M. Finck
9 Papers
39 Citations
M. Finck is an academic researcher. The author has contributed to research in topics: Mercury cadmium telluride & Noise-equivalent temperature. The author has an hindex of 5, co-authored 9 publications.
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Papers
256×256 focal plane array midwavelength infrared camera based on InAs/GaSb short-period superlattices
Markus Walther,Robert Rehm,Frank Fuchs,Johannes Schmitz,Joachim Fleißner,Wolfgang A. Cabanski,D. Eich,M. Finck,Werner Rode,J. Wendler,R. Wollrab,Johann Ziegler +11 more
TL;DR: An infrared camera based on a 256×256 focal plane array (FPA) for the second atmospheric window (3-5 µm) has been realized for the first time with InAs/GaSb short period superlattices (SLs) as discussed by the authors.
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Dual-band QWIP focal plane array for the second and third atmospheric windows
Harald Schneider,Thomas Maier,J. Fleissner,Markus Walther,Peter Koidl,G. Weimann,Wolfgang A. Cabanski,M. Finck,P. Menger,Werner Rode,Johann Ziegler +10 more
TL;DR: In this paper, the authors report on the development and status of a dual-band QWIP FPA with 384 × 288 pixels and 40μm pitch for the 3-5-μm (mid-wavelength infrared, MWIR) and 8-12 -μm spectral bands.
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High-resolution 3─5 [micro sign]m/8─12 [micro sign]m dual-band quantum well infrared photodetector array
Harald Schneider,Thomas Maier,J. Fleissner,Markus Walther,Peter Koidl,G. Weimann,Wolfgang A. Cabanski,M. Finck,P. Menger,Werner Rode,J. Ziegler +10 more
TL;DR: In this article, a dual-band focal plane array (FPA) for the 8-12-µm and 3-5-5 -mm atmospheric windows with simultaneous integration in both spectral bands on each pixel is reported.
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Advanced sensor technologies for high performance infrared detectors
TL;DR: In this article, a guard ring approach for planar diodes, created by a n+region in pixel spacing area reduces pixel crosstalk and improves modulation transfer function.
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Long linear HgCdTe arrays with superior temperature-cycling-reliability
Johann Ziegler,M. Finck,Rolf Krueger,Thomas Simon,C. J. Wendler +4 more
- 17 Jul 2000
TL;DR: In this article, a multi-chip-module approach for the infrared Focal-Plane-Array (FPA) was developed to meet the demands for high temperature-cycling reliability of HgCdTe detectors, bonded to a Silicon 'Read-Out-Integrated- Circuit.'
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