Min-Su Kim
7 Papers
Min-Su Kim is an academic researcher. The author has contributed to research in topics: Chemistry & Electrode. The author has an hindex of 2, co-authored 7 publications.
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Papers
Power cycling tests under driving ΔTj = 125 °C on the Cu clip bonded EV power module
TL;DR: In this article , the performance and life of the power module was evaluated based on AQG-324, and thermal resistance of the junction (Rth-ja) was monitored during PCTs.
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Electrochemical properties of the Si thin-film anode deposited on Ti-Nb-Zr shape memory alloy in Li-ion batteries
Joohyeon Bae,Oyunbayar Nyamaa,Jun-Seok Lee,Sang-du Yun,Seong-Min Woo,Jeonghyeon Yang,Min-Su Kim,Jungpil Noh +7 more
TL;DR: In this paper , the shape-memory behavior recrystallization mechanism of heat-treated superelastic passive Ti-Nb-Zr SMA was used to improve the electrochemical properties of Si thin films.
8
Reduction Time Effect on the Dielectric Characteristics of Reduced-Graphene-Oxide--Encapsulated Barium Titanate Powder Fillers
So Yeon Jun,Seung Hun Park,Minkyun Sohn,Seung Chan Kim,Jung Min Lee,Dae Sol Kong,Tae-Young Lee,Jong Hoon Jung,Min-Su Kim,Sehoon Yoo,Jae-Hyeon Ko,SeungNam Cha,Donggeun Jung,Jin Young Kim,SeGi Yu +14 more
7
Formation of Effective Carbon Composite Structure for Improving Electrochemical Performances of Rhombohedral Li3V2(PO4)3 as Both Cathode and Anode Materials for Lithium Ion Batteries
Duyoung Choi,Jiyeon Shim,Sungwoon Choi,Sang-Mok Park,H. Jeong,Min-Su Kim,Jungpil Kim,Junghoon Yang +7 more
TL;DR: In this article , a method to overcome the issue of alkali vanadium phosphate by building effective carbon backbone in carbon composite and carbon composite is presented. But the carbon backbone not only provides pathways for an electron but also suppresses agglomeration of particles, resulting in efficient ion diffusion and electron transfer in the composite.
4
Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish
TL;DR: In this article , a test chip with Cu/SnAg pillar bumps was bonded on the surface-finished Cu pads with the TCB method, and the surface roughness of the EPIG was 82 nm, which was 1.6 times higher than the ENEPIG surface finish.