Cooling Systems in Data Centers: State of Art and Emerging Technologies

An experimental and computational investigation of thermal air flows through perforated pin heat sinks

Apparatus, systems, and methods for efficiently cooling computing devices having heat-generating electronic components, such as, for example, independently operable servers, immersed in a dielectric liquid coolant in a tank.

Liquid submerged, horizontal computer server rack and systems and methods of cooling such a server rack

The world's energy consumption shows an increasing trend. Unfortunately, it is still dominated by the use of fossil energy. This condition results in concerns that an energy crisis will occur due to running out of non-renewable energy and an environmental crisis of global warming. One of the technology sectors that consumes a lot of energy is computer servers and data centers. This technology sector is growing rapidly due to the increasingly complex computing and larger data. One of the main causes of inefficiency in this technology is a decrease in performance due to an increase in temperature. Therefore, effective and efficient technology is needed to overcome the increasing operating temperature of computer servers and data centers. One of the most prominent cooling technologies to solve this problem is immersion colling. This method has developed in various types with their respective advantages and disadvantages according to application needs. Therefore, review literature is needed to comprehensively discuss the development of immersion cooling technology from the past until now and projected developments in the future. In more detail, this paper comprehensively compiles the latest findings of immersion cooling technology which includes an overview of the cooling system, history, implementation, construction type, and advantages. 

The immersion cooling technology: Current and future development in energy saving

Computational design and optimisation of pin fin heat sinks with rectangular perforations

A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.

Cooled electronic system

The growth in demand for Information Technology (IT) systems and the requirements to better control carbon emissions is a large challenge for data centre design. Air-cooled data centres are becoming more efficient by layout and the adoption of compressor free cooling, but for higher densities, further efficiencies can be achieved with liquid (water) cooled systems, where liquid is either brought to the cabinet or is fed directly into the IT systems. This paper makes a comparison of the full energy consumption between hybrid air-cooled and direct liquid-cooled systems based on real operational systems using comparable IT components. The results based on real data demonstrate a significant level of energy reduction for a high density data centre solution that uses enclosed, immersed, direct liquid-cooled servers.

/pdf/case-study-of-a-data-centre-using-enclosed-immersed-direct-21y1to4jsg.pdf

Case study of a data centre using enclosed, immersed, direct liquid-cooled servers

Liquid immersion of datacom electronics can be configured as a cooling mechanism when components are in direct contact with a high dielectric strength liquid. This paper analyses the heat transfer capabilities of datacom electronics when they are enclosed in a cassette with a dielectric liquid and sandwiched against a cold plate positioned in parallel with the printed circuit board. A proxy server motherboard with controllable heat cells and temperature sensors is used to conduct a series of heat transfer experiments. The results of which demonstrate that the thermal conductance processes via the naturally convecting dielectric liquid improves as the power demand of the electronics increases.

Enclosed liquid natural convection as a means of transferring heat from microelectronics to cold plates

A cooling system for cooling of a heat generating electrical component, in particular to reduce the likelihood of overheating of electrical components or chemical breakdown of coolant fluid. The cooling system has a coolant liquid to absorb excess energy from the heat generating electrical component, the coolant liquid having an energy input threshold above which chemical breakdown of the coolant liquid occurs. A cooling module defines a volume containing the coolant liquid, wherein the heat generating electrical component is mounted within the volume and immersed in the coolant liquid. A power input is arranged to supply power into the cooling module to the heat generating electrical component, and a power regulator is provided external to the volume of the cooling module and connected to the power input so as to regulate the power supplied into the cooling module. Cooling systems are also described having coolant liquid comprising dissolved oxygen, having at least one element arranged within the volume comprising aluminium and/or aluminium oxide, and/or having a sealed volume with at least one seal which opens at a predetermined pressure or temperature corresponding to a temperature below the temperature at which the coolant liquid breaks down.

An immersion cooling system

A cooling apparatus comprises: an interfacing component that receives an electronic device and defines a convective thermal interface through which heat generated by the electronic device can be transferred via an inner coolant; and a heat exchanger arrangement, coupled to the convective thermal interface that transfers heat generated by the electronic device via the thermal interface to first and second isolated heat sinks. In the event that a part of the heat exchanger arrangement is unable to transfer heat to the first heat sink, it transfers at least some of the heat that would have been transferred to the first heat sink to the second heat sink. The heat exchanger arrangement comprises: a first coolant connector, receiving a first outer coolant as part of the first heat sink; and a second coolant connector, receiving a second outer coolant as part of the second heat sink.

Cooling system with redundancy

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