Chemical looping gasification coupled with steam reforming of biomass using NiFe2O4: Kinetic analysis of DAEM-TI, thermodynamic simulation of OC redox, and a loop test

Abstract Low thermal conductivity, compatible thermal expansion coefficient, and good calcium—magnesium—aluminosilicate (CMAS) corrosion resistance are critical requirements of environmental barrier coatings for silicon-based ceramics. Rare earth silicates have been recognized as one of the most promising environmental barrier coating candidates for good water vapor corrosion resistance. However, the relatively high thermal conductivity and high thermal expansion coefficient limit the practical application. Inspired by the high entropy effect, a novel rare earth monosilicate solid solution (Ho 0.25 Lu 0.25 Yb 0.25 Eu 0.25 ) 2 SiO 5 was designed to improve the overall performance. The as-synthesized (Ho 0.25 Lu 0.25 Yb 0.25 Eu 0.25 ) 2 SiO 5 shows very low thermal conductivity (1.07 W·m −1 ·K −1 at 600 °C). Point defects including mass mismatch and oxygen vacancies mainly contribute to the good thermal insulation properties. The thermal expansion coefficient of (Ho 0.25 Lu 0.25 Yb 0.25 Eu 0.25 ) 2 SiO 5 can be decreased to (4.0–5.9)×10 −6 K −1 due to severe lattice distortion and chemical bonding variation, which matches well with that of SiC ((4.5–5.5)×10 −6 K −1 ). In addition, (Ho 0.25 Lu 0.25 Yb 0.25 Eu 0.25 ) 2 SiO 5 presents good resistance to CMAS corrosion. The improved performance of (Ho 0.25 Lu 0.25 Yb 0.25 Eu 0.25 ) 2 SiO 5 highlights it as a promising environmental barrier coating candidate. 

/pdf/ho0-25lu0-25yb0-25eu0-25-2sio5-high-entropy-ceramic-with-low-29da7ogq.pdf

(Ho0.25Lu0.25Yb0.25Eu0.25)2SiO5 high-entropy ceramic with low thermal conductivity, tunable thermal expansion coefficient, and excellent resistance to CMAS corrosion

NiFe films with a composition gradient are of particular interest from the point of view of fundamental science and practical applications. Such gradient magnetic structures may exhibit unique functional properties useful for sensory applications and beyond. The issue surrounds the anomaly concerning the compositional gradient formed near the substrate in electrolytically deposited binary and ternary iron-containing alloys, which has not previously been clearly explained. In this work, light is shed on this issue, and a clear relationship is found between the structure and surface properties of the substrate, the initially formed NiFe layers and the film composition gradient.

/pdf/features-of-galvanostatic-electrodeposition-of-nife-films-1fz4c4fx.pdf

Features of Galvanostatic Electrodeposition of NiFe Films with Composition Gradient: Influence of Substrate Characteristics

Interfacial reaction and IMC growth between Sn-37 Pb and heterogeneous dual-phase substrate

Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe-xNi (x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 μm, 1.7 μm, and 1.4 μm thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms.

Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling

The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage

Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints

Ball shear test was conducted on the SnAgCu/Fe–Ni solder joints, as well as SnAgCu/Cu for comparison after reflow and 150 °C high temperature storage following the industrial JEDEC standards. According to microstructural observation, Fe–Ni UBMs show better diffusion barrier effect than Cu UBM, which form very thin FeSn2 or FeSn2+(Cu,Ni)6Sn5 layers at the interface without any Kirkendall voids. With such thin IMC layers, the shear strengths of Fe–Ni solder joints were comparable to Cu solder joints, which are in the range of 6.3–6.4 mg/μm2 after reflow and then fall into 4.7–5.1 mg/μm2 after 1000 h storage. Statistic observations revealed four kinds of fracture mode among failed solder joints, which are ductile fracture, brittle fracture, UBM fracture and pad lift respectively. The UBM fracture is the most common failure mode for Cu solder joint due to the fast consumption and low mechanical strength of Cu UBM, while the ductile failure takes the majority for Fe–Ni UBMs although it gradually turned into brittle fracture later as the aging time increased. The related mechanism of fracture behavior was also discussed concerning the physical properties of interfacial IMCs. Combining the low IMC growth rate, the comparable shear strength and the ductile fracture mode, Fe–45Ni UBM is superior to Cu UBM on the interfacial reliability of high temperature storage.

A superior interfacial reliability of Fe–Ni UBM during high temperature storage

Gradient growth of fcc and bcc phase within FexNi1−x (50 < x < 75) films during direct-current wafer electroplating

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The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage

Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints

A superior interfacial reliability of Fe–Ni UBM during high temperature storage

Gradient growth of fcc and bcc phase within FexNi1−x (50 < x < 75) films during direct-current wafer electroplating