The invention discloses a back bonding platform for a superchip The back bonding platform comprises a substrate, a chip peeling and overturning unit, an X-Y direction movement unit, a multi-degree of freedom bonding head and a mounting platform unit, wherein the chip peeling and overturning unit is used for respectively peeling and overturning a chip on a wafer disk and sending the chip to a to-be-picked position; the multi-degree of freedom bonding head is arranged on a supporting guide rail of the X-Y direction movement unit in a cantilever mode, and has functions of automatically levelling and aligning; the mounting platform unit is used for adsorbing the substrate and matched with the bonding head, so that the chip and the substrate are mutually positioned In addition, in order to ensure the high-precision movement or matching of units, a plurality of vision positioning systems are configured in the back bonding platform The back bonding platform can reach micrometer-level alignment accuracy, has the parallel adjusting accuracy of higher than 001 degree, and has the advantages of compact structure, convenience for operation and the like, so that the back bonding platform is particularly suitable for back bonding of the superchip

Back bonding platform for superchip

The present invention provides a die bonder and a bonding method, to correct pose misalignment between a pickup capturing camera and a mounting capturing camera, so as to provide high position determination accuracy in a mounting position. According to the present invention, the method comprises: a step of adsorbing, holding and supporting a die with a bonding head having a reference mark in a position offset from a central position of a collet which adsorbs, holds and supports the die; a step of capturing the reference mark with each capturing means in a position adsorbing, holding and supporting the die, and a mounting position; a step of detecting position and rotation angle misalignment of each capturing means with respect to the bonding head based on each capturing result; and correcting at least third rotation angle misalignment between the position and rotation angle misalignment of the bonding head with respect to the mounting position based on each detection result.

Bonding apparatus and bonding method

An apparatus includes a pick and place system with a bonding head, picking head and support table. The picking head and support table are mounted on a carriage. The apparatus can be operated in a direct mode and a parallel mode. In the direct mode the carriage is in a first position (parked). A control unit operates the pick and place system to cause the bonding head to move a series of semiconductor chips from the wafer table to the substrate. In the parallel mode, the carriage is in a second position. The control unit operates the picking head, support table and pick and place system to repeatedly cause the picking head to move a semiconductor chip from the wafer table to the support table and the bonding head to move said semiconductor chip from the support table to the substrate.

Apparatus For Mounting Semiconductor Chips

This invention provides a system and method that ties the coordinate spaces at the two locations together during calibration time using features on a runtime workpiece instead of a calibration target. Three possible scenarios are contemplated: wherein the same workpiece features are imaged and identified at both locations; wherein the imaged features of the runtime workpiece differ at each location (with a CAD or measured workpiece rendition available); and wherein the first location containing a motion stage has been calibrated to the motion stage using hand-eye calibration and the second location is hand-eye calibrated to the same motion stage by transferring the runtime part back and forth between locations. Illustratively, the quality of the first two techniques can be improved by running multiple runtime workpieces each with a different pose, extracting and accumulating such features at each location; and then using the accumulated features to tie the two coordinate spaces.

System and method for tying together machine vision coordinate spaces in a guided assembly environment

A semiconductor chip bonding apparatus includes a bonding head to adsorptively pick up a semiconductor chip, a bonding stage supporting a substrate, the semiconductor chip to be bonded to the substrate on the bonding stage, a first camera to capture an image of the semiconductor chip and to obtain positional information regarding the semiconductor chip, a second camera to capture an image of the substrate and to obtain positional information regarding the substrate, a correction device structure at a first side surface of the bonding stage, the correction device structure including a correction substrate and at least one correction chip, and a bonding controller to control pick up of the at least one correction chip by the bonding head, mounting of the at least one correction chip on the correction substrate, and correcting of a bonding position.

Apparatus for bonding semiconductor chips

The invention relates to a method for picking up semiconductor chips from a wafer table and, optionally, their mounting on a substrate by means of a pick-and-place system. The position and orientation of the semiconductor chip to be mounted next are determined by means of a first camera and made available in the form of positional data relating to a first system of coordinates. The position and orientation of the substrate place on which the semiconductor chip will be mounted are determined by means of a second camera and made available in the form of positional data relating to a second system of coordinates. The conversion of coordinates of the first or second system of coordinates into coordinates of motion of the pick-and-place system occurs by means of two fixed mapping functions and two changeable correction vectors. The correction vectors are readjusted on the occurrence of a predetermined event.

Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate

The invention relates to a method for picking up semiconductor chips (2) from a wafer table (1) and mounting them on a substrate (4) by means of a pick-and-place system (5). The position and orientation of the semiconductor chip (2) to be mounted next are determined by means of a first camera (6) and made available in the form of positional data relating to a first system of coordinates (KS1). The position and orientation of the substrate place on which the semiconductor chip (2) will be mounted are determined by means of a second camera (7) and made available in the form of positional data relating to a second system of coordinates (KS2). The conversion of coordinates of the first and second systems of coordinates into coordinates of motion of the pick-and-place system (5) occurs by means of two fixed mapping functions (F, G) and two changeable correction vectors (K1, K2). The correction vectors (K1, K2) are readjusted on the occurrence of a predetermined event.

Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate

Verfahren fur die Entnahme von auf einem Wafertisch (1) bereitgestellten Halbleiterchips (2) und deren Montage auf einem Substrat (4) mittels eines Pick und Place Systems (5) mit einem Bondkopf (8), wobei am Bondkopf (8) eine Markierung (10) angebracht ist, wobei bei dem Verfahren mit einer ersten Kamera (6) ein Bild des auf dem Wafertisch (1) bereitgestellten Halbleiterchips (2) aufgenommen und die aus dem Bild bestimmte Position des Halbleiterchips (2) in Form von auf ein erstes Koordinatensystem KS1 bezogenen Positionsdaten zur Verfugung gestellt wird, mit einer zweiten Kamera (7) ein Bild des Substratplatzes aufgenommen und die aus dem Bild bestimmte Lage des Substratplatzes in Form von auf ein zweites Koordinatensystem KS2 bezogenen Positionsdaten zur Verfugung gestellt wird, die Position des Bondkopfs (8) auf ein drittes, dem Pick und Place System (5) immanentes Koordinatensystem KS bezogen wird, und das eine Einrichtungsphase und eine Produktionsphase umfasst, wobei die Einrichtungsphase umfasst: Bestimmen einer ersten Abbildungsfunktion, die das erste Koordinatensystem KS1 auf das Koordinatensystem KS abbildet, und ihrer Umkehrfunktion, Setzen eines ersten Korrekturvektors auf den Wert Null, Bestimmen einer zweiten Abbildungsfunktion, die das zweite Koordinatensystem KS2 auf das Koordinatensystem KS abbildet, und ihrer Umkehrfunktion, und Setzen eines zweiten Korrekturvektors auf den Wert Null; und wobei die Produktionsphase umfasst: Montieren eines Halbleiterchips (2) nach dem andern, durch mit der ersten Kamera (6) Aufnehmen eines Bildes des als nachster zu montierenden Halbleiterchips (2), aus dem Bild der ersten Kamera (6) Ermitteln der Position des Halbleiterchips (2) in Bezug auf das erste Koordinatensystem KS1, mittels der ersten Abbildungsfunktion und unter ...

Verfahren für die Entnahme von Halbleiterchips von einem Wafertisch und die Montage der Halbleiterchips auf einem Substrat

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Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate

Method for picking up semiconductor chips from a wafer table and mounting the removed semiconductor chips on a substrate

Verfahren für die Entnahme von Halbleiterchips von einem Wafertisch und die Montage der Halbleiterchips auf einem Substrat