Solder is widely used to connect chips to their packaging substrates in flip chip technology as well as in surface mount technology. At present, the electronic packaging industry is actively searching for Pb-free solders due to environmental concern of Pb-based solders. Concerning the reliability of Pb-free solders, some electronic companies are reluctant to adopt them into their high-end products. Hence, a review of the reliability behavior of Pb-free solders is timely. We use the format of “case study” to review six reliability problems of Pb-free solders in electronic packaging technology. We conducted analysis of these cases on the basis of thermodynamic driving force, time-dependent kinetic processes, and morphology and microstructure changes. We made a direct comparison to the similar problem in SnPb solder whenever it is available. Specifically, we reviewed: (1) interfacial reactions between Pb-free solder and thick metalliztion of bond-pad on the substrate-side, (2) interfacial reactions between Pb-free solder and thin-film under-bump metallization on the chip-side, (3) the growth of a layered intermetallic compound (IMC) by ripening in solid state aging of solder joints, (4) a long range interaction between chip-side and substrate-side metallizations across a solder joint, (5) electromigration in flip chip solder joints, and finally (6) Sn whisker growth on Pb-free finish on Cu leadframe. Perhaps, these cases may serve as helpful references to the understanding of other reliability behaviors of Pb-free solders.

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Thermodynamic properties of the Al–Fe–Ni system acquired via a hybrid approach combining calorimetry, first-principles and CALPHAD

Magnetic phase diagram of the Fe-Ni system

Oxidation and corrosion of highly alloyed Cu–Fe–Ni as inert anode material for aluminum electrowinning in as-cast and homogenized conditions

Understanding the radiation embrittlement of reactor pressure vessel (RPV) steels is required to be able to operate safely a nuclear power plant or to extend its lifetime. The mechanical properties degradation is partly due to the clustering of solute under irradiation. To gain knowledge about the clustering process, a Fe−1.1 Mn−0.7 Ni (at.%) alloy was irradiated in a test reactor at two fluxes of 0.15 and 9 ×1017 nE > 1MeV.m − 2.s − 1 and at increasing doses from 0.18 to 1.3 ×1024 nE > 1MeV.m − 2 at 300°C. Atom probe tomography (APT) experiments revealed that the irradiation promotes the formation in the α iron matrix of Mn/Mn and/or Ni/Ni pair correlations at low dose and Mn–Ni enriched clusters at high dose. These clusters dissolve partially after a thermal treatment at 400°C. Based on a comparison with thermodynamic calculations, we show that the solute clustering under irradiation can just result from an induced mechanism.

Irradiation-Induced Solute Clustering in a Low Nickel FeMnNi Ferritic Alloy

The CuFeNi system was reassessed taking into account new experimental data in particular in the region of the ordered phase (Cu,Ni) 3 Fe. Its thermodynamic description was assessed using a four sub-lattice model, while a random substitutional solution model was used for the disordered solution phases.

Thermodynamic assessment of the CuFeNi system

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Thermodynamic assessment of the CuFeNi system