N. Harjee
Stanford University
19 Papers
146 Citations
N. Harjee is an academic researcher from Stanford University. The author has contributed to research in topics: Piezoresistive effect & Scanning gate microscopy. The author has an hindex of 7, co-authored 19 publications.
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Papers
SU-8 force sensing pillar arrays for biological measurements
Joseph C. Doll,N. Harjee,N. Klejwa,Ronald Y. Kwon,Sarah M. Coulthard,Bryan C. Petzold,Miriam B. Goodman,Beth L. Pruitt +7 more
TL;DR: A two-axis micro strain gauge force sensor constructed from multiple layers of SU-8 and metal on quartz substrates is presented, and the scale of interaction forces generated in wild-type C. elegans is characterized for the first time.
Spatially resolved study of backscattering in the quantum spin Hall state
Markus König,Markus König,Matthias Baenninger,Matthias Baenninger,A. G. F. Garcia,N. Harjee,Beth L. Pruitt,Christopher P. Ames,Philipp Leubner,Christoph Brüne,Hartmut Buhmann,Laurens W. Molenkamp,David Goldhaber-Gordon,David Goldhaber-Gordon +13 more
TL;DR: Using scanning gate microscopy to perturb the QSH edge states on a sub-micron scale, Wang et al. as discussed by the authors identify well-localized scattering sites which likely limit the expected non-dissipative transport in the helical edge channels.
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Low-impedance shielded tip piezoresistive probe enables portable Microwave Impedance Microscopy
A. J. Haemmerli,R. T. Nielsen,Worasom Kundhikanjana,N. Harjee,Keji Lai,Yushi Yang,David Goldhaber-Gordon,Zhi-Xun Shen,Beth L. Pruitt +8 more
- 15 Mar 2012
TL;DR: In this paper, a self-sensing piezoresistive cantilever with low-impedance, electrically-shielded transmission lines is proposed to enable simultaneous topographical and electrical scanning probe microscopy.
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Patterned cracks improve yield in the release of compliant microdevices from silicon-on-insulator wafers
Ginel C. Hill,Jose I. Padovani,Joseph C. Doll,B. W. Chui,Daniel Rugar,Harry Jonathon Mamin,N. Harjee,Beth L. Pruitt +7 more
TL;DR: In this article, the use of cracks patterned lithographically into the BOX layer prior to device release in two separate microcantilever fabrication processes was reported. In both processes, the patterned cracks were found to inhibit spontaneous cracking in critical regions near or under devices and improve device yield.
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Sidewall epitaxial piezoresistor process for in-plane sensing applications
A.A. Barlian,N. Harjee,Vikram Mukundan,T.H. Fung,Sung-Jin Park,Beth L. Pruitt +5 more
- 28 Jan 2008
TL;DR: In this paper, a selective epitaxial fabrication method was proposed to form piezoresistors on the sidewalls of microstructures for in-plane sensing applications, which was found to be 2-7 times more sensitive than most ion-implanted cantilevers with equivalent dopant concentration.
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