The design and use of a simplified, highly efficient, waveguide-based wireless distribution system are provided. A low-loss waveguide is used to transport wireless signals from a signal source or sources to one or more receiver locations. One or more adjustable signal coupling devices partially insert into the waveguide at predetermined locations along the length of the system to provide variable, controlled extraction of one or more wireless signals. Low-loss impedance matching circuitry is provided between the waveguide coupling devices and output connectors to maintain high system efficiency. The system offers the capability of supplying signals of high strength and high quality to a large number of receivers in a wide wireless coverage area via a plurality of signal radiators. Some embodiments of the system are readily adaptable for wireless distribution service in HVAC plenum spaces. A system that combines the functions of fire extinguishing and waveguide wireless distribution is also disclosed.

Waveguide-based wireless distribution system and method of operation

An apparatus for 3D representation of image data, comprising: a structure identifier for identifying structures in motion within image data, and a skeleton insertion unit, which associates three-dimensional skeleton elements with the identified structures. The skeleton elements are able to move with the structures to provide a three-dimensional motion and structural understanding of said image data which can be projected back onto the input data. As well as individual elements, complex bodies can be modeled by complex skeletons having multiple elements. The skeleton elements themselves can be used to identify the complex objects.

System and method for 3d space-dimension based image processing

Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

Cantilever microprobes for contacting electronic components and methods for making such probes

A membrane probing assembly includes a probe card with conductors supported thereon, wherein the conductors include at least a signal conductor located between a pair of spaced apart guard conductors. A membrane assembly includes a membrane with contacts thereon, and supporting at least a signal conductor located between a pair of spaced apart guard conductors. The guard conductors of the probe card are electrically interconnected proximate the interconnection between the probe card and the membrane assembly. The guard conductors of the membrane assembly are electrically interconnected proximate the interconnection between the probe card and the membrane assembly.

Membrane probing system

A membrane probing assembly includes a support element having an incompressible forward support tiltably coupled to a rearward base and a membrane assembly, formed of polyimide layers, with its central region interconnected to the support by an elastomeric layer. Flexible traces form data/signal lines to contacts on the central region. Each contact comprises a rigid beam and a bump located in off-centered location on the beam, which bump includes a contacting portion. After initial touchdown of these contacting portions, further over-travel of the pads causes each beam to independently tilt locally so that different portions of each beam move different distances relative to the support thus driving each contact into lateral scrubbing movement across the pad thereby clearing away oxide buildup. The elastomeric member backed by the incompressible support ensures sufficient scrub pressure and reliable tilt recovery of each contact without mechanical straining of the beam. In an alternative embodiment, the contacts comprise conductive beams each supported on a loose U-shaped flap formed in the membrane assembly where each flap and beam is tiltably supported in inclined position by an elastomeric hub interposed between the flap and support.

Membrane probing system with local contact scrub

A method of constructing a probe which includes providing a substrate and creating a first substantially asymmetrical recess within the substrate. A conductive material is located within the recess and a conductive trace is electrically connected with the conductive material. A membrane supports the conductive trace, wherein the conductive material is located between the membrane and the substrate. The substrate is removed from the conductive material.

Probe construction using a recess

A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

Membrane probing method using improved contact

Method for probing an electrical device having a layer of oxide thereon

A method for producing a membrane sensor (40), comprising: a) providing a substrate (200, 220, 530), b) forming a recess (216) in the substrate (200, 220, 530), c) introducing conductive material (250, 532) (in the recess 216); d) connecting a conductor (76a, 252, 536) to the conductive material (250, 532); e) attaching a diaphragm (72a) to the conductive material (250, support 532); and f) removing the substrate (200, 220, 530) (the conductive material 250, 532).

Membranmeßfühler and membrane probe constructions, methods for their preparation and with them applied testing

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