Biometric cryptosystems: a comprehensive survey

As a common transmission line, the microstrip line plays an important role in high-speed circuits. The purpose of this paper was to investigate the effects of the circuit design of microstrip lines on the signal integrity (SI). In addition, the influence of the type and thickness of the solder resist ink on SI was analyzed to provide guidance for the related producing process design of printed circuit boards (PCBs).,Microstrip line properties consisting of shape, line-width/line-space ratio, reference layer design and as-covered solder resist ink were designed to measure the insertion loss (S21) in high-speed PCB.,The study showed that the insertion loss (S21) of straight, meander, snake-shaped and wavy microstrip lines was approximately consistent. A microstrip line with width/space ratio less than 0.96 is necessary, as the differential line closing produces a mutual interference. Reference layer including the discontinuous area should be repaired by adjusting the microstrip line parameters. With regard to the solder resist ink, the insertion loss of novel solder resist ink decreased by 0.163 dB/in at 12.9 GHz and 0.164 dB/in at 14 GHz, compared with traditional solder resist ink. Accordingly, the insertion loss effectively improved at a lower thickness of solder resist.,This paper demonstrated that the common designing factors of line shape, line/space ratio, reference layer and solder resist influence microstrip line SI in the significant reference of designer-making PCB layout.

Effects of microstrip line fabrication and design on high-speed signal integrity transmission of PCB manufacturing process

Кристаллы интегральных микросхем для защиты от влияния окружающей среды чаще всего помещаются в корпус. При этом корпус, исполняющий положительную роль защиты от внешних воздействий, отрицательно влияет на частотные и ряд других характеристик микросхем. Так, с увеличением частоты начинают проявляться негативные эффекты, связанные с целостностью сигнала – перекрестные помехи, возникновение резонансов, связанных с одновременным переключением цифровых блоков, шумы – дребезг земли и др. Для предотвращения данных проблем требуется учитывать параметры используемого корпуса на этапе разработки схемотехники. В данной работе результаты полноволнового трехмерного электромагнитного моделирования методом конечных элементов в частотной области LGA корпуса микросхем используются для построения RLC модели вывода корпуса, которая затем дорабатывается с целью достижения большей точности модели на высоких частотах. Применение данной оптимизации позволило повысить точность модели в диапазоне частот более чем в 3 раза.

ОПРЕДЕЛЕНИЕ LC ПАРАМЕТРОВ КОРПУСА ИМС МЕТОДОМ ЭЛЕКТРОМАГНИТНОГО МОДЕЛИРОВАНИЯ С ЦЕЛЬЮ ПОСТРОЕНИЯ ВЫСОКОТОЧНОЙ МОДЕЛИ ВЫВОДА КОРПУСА НА ВЫСОКИХ ЧАСТОТАХ, "Электронная техника. Серия 3. Микроэлектроника"

In high speed applications, the clock rates have approached giga-hertz ranges. Signal integrity has become a critical issue and is posing severe challenges to the designers. This necessitates interconnects capable of supporting broadband signals without degradation. In signal integrity analysis, Sparameters are labeled as the behavioral model that can be used for describing the behavior of linear and passive interconnects. Sparameters describes how precise waveforms such as sine waves, scatter from the ends of interconnects. S-parameter matrix elements and analytical information that each element contains gives the precise behavior of interconnects. Here a new analytical formulation is proposed, which is used to extract the Sparameters of the RLCG interconnects that is based on the impedance profile of network. The impedances extracted are used for estimation of return loss (S11) and insertion losses (S21) of interconnect. Calculation is a complicated task and depends on impedance profile, time delays of transmission line segment and frequency of wave. S-parameters are obtained by considering interconnect as a two port network with a source and matched impedance terminations (Z0=50&#x03A9). S-parameter analysis of lumped and distributed models of interconnects such as RC, RLC and RLGC and modified RGLC model is carried out for performance evaluation. Simultaneously, Time Domain Reflectrometry (TDR) analysis of all the models of interconnects is performed to know impedance discontinuities. In TDR analysis, the incident waveforms is a step edge and the reflected wave is referred as the time domain reflection response. The results are compared for optimum performances in metrics of insertion loss (S21) and return loss (S11) in dB/magnitude scale along with TDR response of interconnect models.

S-Parameter Modeling and Analysis of RGLC Interconnect for Signal Integrity

In recent years, many template protection methods for fingerprints have been developed. We present a method for constructing a bio-cryptosystem for fingerprints by selecting neighbors of a minutia point variable. To select a variable number of neighbors for each minutia point, we construct a Delaunay triangulation for the minutiae points in the fingerprint image. We derive a bit string from the neighbors in the Delaunay triangulation. This bit string is protected using fuzzy commitment scheme. Here, we use convolution coding to encrypt the bit string. The experimental tests conducted on FVC 2002 databases, yield satisfactory results, thereby proving the viability of the proposed method.

Fingerprint Cryptosystem Using Variable Selection of Minutiae Points

In modern IC chips, on chip interconnects plays a dominant role because of the device parasitic's. Several analytical and mathematical models are used for the interconnect analysis for delay reduction. But with the technology scaling towards nanometers, interconnect length is increasing exponentially. So, more accurate and efficient techniques for interconnect analysis are essential to reduce the propagation delays and increase the overall circuit performance in-terms of speed. Here a new interconnect scheme based on the transmission line model is proposed. This interconnect scheme has a resistance and conductance at the input, output and a lossless T-type LC network between them. Closed form delay model of interconnect is developed, which is a third order approximation to achieve better accuracy and less delays. The lumped delay models such as RC, RLC and RLGC are compared with the proposed model of interconnect for performance analysis in-terms of propagation delays and average power. The comparison analysis have shown that the proposed model of interconnect has less transients, average and propagation delays when compared to the other delay models.

Analytical Delay Modeling of On-Chip Hybrid RGLC Interconnect

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S-Parameter Modeling and Analysis of RGLC Interconnect for Signal Integrity

Fingerprint Cryptosystem Using Variable Selection of Minutiae Points

Analytical Delay Modeling of On-Chip Hybrid RGLC Interconnect