Transient liquid phase (TLP) bonding is a relatively new bonding process that joins materials using an interlayer. On heating, the interlayer melts and the interlayer element (or a constituent of an alloy interlayer) diffuses into the substrate materials, causing isothermal solidification. The result of this process is a bond that has a higher melting point than the bonding temperature. This bonding process has found many applications, most notably the joining and repair of Ni-based superalloy components. This article reviews important aspects of TLP bonding, such as kinetics of the process, experimental details (bonding time, interlayer thickness and format, and optimal bonding temperature), and advantages and disadvantages of the process. A wide range of materials that TLP bonding has been applied to is also presented. Partial transient liquid phase (PTLP) bonding is a variant of TLP bonding that is typically used to join ceramics. PTLP bonding requires an interlayer composed of multiple layers; the most common bond setup consists of a thick refractory core sandwiched by thin, lower-melting layers on each side. This article explains how the experimental details and bonding kinetics of PTLP bonding differ from TLP bonding. Also, a range of materials that have been joined by PTLP bonding is presented.

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Overview of transient liquid phase and partial transient liquid phase bonding

A review of the transient liquid phase (TLP) bonding process is presented in this paper. This review concentrates on the mechanisms of the TLP process, including both microstructural development and wettability aspects. However, design related issues and engineering applications are also considered. The paper explains how the TLP bonding process offers the potential for producing joints with microstructures and hence mechanical properties that are similar to those of the parent materials. The process of isothermal solidification is discussed at some length. The paper considers the ways in which specific microstructural features of the substrate material–interlayer material combination influence microstructural development. A distinction is drawn between cases where the progression of isothermal solidification dominates the final microstructure and those where events occurring after the completion of isothermal solidification are paramount. The paper describes the practical limitations on the produ...

Transient liquid phase bonding

Strain energy distribution in ceramic-to-metal joints

Joining of ceramics

Micromechanical modelling of functionally graded materials

A method of ceramic-ceramic joining that exploits a thin layer of a transient liquid phase to join alumina to alumina has been developed, and the results of its application to joining alumina are reported. Through the use of microdesigned multilayer Cu/Pt interlayers, transient liquid-phase joining has been achieved at 1150°C, yielding an interlayer that is platinum-rich at temperatures substantially lower than those required for solid-state diffusion bonding with pure platinum interlayers. Flexure tests indicate that ceramic/metal interface strengths exceeding those of the ceramic can be achieved.

Ceramic joining: Part I Partial transient liquid-phase bonding of alumina via Cu/Pt interlayers

A method of ceramic-ceramic joining that exploits a multilayer interlayer designed to form a thin, potentially transient layer of liquid phase has been used to join alumina to alumina. Microdesigned multilayer Cu/Nb interlayers were used to achieve bonding at 1150 °C. Flexure strengths of as-bonded samples ranged from 119 to 255 MPa, with an average of ≈ 181 MPa. The ability to form ‘strong’ ceramic/metal interfaces is also indicated by instances of ceramic failure. Microstructural and chemical characteristics of fracture surfaces were evaluated using SEM, EDS and microprobe. The impact of post-bonding anneals of 10 h duration at 1000 °C in gettered argon on room-temperature joint strength was assessed. High strengths (198 to 238 MPa) were obtained. The retention of strength following annealing in low oxygen partial pressure argon differs from the behaviour previously observed in Cu/Pt bonded alumina. Effects of the anneal on interfacial microstructure were determined, and an explanation for this difference in behaviour is proposed.

Ceramic joining III bonding of alumina via Cu/Nb/Cu interlayers

Multilayer Cu/Ni/Cu interlayers that form a thin layer of a Cu-rich transient liquid phase have been used to join alumina to alumina at 1150 °C The method and bonding conditions yield an assembly bonded by a Ni-rich (>94 at% Ni) interlayer at a temperature substantially lower than those normally required for solid-state diffusion bonding with pure Ni interlayers Flexure strengths of as-bonded beams ranged from 61 to 267 MPa with an average of 160 MPa and a standard deviation of ±63 MPa The highest flexure strengths were observed in samples where failure occurred in the ceramic Post-bonding anneals of 10 h duration in air and gettered-argon at 1000 °C decreased the average room temperature strength to 138 and 74 MPa, respectively In as-processed and annealed samples, varying degrees of interfacial spinel formation are indicated Spinel formation may contribute to the scatter in as-processed samples, and the decrease in strength values resulting from annealing

Ceramic joining II partial transient liquid-phase bonding of alumina via Cu/Ni/Cu multilayer interlayers

In most cases, functionally gradient materials have been designed to produce a desirable property gradient in a material or in a joint region. In this paper, the concept of a transient gradient structure is introduced. The function of the intentional property discontinuities in these multilayer interlayers is to facilitate processing of assemblies and materials combinations that would be difficult to process using conventional bonding approaches. Specifically, the methods make use of a thin or partial layer of a low melting point transient liquid phase to facilitate bonding via brazing, yet produce refractory joints. Several mechanisms for consuming the transient liquid former are outlined, and examples of interlayer designs that exploit these mechanisms are presented. Specific results from experiments joining alumina to alumina via Cu/Pt/Cu, Cu/Ni/Cu, Cu/Nb/Cu and Sn/Nb/Sn interlayers are presented.

A transient FGM interlayer based approach to joining ceramics. [Functionally gradient materials]

In most cases, functionally gradient materials have been designed to produce a desirable property gradient in a material or in a joint region In this paper, the concept of a transient gradient structure is introduced The function of the intentional property discontinuities in these multilayer interlayers is to facilitate processing of assemblies and materials combinations that would be difficult to process using conventional bonding approaches Specifically, the methods make use of a thin or partial layer of a low melting point transient liquid phase to facilitate bonding via brazing, yet produce refractory joints Several mechanisms for consuming the transient liquid former are outlined, and examples of interlayer designs that exploit these mechanisms are presented Specific results from experiments joining alumina to alumina via Cu/Pt/Cu, Cu/Ni/Cu, Cu/Nb/Cu and Sn/Nb/Sn interlayers are presented

/pdf/a-transient-fgm-interlayer-based-approach-to-joining-4rznssiyro.pdf

A Transient FGM Interlayer Based Approach to Joining Ceramics

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