[Problem] To provide a vehicle air conditioner that can reduce electricity consumption by improving the accuracy of frost determination on an outdoor heat exchanger, maintaining heating performance, and avoiding unnecessary defrosting. [Solution] A controller that implements a heating mode. A controller (32) ascertains the formation of frost on an outdoor heat exchanger (7) either on the basis of the refrigerant evaporation pressure (PXO) of the outdoor heat exchanger (7) and the refrigerant evaporation pressure (PXObase) of the outdoor heat exchanger (7) when no frost is present, or on the basis of the refrigerant evaporation temperature (TXO) of the outdoor heat exchanger (7) and the refrigerant evaporation temperature (TXObase) of the outdoor heat exchanger (7) when no frost is present, and then feeds high temperature refrigerant gas to the outdoor heat exchanger (7) to defrost the outdoor heat exchanger (7).

Vehicle air conditioner

To provide an electronic component mounting system and an electronic component mounting method which can prevent a mounting failure due to positional error in a height direction of a substrate and ensure mounting quality. The electronic component mounting system includes a plurality of electronic component mounting devices connected to one another and mounts an electronic component on a substrate to manufacture a mounting substrate. A print test device for testing the substrate after solder printing measures a height position of a height measurement point set on the upper surface of the substrate 4 by a height measuring machine 22 and outputs a measurement result as substrate height data. In a component placing step using an electronic component placing device, a control parameter for controlling a component placing operation of the placing head 32 is updated. Accordingly, it is possible to correct a variation of the height position of an individual substrate and to prevent a mounting failure due to positional error in the height direction of the substrate.

Electronic component mounting system and electronic component mounting method

In order to measure a measurement target on a PCB, height information of the PCB is acquired by using a first image photographed by illuminating a grating pattern light onto the PCB. Then, a first area protruding on the PCB by greater than a reference height is determined as the measurement target by using the height information. Thereafter, color information of the PCB is acquired by using a second image photographed by illuminating light onto the PCB. Then, the first color information of the first area determined as the measurement target out of the color information of the PCB is set as reference color information. Thereafter, the reference color information is compared with color information of an area except for the first area to judge whether the measurement target is formed in the area except for the first area. Thus, the measurement target may be accurately measured.

Method of measuring measurement target

An inspection method includes photographing a measurement target to acquire image data for each pixel of the measurement target, acquiring height data for each pixel of the measurement target, acquiring visibility data for each pixel of the measurement target, multiplying the acquired image data by at least one of the height data and the visibility data for each pixel to produce a result value, and setting a terminal area by using the produced result value. Thus, the terminal area may be accurately determined.

Board inspection apparatus and method

A hardness tester includes an image pickup control section, an indentation region extraction section, an indentation apex extraction section and a hardness calculation section The image pickup control section obtains picked-up image data of a sample's surface The region extraction section binarizes the image data, determines based on the binarized image data whether an indentation region candidate is extracted, and when determining that the candidate is not extracted, obtains curvature image data, binarizes the curvature image data, erodes and dilates the binarized curvature image data, performs distance transform on the eroded-and-dilated curvature image data, and extracts a closed region corresponding to the indenter's shape using the distance-transformed curvature image data The apex extraction section extracts an indentation-measurement-use apex based on the closed region The hardness calculation section calculates the sample's hardness based on the apex

Hardness tester and hardness test method

PROBLEM TO BE SOLVED: To provide a visual inspection method for a circuit board automatically forming inspection information concerning a board to be inspected. SOLUTION: The visual inspection method for a circuit board has a part region determination step for determining a certain part region of mounted parts, based on a circuit board image data which is two-dimensional image data and/or three-dimensional image data obtained by measuring the circuit board of the inspection object where parts are mounted. The visual inspection method also has a characteristic quantity introducing step for introducing the characteristic quantity out of the circuit board image data in the determined part region; an inspection information selection step for comparing the characteristic quantity introduced out of the circuit board image data and the inspection information group mutually correlating the characteristics quantity of the pre-stored parts and the inspection information concerning the parts, specifying the parts mounted in the part region, and selecting the inspection information correlated with the parts in the inspection information group; and an inspection step for visually inspecting the part region based on the selected inspection information. COPYRIGHT: (C)2005,JPO&NCIPI

Method and system for visual inspection of circuit board

PROBLEM TO BE SOLVED: To provide a teaching method which can confirm visually the adequacy of set teaching data in a 3-dimensional space. SOLUTION: Images of objects to be measured are displayed on a display, on the basis of 3-dimensional configuration data wherein the objects are measured by using a form measuring means capable of measuring a 3-dimensional configuration. In the teaching method, inspection information to be used for inspecting an object to be inspected which becomes an object to be inspected from among the objects to be measured is set by using a displayed image of the object to be measured, after the inspection information is set, and at least one or more datagrams are subjected to 3-dimensional image display, out of the measured 3-dimensional configuration data and the set inspection information. COPYRIGHT: (C)2004,JPO

Teaching method, electronic substrate inspection method, and electronic substrate inspection device

PROBLEM TO BE SOLVED: To provide a method for inspecting electronic substrates and an apparatus using the method whereby all of minute parts arranged on the electronic substrates can be highly accurately extracted without being influenced by a strain amount of the electronic substrates. SOLUTION: This method for inspecting electronic substrates includes a process of measuring a three-dimensional shape of the electronic substrate to be inspected to obtain surface shape measurement data, a process of automatically estimating the strain amount of the electronic substrate from the surface shape measurement data of the whole face of the measured electronic substrate, a process of automatically generating an approximate surface of the electronic substrate from the estimated result of the above process, and a subtraction process between the approximate surface generated in the above process and the surface shape measurement data. The electronic substrate-inspecting apparatus is provided with a processing unit for executing each of the processes.

Method for inspecting electronic substrate and apparatus using the same

PROBLEM TO BE SOLVED: To accurately extract a pattern surface even in the case that reflection light quantity is reduced in a measurement using light due to roughness having directivity on an electronic substrate surface when the surface is ground for improving contactness of solder by smoothing and activating the surface in producing the electronic substrate. SOLUTION: A differential image is produced by using a plurality of brilliance images obtained by measuring from a plurality of different directions, a binary threshold is automatically determined by histogram processing and the differential threshold is binarized so that only patterned surface is automatically accurately extracted in the constitution. COPYRIGHT: (C)2003,JPO

Automatic pattern surface extraction method and shape measuring device thereof

PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus and a mounting method thereof which mount an electronic component while considering the maldistribution of a solder printing amount. SOLUTION: The apparatus is provided with an operating means for calculating planar positions b1 of volume centers of cream solder 30a, 30b printed on substrate-side electrodes 1a, 1b; and a mounting means for mounting electronic components 20 on the substrate-side electrodes 1a, 1b using the planar positions b1 of the volume centers of the cream solder 30a, 30b as references. The apparatus mounts the electronic component on a position where the maldistribution of the solder printing amount is taken into consideration. COPYRIGHT: (C)2008,JPO&INPIT

Electronic component mounting apparatus and mounting method thereof

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