PROBLEM TO BE SOLVED: To provide a resin electronic device enclosure installed outdoors capable of improving waterproofness while maintaining heat dissipation performance of the electronic device enclosureSOLUTION: An enclosure 10 of electronic equipment accommodating a substrate assembly including a substrate carrying an electronic circuit 18 includes a resin wall surrounding the substrate assembly and a resin heat radiating portion 14 integrally formed on a joining surface J of an opening of the wall The joining surface J between the wall and the heat radiation portion 14 includes a convex portion extending in a direction perpendicular to the thickness direction of the heat radiation portion 14 and a concave portion fitted to the convex portionSELECTED DRAWING: Figure 2

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