Minyoung Bai

TL;DR: In this paper, a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangements is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the Electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape.

TL;DR: In this paper, an independent claim is included for manufacturing the adhesive tape comprising: forming a viscoelastic foam support layer, which comprises a top and a bottom, by providing a mixture of free or controlled free radical polymerization mixture comprising acrylate and alkyl acrylated, polymerizing the mixture, then thermal cross-linking, and foaming the polyacrylate; and coating the pressure sensitive adhesive to produce the pressure-sensitive adhesive layer.

TL;DR: Klebemasse insbesondere zur Kapselung einer elektronischen Anordnung gegen Permeanten, umfassend (a) zumindest ein Copolymer enthaltend zumINDest Isobutylen oder Butylen als Comonomersorte and zumndest eine Comonomerorte, die - als hypothetisches Homopolymer betrachtet - eine Erweichungstemperatur von groser 40°

TL;DR: In this paper, the authors proposed a line for protecting adhesives with respect to permeates originating from the surroundings or included during winding, stacking or other process steps, having at least one non-stick release layer and at least getter material that is able to absorb at least 1 substance capable of permeation, the getter being contained as a dispersed phase in at least a layer of the liner.