Mario Gonzalez
Katholieke Universiteit Leuven
97 Papers
615 Citations
Mario Gonzalez is an academic researcher from Katholieke Universiteit Leuven. The author has contributed to research in topics: Stretchable electronics & Silicon. The author has an hindex of 24, co-authored 97 publications. Previous affiliations of Mario Gonzalez include Austral University of Chile & IMEC.
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Papers
Design of metal interconnects for stretchable electronic circuits
Mario Gonzalez,Fabrice Axisa,Mathieu Vanden Bulcke,Dominique Brosteaux,Bart Vandevelde,Jan Vanfleteren,Jan Vanfleteren +6 more
TL;DR: In this work, the design of flexible and stretchable interconnections is presented by embedding sinuous electroplated metallic wires in a stretchable substrate material that allows a large deformation with the minimum stress concentration.
435
Design and Fabrication of Elastic Interconnections for Stretchable Electronic Circuits
TL;DR: In this paper, a simple molded-interconnect-device technology for the construction of elastic point-to-point interconnections, based on 2-D spring-shaped metallic tracks, which are embedded in a highly elastic silicone film, was revealed.
255
Printed circuit board technology inspired stretchable circuits
Jan Vanfleteren,Mario Gonzalez,Frederick Bossuyt,Yung-Yu Hsu,Thomas Vervust,I. De Wolf,Michal Jablonski +6 more
TL;DR: An approach inspired by conventional rigid and flexible printed circuit board (PCB) technology is presented, aimed at optimizing the build-up toward maximum mechanical reliability of the structures.
Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages.
TL;DR: Comparing the induced inelastic strains in the solder joint, the leadfree SnAgCu generally scores better thanks to the lower creep strain rate, while for the CSP and flip chip package, SnAg Cu scores worse for the more extreme loading conditions when the inelastically dissipated energy density is selected as damage parameter.
136
Design of Metal Interconnects for Stretchable Electronic Circuits using Finite Element Analysis
Mario Gonzalez,Fabrice Axisa,M. Vanden Bulcke,Dominique Brosteaux,Bart Vandevelde,Jan Vanfleteren +5 more
- 16 Apr 2007
TL;DR: In this paper, the authors proposed a flexible and stretchable interconnections by embedding sinuous electroplated metallic wires in a stretchable substrate material, which is chosen as a silicone material because of its low stiffness and high elongation before break.
131