Wafer-level reliability (WLR) testing continues to be an important tool for implementing a building-in reliability (BIR) strategy. The thrust of WLR testing has shifted, however, from the back-of-the-line (monitoring of outgoing reliability levels) to the front-of-the-line (margin testing during the development and productization phase). The rapid nature of most WLR tests permits the process engineer to evaluate the impact of process variation and obtain an "almost instantaneous" feedback as to its reliability impact. Rapid reliability information feedback is a key to helping the process engineer to build reliability into the technology. This is extremely important today when technologies are being developed and introduced to fabs at a rapid rate.

Does building-in reliability imply more or less wafer-level reliability testing?

Reliability testing: Bibliography

Nowhere is the pace of change so rapid or so dramatic as in the semiconductor industry. For any industry to sustain 15% growth per year over a 40-year period is remarkable, but in the next few years, that growth rate is expected to accelerate, creating an industry that rivals historically dominant industries such as automotive and steel for a share of the global economy. Moore's Law has proven remarkably successful in characterizing the growth of the semiconductor industry for the past three decades. During that period, the core microelectronic materials-silicon substrate, SiO/sub 2/-based dielectrics, and aluminum metallization-have undergone relatively minor perturbations. Now, however, a discontinuity in basic semiconductor materials will be necessary for the industry to continue on the curve described by Moore's Law. The materials on which careers have been based are giving way to new gate and interlevel dielectrics, and copper metallization is replacing aluminum-alloy metallization. Given the size of our industry and its impact on the global economy, an accelerated understanding of the reliability physics of these new materials is essential. This paper deals with the work environment, skills and methods required for the reliability scientist to prepare the semiconductor industry for the new millennium.

The reliability challenge: New materials in the new millennium. Moore's Law drives a discontinuity

Wafer level reliability testing has been nurtured in the DARPA supported workshops, held each autumn since 1982. The seeds planted in 1982 have produced an active crop of very large scale integration manufacturers applying wafer level reliability test methods. Computer Aided Reliability (CAR) is a new seed being nurtured. Users are now being awakened by the huge economic value of the wafer reliability testing technology.

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Wafer level reliability testing: an idea whose time has come

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Wafer level reliability testing: an idea whose time has come