13 Papers
10 Citations
Na Li is an academic researcher from Harbin Institute of Technology. The author has contributed to research in topics: Atmospheric-pressure plasma & Etching (microfabrication). The author has an hindex of 5, co-authored 9 publications.
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Papers
Blockchain-supported business model design, supply chain resilience, and firm performance
TL;DR: Wang et al. as mentioned in this paper investigated the impact of blockchain-supported business model design on supply chain resilience and firm performance, showing that companies with high strategic emphasis on BM efficiency can achieve higher firm performance and SCR through blockchain usage than those without such a focus.
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Surface roughening of ground fused silica processed by atmospheric inductively coupled plasma
TL;DR: In this paper, the surface morphology evolution of ICP-processed substrates was observed and characterized by confocal laser scanning microscope (CLSM), field emission scanning electron microscope (SEM), and atomic force microscopy (AFM).
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The morphology and chemistry evolution of fused silica surface after Ar/CF4 atmospheric pressure plasma processing
TL;DR: In this paper, the surface morphology and chemistry evolution of fused silica surface were analyzed by AFM and XPS, which exhibited the three-dimensional surface topography and the RMS roughness changed with the increase of the material removal depth.
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Characterization of fused silica surface topography in capacitively coupled atmospheric pressure plasma processing
TL;DR: In this paper, a capacitively coupled atmospheric pressure plasma processing (CCAPPP) system and experimental setup are firstly presented, and a comprehensive characterization of surface topography after atmospheric plasma processing is necessary in order to understand the opacification phenomenon and etching mechanism.
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Modeling and experimental study on the force of micro-milling titanium alloy based on tool runout
TL;DR: In this article, the milling force model is established for the micro-milling process with considering tool runout, undeformed chip thickness, tool slope angle, shear angle, friction angle, and equivalent rake angle.
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