperature on the Electrical Resistivity of Sn-Bi Alloys

Abstract The different rates of thermal expansion of the many materials that make up an electronic assembly combined with temperature fluctuations are the driver of the thermal fatigue failure of solder joints. A characteristic of the Sn-Bi system, which provided the basis for many of the low process temperature solder alloys that the electronics industry is now adopting, is the very temperature-sensitive solubility of Bi and Sn in the other phase. In this study, in situ synchrotron powder x-ray diffraction was used to characterize the temperature dependence of the lattice parameters of the βSn and Bi phases in Sn-57wt%Bi and Sn-37wt%Bi. The effects of temperature and solute were separated by comparing with the data from pure βSn and pure Bi and verified using density functional theory calculations. Furthermore, the coefficients of thermal expansion of βSn and Bi during heating were also derived to reveal the thermal expansion behavior. 

/pdf/the-effects-of-temperature-and-solute-diffusion-on-volume-1guw8rqu.pdf

The Effects of Temperature and Solute Diffusion on Volume Change in Sn-Bi Solder Alloys

/pdf/the-effects-of-temperature-and-solute-diffusion-on-volume-cir6gspo.pdf

Investigating the Effects of Rapid Precipitation of Bi in Sn on the Shear Strength of BGA Sn-Bi Alloys

Alloys based on the Sn-Bi system are widely considered as the most promising candidates for low temperature solders (LTS) in the electronics industry due to their low liquidus temperature, non-toxicity and relatively low cost. However, implementation of LTS is complicated as they exhibit different characteristics from conventional Pb-free solders. While the solid solubility of alloying additions in Sn is typically <1 wt% in the current generation of Pb-free solders, the solubility of Bi in Sn ranges from less than 3 wt% at room temperature to 21 wt% at the eutectic temperature of 139°C. In consequence, the microstructure and properties of Sn-Bi solders change significantly under varying temperature during normal service, affecting reliability. Since these changes are time and temperature dependent, interpreting results obtained using ex-situ methods requires assumptions about the stability of the alloy during transitions from the test environment to the observation environment, leading to an incomplete understanding of these changes. To address this, in-situ synchrotron powder X-ray diffraction (PXRD) and in-situ scanning electron microscopy (SEM) techniques were developed to investigate the time-temperature dependent lattice and microstructure of hypo-eutectic Sn-37wt%Bi and near-eutectic Sn-57wt%Bi solder alloys. This made possible for the first time the observation of changes during temperature fluctuations. The study revealed that lattice and microstructure are highly sensitive to factors like temperature ramp rate and isothermal holding time, not previously considered. The results will impact the design of electronic circuitry and process parameters during electronics assembly to enhance reliability and performance. 

In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys

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Papers

The Effects of Temperature and Solute Diffusion on Volume Change in Sn-Bi Solder Alloys

The Effects of Temperature and Solute Diffusion on Volume Change in Sn-Bi Solder Alloys

The Effect of Temperature on the Electrical Resistivity of Sn-Bi Alloys

Investigating the Effects of Rapid Precipitation of Bi in Sn on the Shear Strength of BGA Sn-Bi Alloys

In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys