Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.

Methods and systems for utilizing design data in combination with inspection data

An object is to provide a method for manufacturing a semiconductor device, in which the number of photolithography steps can be reduced, the manufacturing process can be simplified, and manufacturing can be performed with high yield at low cost A method for manufacturing a semiconductor device includes the following steps: forming a semiconductor film; irradiating a laser beam by passing the laser beam through a photomask including a shield for shielding the laser beam; subliming a region which has been irradiated with the laser beam through a region in which the shield is not formed in the photomask in the semiconductor film; forming an island-shaped semiconductor film in such a way that a region which is not irradiated with the laser beam is not sublimed because it is a region in which the shield is formed in the photomask; forming a first electrode which is one of a source electrode and a drain electrode and a second electrode which is the other one of the source electrode and the drain electrode; forming a gate insulating film; and forming a gate electrode over the gate insulating film

Method for Manufacturing Semiconductor Device

Methods and systems for determining a critical dimension and overlay of a specimen

Methods and systems for determining a critical dimension and a thin film characteristic of a specimen

Various methods and systems for determining a position of inspection data in design data space are provided. One computer-implemented method includes determining a centroid of an alignment target formed on a wafer using an image of the alignment target acquired by imaging the wafer. The method also includes aligning the centroid to a centroid of a geometrical shape describing the alignment target. In addition, the method includes assigning a design data space position of the centroid of the alignment target as a position of the centroid of the geometrical shape in the design data space. The method further includes determining a position of inspection data acquired for the wafer in the design data space based on the design data space position of the centroid of the alignment target.

Methods and systems for determining a position of inspection data in design data space

A contactless technique for semiconductor wafer testing comprising: depositing charges on the top surface of an insulator layer over the wafer to create an inverted surface with a depletion region and thereby a field-induced junction therebelow in the wafer, with an accumulated guard ring on the semiconductor surface therearound The technique further includes the step of changing the depth to which the depletion region extends below the inverted semiconductor wafer surface to create a surface potential transient, and the step of measuring a parameter of the resultant surface potential transient This technique may be utilized to make time retention and epi doping concentration measurements It is especially advantageous for reducing the effects of surface leakage on these measurements In a preferred embodiment, corona discharges are used to effect the charge deposition configuration Either corona discharge or photon injection are used to change the depletion region depth

Contactless technique for semicondutor wafer testing

An apparatus for measuring charge in an oxide layer overlying a silicon substrate containing very high density product chips characterized by thick oxides and high substrate doping levels in the field regions. A specially designed extremely thin conductive probe is pressed against the oxide layer whose charge is to be measured. A bias is applied to the probe for biasing the underlying silicon surface into accumulation or inversion. An intensity modulated light beam is focussed at the point of probe contact. The resulting amplitude modulated photovoltage is detected and applied to a computer to derive the value of the oxide charge therefrom.

Photovoltaic oxide charge measurement probe technique

A method and apparatus comprises heating a wafer to a temperature sufficient to temperature stress the wafer and enable ion motion. The wafer is then initialized in a measurement region with a non-contact corona discharge of a first polarity until a first dielectric field is developed, wherein any mobile ions present in the dielectric layer or at an air/dielectric interface move to a substrate/dielectric interface. A non-contact pulsed corona discharge of a second polarity, opposite the first polarity, is then applied to the wafer until a second dielectric field is developed and an amount of corona discharge Q MEASURED necessary to change the dielectric field from the first dielectric field to the second dielectric field is measured, wherein any mobile ions present at the dielectric/substrate interface move to the air/dielectric interface. An ideal amount of corona discharge Q IDEAL , in the absence of any highly mobile ionic species, necessary to change the dielectric field voltage of a dielectric layer of known thickness from a third dielectric field to a fourth dielectric field is then established. Lastly, measured corona discharge Q MEASURED is compared to ideal corona discharge Q IDEAL , wherein a quantitative difference between Q.sub. MEASURED and Q IDEAL is indicative of the amount of mobile charge Q MOBILE , Q MOBILE being representative of the amount of mobile ionic species in the dielectric layer.

Contactless corona-oxide-semiconductor Q-V mobile charge measurement method and apparatus

Corona charges are used to bias a wafer to push down mobile charges and then pull them up during temperature cycles. Mobile charge is measured from the drops in the corona voltage due to the mobile charges. Corrections are made in the measurements for dipole potentials, leakage and silicon band-bending.

Non-contact mobile charge measurement with leakage band-bending and dipole correction

A contactless technique for semiconductor wafer testing comprising: depositing charges on the top surface of an insulator layer over the wafer to create an inverted surface with a depletion region and thereby a field-induced junction therebelow in the wafer, with an accumulated guard ring on the semiconductor surface therearound. The technique further includes the step of changing the depth to which the depletion region extends below the inverted semiconductor wafer surface to create a surface potential transient, and the step of measuring a parameter of the resultant surface potential transient. This technique may be utilized to make time retention and epi doping concentration measurements. It is especially advantageous for reducing the effects of surface leakage on these measurements. In a preferred embodiment, corona discharges are used to effect the charge deposition configuration. Either corona discharge or photon injection are used to change the depletion region depth.

A contacless technique for semiconductor wafer testing

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