The challenges associated with the development of free-space optically interconnected electronics are discussed. These include finding an application for which optics offers an improved performance, developing optical transceivers, and developing suitable optics and mechanics. The main focus of the paper is the discussion of some novel approaches that smart pixels offer to increase alignment tolerance.

Challenges in optically interconnecting electronics

OLIVES is a three-layer collaborative project under the European Community ESPRIT program in which components for and practical demonstration of optical interconnections for high-performance processors are under development. A review of the major aims of the project and the progress to date is given. >

Optical interconnection for advanced processor systems: a review of the ESPRIT II OLIVES program

The purpose of this paper is to set the scene for what promises to be an outstanding conference. To this end the paper will survey the early work in silicon photonics from the late 1980s to the mid 1990s. This was when the more fundamental studies of basic building blocks were carried out, such as study of the silicon optical waveguide itself, the contributions to loss and improvement of waveguiding devices. Issues such as how to achieve modulation, and how to implement a modulator, the criteria for single mode propagation will also be covered, as well as work on the beginnings of optical circuits in silicon and SOI. The focus will be upon pure silicon, usually, but not exclusively in the form of Silicon on Insulator (SOI), as opposed to work on compounds such as SiGe or SiC. Much of this work still resonates with work being carried out today, because the move to smaller and more efficient devices means that some of these issues must be revisited in order to achieve optimal device performance. Hence the paper will provide a summary of the early work on silicon photonics, and attempt to relate it to some of the issues being studied today.

Silicon photonics: the early years

Modern computer buses are typically organized by the three functions of data transfer, addressing, and arbitration/control. In this paper we present a fiber-based bus design which provides optical solutions for each of these functions. The design includes an all-optical addressing system, based on coincident pulse addressing, which eliminates the latency contribution and bandwidth limitation associated with electronic address decoding. The control system uses time-of-flight relationships between a priority chain and a feedback waveguide to implement fully distributed asynchronous and self-timed bus arbitration. >

Optoelectronic buses for high-performance computing

/pdf/optoelectronic-buses-for-high-performance-computing-18sb6j10lh.pdf

Optoelectronic Buses for High-Performance Computing _____

A demonstration of a system for optical rack-to-rack interconnects based on opto-hybrid array transmitter and receiver modules is reported. A six-channel interconnection at 700 Mbit/s per channel is reported and the transmitter array alone operates to 1 Gbit/s per channel. These modules are believed to be among the most complex opto-hybrids reported to date.

Multifibre bus for rack-to-rack interconnects based on opto-hybrid transmitter/receiver array pair

A twelve channel receiver array operating at 25 Gbit/s per channel, ie with an aggregate capacity of 30 Gbit/s, has been fabricated using silicon hybrid technology The module, which is intended for use in rack-to-rack and board-to-board optical interconnects, has a typical sensitivity of /spl sim/-20 dBm in fibre at 13 /spl mu/m wavelength, and a channel-to-channel crosstalk penalty of <05 dB

12 × 2.5 Gbit/s receiver array module

Fully operational opto-hybrid transmitter and receiver array modules containing driver ICs, passive components, v-groove mounted ribbon fibres, electrical interconnects and solder-bumped laser arrays integrated onto a silicon substrate are described. These operate at 700MBits/s per channel with 6 operational channels and are believed to be the most complete demonstration of opto-hybrid technology reported to date.

6 × 700 Mbit/s Array Transmitter/Receiver Pair Realised In Opto-Hybrid Silicon Motherboard Technology

To increase interconnection capabilities at all levels, new ways of packaging optical, optoelectronic and electronic components are vital. A possibility is to make use of hybrid multi-chip modules. Hybrid mounting techniques allow the independent optimisation of the individual optical and electronic components; InP lasers can be mixed with Si ICs and InGaAs photodetectors. In this way complex and densely packed integrated optoelectronic subsystems can be manufactured, which make the best use of each technology. Silicon possesses a unique combination of properties as a substrate for such opto-hybrid modules. Progress in the development of silicon-based opto-hybrids is described with reference to a particular application in the interconnection of multiprocessor mainframe computers: a wideband optical bus. In particular, the transmitter unit of such a module, capable of a data rate of up to 32 Gbit/s, is described. The use of hybrid techniques in this application is essential to achieve the total data rate required within an acceptable board area and power consumption. >

https://ieeexplore.ieee.org/iel3/1703/4594/00181466.pdf

Developments in silicon opto-hybrid technology for high performance opto-electronic modules

The hybridization of optical, optoelectronic and electronic components on a silicon submount (silicon optohybrid technology) offers an attractive route to high functionality and low-cost modules for a wide variety of applications. The key features of this technology are described with reference to the construction of a six-channel transmitter-receiver array module pair. Recent developments and future prospects are outlined.

Hybrid integration of optical and electronic components on silicon

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