Using nonvolatile memories in memory hierarchy has been investigated to reduce its energy consumption because nonvolatile memories consume zero leakage power in memory cells One of the difficulties is, however, that the endurance of most nonvolatile memory technologies is much shorter than the conventional SRAM and DRAM technology This has limited its usage to only the low levels of a memory hierarchy, eg, disks, that is far from the CPUIn this paper, we study the use of a new type of nonvolatile memories -- the Phase Change Memory (PCM) as the main memory for a 3D stacked chip The main challenges we face are the limited PCM endurance, longer access latencies, and higher dynamic power compared to the conventional DRAM technology We propose techniques to extend the endurance of the PCM to an average of 13 (for MLC PCM cell) to 22 (for SLC PCM) years We also study the design choices of implementing PCM to achieve the best tradeoff between energy and performance Our design reduced the total energy of an already low-power DRAM main memory of the same capacity by 65%, and energy-delay2 product by 60% These results indicate that it is feasible to use PCM technology in place of DRAM in the main memory for better energy efficiency

/pdf/a-durable-and-energy-efficient-main-memory-using-phase-1ulke5et76.pdf

A durable and energy efficient main memory using phase change memory technology

A significant part of future microprocessor real estate will be dedicated to L2 or L3 caches. These on-chip caches will heavily impact processor perfor- mance, power dissipation, and thermal management strategies. There are a number of interconnect design considerations that influence power/performance/area characteristics of large caches, such as wire mod- els (width/spacing/repeaters), signaling strategy (RC/differential/transmission), router design, etc. Yet, to date, there exists no analytical tool that takes all of these parameters into account to carry out a design space exploration for large caches and estimate an optimal organization. In this work, we implement two major extensions to the CACTI cache modeling tool that focus on interconnect design for a large cache. First, we add the ability to model different types of wires, such as RC-based wires with different power/delay characteristics and differential low-swing buses. Second, we add the ability to model Non-uniform Cache Access (NUCA). We not only adopt state-of-the-art design space exploration strategies for NUCA, we also enhance this exploration by considering on-chip network contention and a wider spectrum of wiring and routing choices. We present a validation analysis of the new tool (to be released as CACTI 6.0) and present a case study to showcase how the tool can improve architecture research methodologies. Keywords: cache models, non-uniform cache archi- tectures (NUCA), memory hierarchies, on-chip intercon- nects.

/pdf/optimizing-nuca-organizations-and-wiring-alternatives-for-3rrqqn2dbv.pdf

Optimizing NUCA Organizations and Wiring Alternatives for Large Caches with CACTI 6.0

Three-dimensional integration enables stacking memory directly on top of a microprocessor, thereby significantly reducing wire delay between the two. Previous studies have examined the performance benefits of such an approach, but all of these works only consider commodity 2D DRAM organizations. In this work, we explore more aggressive 3D DRAM organizations that make better use of the additional die-to-die bandwidth provided by 3D stacking, as well as the additional transistor count. Our simulation results show that with a few simple changes to the 3D-DRAM organization, we can achieve a 1.75x speedup over previously proposed 3D-DRAM approaches on our memory-intensive multi-programmed workloads on a quad-core processor. The significant increase in memory system performance makes the L2 miss handling architecture (MHA) a new bottleneck, which we address by combining a novel data structure called the Vector Bloom Filter with dynamic MSHR capacity tuning. Our scalable L2 MHA yields an additional 17.8% performance improvement over our 3D-stacked memory architecture.

/pdf/3d-stacked-memory-architectures-for-multi-core-processors-1ufiq9rsba.pdf

3D-Stacked Memory Architectures for Multi-core Processors

Dynamic random-access memory (DRAM) is the building block of modern main memory systems. DRAM cells must be periodically refreshed to prevent loss of data. These refresh operations waste energy and degrade system performance by interfering with memory accesses. The negative effects of DRAM refresh increase as DRAM device capacity increases. Existing DRAM devices refresh all cells at a rate determined by the leakiest cell in the device. However, most DRAM cells can retain data for significantly longer. Therefore, many of these refreshes are unnecessary. In this paper, we propose RAIDR (Retention-Aware Intelligent DRAM Refresh), a low-cost mechanism that can identify and skip unnecessary refreshes using knowledge of cell retention times. Our key idea is to group DRAM rows into retention time bins and apply a different refresh rate to each bin. As a result, rows containing leaky cells are refreshed as frequently as normal, while most rows are refreshed less frequently. RAIDR uses Bloom filters to efficiently implement retention time bins. RAIDR requires no modification to DRAM and minimal modification to the memory controller. In an 8-core system with 32 GB DRAM, RAIDR achieves a 74.6% refresh reduction, an average DRAM power reduction of 16.1%, and an average system performance improvement of 8.6% over existing systems, at a modest storage overhead of 1.25 KB in the memory controller. RAIDR's benefits are robust to variation in DRAM system configuration, and increase as memory capacity increases.

/pdf/raidr-retention-aware-intelligent-dram-refresh-4t380u711e.pdf

RAIDR: Retention-Aware Intelligent DRAM Refresh

Process variations will greatly impact the stability, leakage power consumption, and performance of future microprocessors. These variations are especially detrimental to 6T SRAM (6-transistor static memory) structures and will become critical with continued technology scaling. In this paper, we propose new on-chip memory architectures based on novel 3T1D DRAM (3-transistor, 1-diode dynamic memory) cells. We provide a detailed comparison between 6T and 3T1D designs in the context of a L1 data cache. The effects of physical device variation on a 3T1D cache can be lumped into variation of data retention times. This paper proposes a range of cache refresh and placement schemes that are sensitive to reten- tion time, and we show that most of the retention time variations can be masked by the microarchitecture when using these schemes. We have performed detailed circuit and architectural simulations assuming different degrees of variability in advanced technology nodes, and we show that the resulting memory architecture can tol- erate large process variations with little or even no impact on per- formance when compared to ideal 6T SRAM designs. Furthermore, these designs are robust to memory cell stability issues and can achieve large power savings. These advantages make the new mem- ory architectures a promising choice for on-chip variation-tolerant cache structures required for next generation microprocessors.

/pdf/process-variation-tolerant-3t1d-based-cache-architectures-45zv4uryey.pdf

Process Variation Tolerant 3T1D-Based Cache Architectures

3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die stacking is a significant reduction of interconnect both within a die and across dies in a system. For instance, blocks within a microprocessor can be placed vertically on multiple die to reduce block to block wire distance, latency, and power. Disparate Si technologies can also be combined in a 3D die stack, such as DRAM stacked on a CPU, resulting in lower power higher BW and lower latency interfaces, without concern for technology integration into a single process flow. 3D has the potential to change processor design constraints by providing substantial power and performance benefits. Despite the promising advantages of 3D, there is significant concern for thermal impact. In this research, we study the performance advantages and thermal challenges of two forms of die stacking: Stacking a large DRAM or SRAM cache on a microprocessor and dividing a traditional microarchitecture between two die in a stack Results: It is shown that a 32MB 3D stacked DRAM cache can reduce the cycles per memory access of a twothreaded RMS benchmark on average by 13% and as much as 55% while increasing the peak temperature by a negligible 0.08?C. Off-die BW and power are also reduced by 66% on average. It is also shown that a 3D floorplan of a high performance microprocessor can simultaneously reduce power 15% and increase performance 15% with a small 14?C increase in peak temperature. Voltage scaling can reach neutral thermals with a simultaneous 34% power reduction and 8% performance improvement.

Die Stacking (3D) Microarchitecture

3D and Microprocessors

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Die Stacking (3D) Microarchitecture

3D and Microprocessors