M. Hande

TL;DR: The proposed methodology eliminates the need for knowledge of prior stress histories and enables interrogation of system state using the identified damage pre-cursors, which have correlated with residual life and computational finite-element model predictions.

TL;DR: In this article, a mathematical approach for interrogation of system state under cyclic thermo-mechanical stresses has been developed for 6-different leadfree solder alloy systems on a variety of area-array architectures.

TL;DR: In this paper, the authors developed a framework based on a development of correlation between damage pre-cursors and underlying degradation mechanisms in lead-free packaging architectures, which eliminates the need for knowledge of prior stress histories and enables interrogation of system state using the identified damage precursors.

TL;DR: In this article, a mathematical approach has been presented to calculate the prior damage in electronics subjected to cyclic and isothermal thermo-mechanical loads, which can significantly impact electronic reliability for applications in which even minimal risk of failure may be unbearable.