Ping-Yang Wang
Shanghai Jiao Tong University
26 Papers
106 Citations
Ping-Yang Wang is an academic researcher from Shanghai Jiao Tong University. The author has contributed to research in topics: Heat transfer & Thermal conduction. The author has an hindex of 11, co-authored 21 publications. Previous affiliations of Ping-Yang Wang include Harbin Institute of Technology.
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Papers
Collecting performance of an evacuated tubular solar high-temperature air heater with concentric tube heat exchanger
TL;DR: In this article, a set of evacuated tube solar high temperature air heaters with simplified CPC (compound parabolic concentrator) and concentric tube heat exchanger is designed to provide flow air with a temperature of 150-230°C for industrial production.
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Modeling of thermoelectric generators with effects of side surface heat convection and temperature dependence of material properties
TL;DR: In this paper, a general model to analyze the performance of TEGs with consideration of their side surface heat convection (SSHC) and temperature-dependent material properties is developed.
35
Transient Coupled Radiation and Conduction in an Absorbing and Scattering Composite Layer
TL;DR: In this article, the radiative transfer coefficients of the absorbing and isotropic scattering composite are deduced by the ray tracing method in combination with Hottel and Sarofim's zonal method.
35
Experiment and simulation of natural convection heat transfer of transformer oil under electric field
TL;DR: In this paper, the authors investigated the heat transfer characteristics of transformer oil natural convection in a cavity with a linear electrode and established coupled physical and mathematical models of electric field, flow field and temperature field by the lattice Boltzmann method.
23
Effect of nano-structure coating on thermal performance of thermosyphon boiling in micro-channels
TL;DR: In this article, a novel micro-channel thermosyphon technology for passively cooling 3D stacked chips was provided, and the thermodynamic characteristics in vertical and inclined micro-channels with two open ends which simulate the specific stacked structure of actual 3D chip were experimentally carried out.
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