A chip package includes: a substrate; a signal pad and a ground pad disposed on the substrate; a first and a second conducting layers disposed on the substrate and electrically connected to the signal pad and the ground pad, respectively, wherein the first and the second conducting layers extend from an upper surface of the substrate towards a lower surface of the substrate along a first and a second side surfaces of the substrate, respectively, and the first and the second conducting layers protrude from the lower surface; and a protection layer disposed on the substrate, wherein the protection layer completely covers the entire portion of the first conducting layer located on the first side surface of the substrate, and the entire portion of the second conducting layer located on the second side surface of the substrate is not covered by the protection layer.

Chip package and method for forming the same

Methods and apparatus for performing molding on die on wafer interposers. A method includes receiving an interposer assembly having a die side and an opposite side including two or more integrated circuit dies mounted on the die side of the interposer, the interposer assembly having spaces formed on the die side of the interposer between the two or more integrated circuit dies; mounting at least one stress relief feature on the die side of the interposer assembly in one of the spaces between the two or more integrated circuit dies; and molding the integrated circuit dies using a mold compound, the mold compound surrounding the two or more integrated circuit dies and the at least one stress relief feature. An apparatus is disclosed having integrated circuits mounted on a die side of an interposer, stress relief features between the integrated circuits and mold compound over the integrated circuits.

Apparatus and methods for molding die on wafer interposers

Surface energy of a substrate is changed without the need for any template, mask, or additional coating medium applied to the substrate. At least one beam of energy directly ablates a substrate surface to form a predefined topographical pattern at the surface. Each beam of energy has a width of approximately 25 micrometers and an energy of approximately 1-500 microJoules. Features in the topographical pattern have a width of approximately 1-500 micrometers and a height of approximately 1.4-100 micrometers.

/pdf/modification-of-surface-energy-via-direct-laser-ablative-1fdteb3csh.pdf

Modification of surface energy via direct laser ablative surface patterning

The present invention provides an adhesive tape composition and an adhesive tape prepared from same. Based on the total weight of the adhesive tape composition, the adhesive tape composition comprises: 25-75 wt. % of an acrylate monomer; 20-70 wt. % of an epoxy resin; 0.001-3 wt. % of a free radical photoinitiator; 0-10 wt. % of a fumed silica; and 0.02-5 wt. % of a cationic thermal initiator. According to the present invention, an adhesive tape having a room temperature retention time as long as 6 months that can be cured at low temperature such as 80 degree C. can be produced from the adhesive tape composition.

Adhesive Tape Composition and Adhesive Tape Prepared From Same

A method comprising: providing a transparent electrically conductive film comprising: a transparent substrate (14); a composite layer (18) comprising: an electrically conductive layer disposed on at least a portion of a major surface of the transparent substrate (14) and comprising a plurality of interconnecting metallic nanowires (12); and a polymeric overcoat layer disposed on a portion of the electrically conductive layer, to provide a coated area of the electrically conductive layer; and patternwise exposing the coated area of the electrically conductive layer to a corona discharge to provide a patternwise exposed electrically conductive film comprising (1) an un exposed region (122) of the coated region having a first electrical resistivity, and (2) an exposed region (121) having a second electrical resistivity; wherein the exposed region is less electrically conductive than the unexposed region, and wherein there is a ratio of the second electrical resistivity over the first electrical resistivity of at least 1000:1.

Corona patterning of overcoated nanowire transparent conducting coatings

Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.

Dicing tape and die attach adhesive with patterned backing

Handle everyday research tasks with reliable, citation-backed results

Your personal Research Agent to handle research tasks with citation-backed results

Popular Tasks used by Researchers

How can I help with your research?

Meet SciSpace

Get more enhanced response by uploading the PDFs you want me to reference.

No relevant PDFs in your library

SciSpace is the AI research assistant for academics. Run systematic literature reviews on 280M+ papers, and write papers with cited sources. Trusted by 1M+ students, PhDs & researchers.

SciSpace | AI for Research

Analyze PDFs

Code & Manuscripts

Funding & Grants

Literature & Patents

Medical & Clinical Data

Systematic Review

Visualize & Present

Web & Data

Build a Google Scholar-like website for your research.

Build a website

Create charts and images for your research

Create a Chart

Write a paper for submission to a journal

Draft a manuscript

Patent Search

Design eye-catching scientific posters in minutes.

Scientific Poster Generation

Systematic Literature Review

One task is running at the moment. Your messages will be shown right after.

Drag and drop or click here to browse

Loved by <highlight>1 million+</highlight> researchers

Extract a list of specific topics and their sources from unstructured text

Topics

Compare and analyze relevant papers that matches with your search

Papers

Get insights from PDFs and bookmarked papers from your library

My library

Recent searches

Try searching for:

Catch AI-generated content in scholarly and non-scholarly content

{ai} Detector

Ai Writer

Get PDF Summaries, highlighted text explanations 

Chat with PDF

Effortlessly create in-text citations and bibliographies in APA and 2,500 other formats

Citation generator

Get explanations, summaries, and answers on academic papers

Ease up your research workflow with {scispace}'s cohort of exciting AI tools

Elevate your academic writing skills and convey your ideas the way you want

Paraphraser

Explore our range of reading and writing tools

Your file is being prepared and should be ready in a few minutes. If it's a large file, it might take a bit longer. You can close this window, and we'll email you the file when it's done.

You have reached a maximum limit of <strong>{limit}</strong> columns in the table. Remove at least <strong>1</strong> column to add or create another one.

Olester Benson

Author Tools

Chat about Author

Papers

Dicing tape and die attach adhesive with patterned backing