Mingwei Di
Northeast Forestry University
17 Papers
18 Citations
Mingwei Di is an academic researcher from Northeast Forestry University. The author has contributed to research in topics: Adhesive & Epoxy. The author has an hindex of 7, co-authored 17 publications.
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Papers
Green Modification of Corn Stalk Lignin and Preparation of Environmentally Friendly Lignin-Based Wood Adhesive.
Sen Wang,Yalan Yu,Mingwei Di +2 more
TL;DR: Compared with unmodified lignin, the glyoxalated corn stalklignin had a significant improvement in hydroxyl content, activation, and thermal stability, and results from the GPC showed that the molecular weight increased compared with original corn stalk, possibly due to the secondary polycondensation reaction between lignIn and glyoxAl.
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Preparation and characterization of film of poly vinyl acetate ethylene copolymer emulsion
TL;DR: In this paper, a new kind of polyvinyl acetate emulsion adhesive by continuous emulsion polymerization was presented, and the dynamic mechanics, particle distribution, glass transition temperature, polymer emulsion structure of both polymerized and copolymerized emulsion were analyzed by SEM, DMA and XPS, respectively.
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Study on cross-linking agent of a novel one-component API adhesive
Chunhua Lou,Mingwei Di +1 more
TL;DR: In this paper, a series of waterborne blocked polyisocyanate dispersions were prepared by anionic modified process, using polyaryl polyiso-yanate (PAPI), 2,4,6-trichlorophenol (TCP), and dimethylol propionic acid.
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Preparation and Characterization of Blocked PAPI with Sodium Bisulfate
TL;DR: In this paper, the authors used a laser particle size analyzer and a thermo gravimetric analysis to measure particle size distribution rate and the stability of the blocked isocyanate emulsion, respectively.
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Preparation and Properties of Wood Flour Reinforced Lignin-Epoxy Resin Composite
Shanshan He,Tong Liu,Mingwei Di +2 more
TL;DR: In this article, the effects of wood flour on the mechanical, thermal creep, and creep recovery properties, as well as the microstructure of the composite, were studied, and the scanning electron microscopy (SEM) analysis revealed good interfacial bonding between the lignin, epoxy resin, and wood flour.
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