In recent years, copper wiring has emerged as a promising substitute for the aluminum wiring in integrated circuits, because copper offers lower electrical resistance and better reliability at smaller dimensions than aluminum. However, use of copper typically requires forming a diffusion barrier to prevent contamination of other parts of an integrated circuit and forming a seed layer to facilitate copper plating steps. Unfortunately, conventional methods of forming the diffusion barriers and seed layers require use of separate wafer-processing chambers, giving rise to transport delays and the introduction of defect-causing particles. Accordingly, the inventors devised unique wafer-processing chambers and methods of forming barrier and seed layers. One embodiment of the wafer-processing chamber includes equipment for physical vapor deposition and equipment for chemical vapor deposition to facilitate formation of diffusion barriers and seed layers within one chamber, thereby promoting fabrication efficiency and reducing defects.

Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals

A method for forming conductive contacts and interconnects in a semiconductor structure, and the resulting conductive components are provided. In particular, the method is used to fabricate single or dual damascene copper contacts and interconnects in integrated circuits such as memory devices and microprocessor.

Barrier-metal-free copper damascene technology using atomic hydrogen enhanced reflow

Structures and methods are provided for an improved multilevel wiring interconnect in an integrated circuit assembly. The present invention provides for a multilayer copper wiring structure by electroless, selectively deposited copper in a streamlined process which further reduces both intra-level line to line capacitance and the inter-level capacitance. In particular, an illustrative embodiment of the present invention includes a novel methodology for forming multilevel wiring interconnects in an integrated circuit assembly. The method includes forming a number of multilayer metal lines, e.g. copper lines formed by selective electroless plating, separated by air gaps above a substrate. A low dielectric constant material is deposited between the number of metal lines and the substrate using a directional process. According to the teachings of the present invention, using a directional process includes maintaining a number of air gaps in the low dielectric constant material. Structures and systems are similarly included in the present invention.

Multilevel copper interconnects with low-k dielectrics and air gaps

Disclosed structures and methods inhibit atomic migration and related capacitive-resistive effects between a metallization layer and an insulator layer in a semiconductor structure. One exemplary structure includes an inhibiting layer between an insulator and a metallization layer. The insulator includes a polymer or an insulating oxide compound. And, the inhibiting layer has a compound formed from a reaction between the polymer or insulating oxide compound and a transition metal, a representative metal, or a metalloid.

Structures and methods to enhance copper metallization

Structures and methods are provided which include a selective electroless copper metallization. The present invention includes a novel methodology for forming copper vias on a substrate, including depositing a thin film seed layer of Palladium (Pd) or Copper (Cu) on a substrate to a thickness of less than 15 nanometers (nm). A number of via holes is defined above the seed layer. A layer of copper is deposited over the seed layer using electroless plating to fill the via holes to a top surface of the patterned photoresist layer. The method can be repeated any number of times, forming second, third and fourth layers of copper. The photoresist layers along with the seed layers in other regions can then be removed, such as by oxygen plasma etching, such that a chemical mechanical planarization process is avoided.

Selective electroless-plated copper metallization

The barrier performance and properties (resistivity, crystalline phase and surface microroughness) of tantalum nitride films, as well as the relationship between grain size and diffusivity of copper films, are reported. The resistivity and Ra roughness of Ta2N film formed by reactive sputtering using argon and nitrogen plasma are ~200 µΩcm and ~0.35 nm, respectively. The Ta2N diffusion barrier exhibits better barrier performance than Ta4N and bcc-Ta diffusion barriers. Giant-grain copper interconnects formed by sputtering in low-energy ion bombardment process show lower diffusivity than small-grain copper interconnects. The barrier performance of tantalum nitride film was evaluated by electrical measurement. An n+p junctions having 20 µm×20 µm contact holes filled with 10-nm-thick Ta2N diffusion barriers and giant-grain copper interconnects exhibit no increase in reverse-bias current after annealing at 700°C for 30 min in argon ambient.

Thin and Low-Resistivity Tantalum Nitride Diffusion Barrier and Giant-Grain Copper Interconnects for Advanced ULSI Metallization

https://www.jstage.jst.go.jp/article/jjoms1967/32/8/32_8_1505/_pdf

A case of nodular fasciitis of the mandible

A 46-year-old woman referred for swelling on median part of the mandible. She had become aware of the lesion 2 years ago as a bean-size swelling on her lingual gingiva.She had visited an otorhinologist and had got the enucleation.Recurrence of the lesion had occurred after 1 year and it had enlarged to an egg-size within 9 months. Clinical examination disclosed a moderately firm swelling extending laterrally 4 from to 3 on both labial and lig lingual sides.X-ray exam showed diffused absorption of the bone. Under histopathological diagnosis of emangiopericytoma, the tumor was excised with the mandible from 1 to IT rectangularly.Histopathological exam of the excised specimen revealed invasion of tumor cells to the mandibular bone marrow, which suggests Malignant hemangiopericytoma.40 Gy of total dose irradiation after operation.At the 4 years' exam, there was no evidence of recurrence or metastasis.

Malignant hemangiopericytoma of the mandibular alveolar process: A case report

Clinical studies on the serum levels of immunosuppressive acidic protein (IAP) of oral cancer patients

https://www.jstage.jst.go.jp/article/jjoms1967/25/4/25_4_778/_pdf

Clinical and statistical investigation on the regional lymph node metastasis of oral squamous cell carcinoma

Handle everyday research tasks with reliable, citation-backed results

Your personal Research Agent to handle research tasks with citation-backed results

Popular Tasks used by Researchers

How can I help with your research?

Meet SciSpace

Get more enhanced response by uploading the PDFs you want me to reference.

No relevant PDFs in your library

SciSpace is the AI research assistant for academics. Run systematic literature reviews on 280M+ papers, and write papers with cited sources. Trusted by 1M+ students, PhDs & researchers.

SciSpace | AI for Research

Analyze PDFs

Code & Manuscripts

Funding & Grants

Literature & Patents

Medical & Clinical Data

Systematic Review

Visualize & Present

Web & Data

Build a Google Scholar-like website for your research.

Build a website

Create charts and images for your research

Create a Chart

Write a paper for submission to a journal

Draft a manuscript

Patent Search

Design eye-catching scientific posters in minutes.

Scientific Poster Generation

Systematic Literature Review

One task is running at the moment. Your messages will be shown right after.

Drag and drop or click here to browse

Loved by <highlight>1 million+</highlight> researchers

Extract a list of specific topics and their sources from unstructured text

Topics

Compare and analyze relevant papers that matches with your search

Papers

Get insights from PDFs and bookmarked papers from your library

My library

Recent searches

Try searching for:

Catch AI-generated content in scholarly and non-scholarly content

{ai} Detector

Ai Writer

Get PDF Summaries, highlighted text explanations 

Chat with PDF

Effortlessly create in-text citations and bibliographies in APA and 2,500 other formats

Citation generator

Get explanations, summaries, and answers on academic papers

Ease up your research workflow with {scispace}'s cohort of exciting AI tools

Elevate your academic writing skills and convey your ideas the way you want

Paraphraser

Explore our range of reading and writing tools

Your file is being prepared and should be ready in a few minutes. If it's a large file, it might take a bit longer. You can close this window, and we'll email you the file when it's done.

You have reached a maximum limit of <strong>{limit}</strong> columns in the table. Remove at least <strong>1</strong> column to add or create another one.

Masashi Numata

Author Tools

Chat about Author