A review of heat transfer and pressure drop characteristics of single and two-phase microchannels

Power dissipation in microprocessors will reach a level that necessitates chip-level liquid cooling in the near future. An on-chip microfluidic heat sink can reduce the thermal interfaces between an IC chip and the convective cooling medium. Through wafer-level processing, integrated thermal-fluidic I/O interconnects enable on-chip microfluidic heat sinks with ultrasmall form factor at low-cost. This letter describes wafer-level integration of microchannels at the wafer back-side with through-wafer fluidic paths and thermal-fluidic input/output interconnection for future generation gigascale integrated chips.

Integrated thermal-fluidic I/O interconnects for an on-chip microchannel heat sink

At present, miniaturization of the devices in order to make them for effective performance, reliability and ease at cost is the primary need of any nation. In this direction, the role of microchannels can play an important role in the further development of industrial growth. The increased demand of the microchips in the industrial areas has increased the number of transistors for the improved functionality which leads to the emission of the higher heat flux, which is already a big challenge in the electronic sector. In the present paper, a comprehensive review on microchannels has been done regarding single-phase and multi-phase studies. In the present paper, an intensive review of the thermal and hydraulic characteristics of fluid flow in microchannels at different hydraulic diameters and their effects on performance has been done. The effects of the various parameters such as the Reynolds number (Re), Nusselt number (Nu), friction factor (f), pressure drop (P), working fluid and cross-sectional geometry of duct, as well as the hydrodynamic and thermal aspects, has been also studied. It was concluded through the literature study that transition from laminar to turbulent is very much affected by channel cross-sectional geometry, aspect ratio, channel wall roughness and compressibility effects. Also, researchers only explored the laminar region for its pressure drop and heat transfer characteristics, while the turbulent flow regime is yet to be explored. It was observed that most of the correlation over-estimated the value of pressure drop in multi-phase flow.

A study on thermohydraulic characteristics of fluid flow through microchannels

https://smartech.gatech.edu/bitstream/1853/14001/1/dang_bing_200612_phd.pdf

Integrated Input/Output Interconnection and Packaging for GSI

A bibliography of 847 publications dealing with air cooled heat sinks for thermal enhancement of electronic packages is presented. The bibliography also includes papers dealing with design and performance analysis of heat sinks, extended surfaces and adhesives for bonding heat sinks. The papers are classified in several categories.

bibliography of liquid cooled heat sinks for thermal enhancement of electronic packages

This paper describes a novel packaging technology for high power multi chip modules (MCMs). The work covers three areas: The fabrication of a multichip module which provides access to the die backside for heat removal, the development of high performance microchannel heat sinks with a CTE matched to the MCM-substrate as well as a low thermal resistivity assembling technology of the two components. The MCM is fabricated by means of the planar embedding technology. By planarizing the module backside a low thermal resistance between heat sink and dice can be accomplished simultaneously for all embedded components. While offering the same high interconnection density and the high speed performance benefit of flip chip and providing high reliability and very small size of the overall package, this alternative technology promises to eliminate crucial problems associated with backside cooling of flip chip devices.

High power multichip modules employing the planar embedding technique and microchannel water heat sinks

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High power multichip modules employing the planar embedding technique and microchannel water heat sinks