Disclosed is a light-emitting diode package, comprising: a package body having a cavity; a light-emitting diode chip having a plurality of light-emitting cells connected in serial with each other; a fluorescent body for converting the wavelength of light emitted by the light-emitting diode chip; and a pair of lead electrodes. The light-emitting cells are connected together in series between the pair of lead electrodes.

Light emitting diode package

The present disclosure relates to a semiconductor light emitting device, comprising: a plurality of semiconductor layers, including a first semiconductor layer having a first conductivity, a second semiconductor layer having a second conductivity different from the first conductivity, and an active layer interposed between the first semiconductor layer and the second semiconductor layer, generating light via electron-hole recombination; a first electrode, supplying either electrons or holes to the plurality of semiconductor layers; a second electrode, supplying, to the plurality of semiconductor layers, electrons if the holes are supplied by the first electrode, or holes if the electrons are supplied by the first electrode; a non-conductive distributed bragg reflector coupled to the plurality of semiconductor layers, reflecting the light from the active layer; and a first light-transmitting film coupled to the distributed bragg reflector from a side opposite to the plurality of semiconductor layers with respect to the non-conductive distributed bragg reflector, with the first light-transmitting film having a refractive index lower than an effective refractive index of the distributed bragg reflector.

Semiconductor Light Emitting Device

By doping an organic compound functioning as an electron donor (hereinafter referred to as donor molecules) into an organic compound layer contacting a cathode, donor levels can be formed between respective LUMO (lowest unoccupied molecular orbital) levels between the cathode and the organic compound layer, and therefore electrons can be injected from the cathode, and transmission of the injected electrons can be performed with good efficiency. Further, there are no problems such as excessive energy loss, deterioration of the organic compound layer itself, and the like accompanying electron movement, and therefore an increase in the electron injecting characteristics and a decrease in the driver voltage can both be achieved without depending on the work function of the cathode material.

Light Emitting Device

An illumination assembly that includes a light guide and a plurality of light sources operable to direct light into the light guide is disclosed. The light sources have a center-to-center spacing of at least 15 mm, and a distance between a primary emitting surface of at least one light source of the plurality of light sources and the input surface is no greater than 1 mm. The assembly further includes a structured surface layer positioned between the plurality of light sources and the input surface. The structured surface layer includes a substrate and a plurality of structures on a first surface of the substrate facing the plurality of light sources. The assembly further includes a plurality of extraction features operable to direct light from the light guide through an output surface of the light guide.

Illumination assembly and method of making same

To provide a light-emitting diode (21), transparent resin (27) is filled in a hole (25) through a fiberglass-reinforced epoxy substrate (22) between the upper surface (26a) and the lower surface (26b). A light-emitting diode element (29) formed of semiconducting nitride gallium on a transparent sapphire glass substrate (30) is fixedly attached to the transparent resin (27) with transparent adhesive (37). Opaque electrodes (33, 34) are provided on the light-emitting diode element (29) so that the light from the light-emitting diode element (29) can pass through the transparent resin (27) to the lower surface (26b) of the fiberglass-reinforced epoxy substrate (22). When mounted on a motherboard (41), the light-emitting diode (21) is let fall, with its resin mold (38) down, into a hole (42) opened in the motherboard (41), thereby reducing the height above the motherboard.

Light-emitting diode

The invention relates to an optoelectronic component that emits electromagnetic radiation. Said component comprises a housing body with a cavity that is configured as a trench, a plurality of semiconductor chips being arranged in a line in the cavity. Two neighbouring semiconductor chips are spaced at a distance from one another, which is less than or equal to one and a half lateral edge lengths of the semiconductor chip and greater than or equal to 0 νm. The invention also relates to an illumination module comprising a component of this type.

Optoelectronic component that emits electromagnetic radiation and illumination module

The invention relates to an illumination device for backlighting an image reproduction device that contains light valves. Said device is characterised in that light spots formed respectively by at least one light emitting diode are arranged in a grid on a thermally conductive support. The respective surface area of the light spots is less than that of the surface area defined by the grid.

Illumination device for backlighting an image reproduction device

The invention relates to an optoelectronic component (1) comprising a semiconducting assembly (4) which emits and receives electromagnetic radiation and is arranged on a support (22) connecting a thermocunductor to a heat sink (12). The inventive optoelectronic component also comprises external electrical connections (9) which are connected to the semiconducting assembly (4) and disposed in an electrically insulated manner on the heat sink (12) at a distance from the support (22). Said invention makes it possible to produce an optimised component for evacuating waste heat and light emission and providing an electrical contact and components density in modules.

Optoelectronic component and a module based thereon

Die Erfindung betrifft ein elektromagnetische Strahlung emittierendes optoelektronisches Bauelement mit einem Gehausekorper, der eine Kavitat aufweist, wobei die Kavitat grabenartig ausgebildet ist und in der Kavitat eine Mehrzahl von Halbleiterchips in einer linienformigen Anordnung angeordnet sind. Zwei benachbarte Halbleiterchips weisen zueinander einen Abstand auf, der kleiner als oder gleich einer und einer halben lateralen Kantenlange der Halbleiterchips und groser als oder gleich 0 µm ist. Zudem ist ein Leuchtmodul mit einem derartigen Bauelement angegeben.

Elektromagnetische strahlung emittierendes optoelektronisches bauelement und leuchtmodul

Vorgeschlagen wird ein optoelektronisches Bauelement (1) mit einer elektromagnetische Strahlung emittierenden und/oder empfangenden Halbleiteranordnung (4), die auf einem Trager (22) angeordnet ist, der thermisch leitend mit einem Kuhlkor-per (12) verbunden ist, und mit externen elektrischen Anschlussen (9), die mit der Halbleiteranordnung (4) verbunden sind, wobei die externen elektrischen Anschlusse (9) elektrisch isoliert auf dem Kuhlkorper (12) mit Abstand zu dem Trager (22) angeordnet sind. Dadurch ergibt sich ein optimiertes Bauelement hinsichtlich der Verlustwarmeabfuhr und der Lichtabstrahlung sowie der elektrischen Kontaktierung und Packungsdichte in Modulen.

Optoelektronisches bauelement und bauelement-modul

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