Parasitic capacitances of conventional transformers can be used as resonant elements in resonant DC-DC converters in order to reduce the overall system size. For predicting the values of the parasitic capacitors without building the transformer different approaches for calculating these capacitances are compared. A systematic summary of the known approaches is given and missing links between the different theories and missing equations are added. Furthermore, a new simple procedure for modelling parasitic capacitances which is based on the known approaches is proposed. The resulting equations are verified by measurements on four different high voltage transformers.

https://www.hpe.ee.ethz.ch/uploads/tx_ethpublications/01518701.pdf

Using transformer parasitics for resonant converters - a review of the calculation of the stray capacitance of transformers

The paper examines the status of power electronics technology by looking at eight constituent technologies (power switch technology, passive components, power switching network technology, packaging technology, environmental impact technology, cooling technology, manufacturing technology, and converter control technology). The present trends are then discussed from the point of view of some of these that can be considered internal drivers, as well as from the viewpoint of those that are external drivers. Packaging as a central driver is evaluated and the necessity for a paradigm shift in power electronics technology identified. Future possibilities in terms of electromagnetic integration of passives and of integrated power electronic modules (IPEMs) are discussed.

Power electronics technology at the dawn of the new millenium-status and future

Integration of efficient power converters requires technology for efficient, high-power on-chip inductors and transformers. Increases in switching frequency, facilitated by advances in circuit designs and silicon or wide-bandgap semiconductors, can enable miniaturization, but only if the magnetics technology works well at the higher frequencies. Technologies, geometries, and scaling of air-core and magnetic-core inductors and transformers are examined, and their potential for integration is discussed. Air-core inductors can use simpler fabrication, and increasing frequency can always be used to decrease their size, but magnetic cores can decrease the required thickness without requiring as high a frequency.

Integrating Magnetics for On-Chip Power: A Perspective

The ongoing demand for smaller and lighter power supplies is driving the motivation to increase the switching frequencies of power converters. Drastic increases however, come along with new challenges, namely the increase of switching losses in all components. The application of power circuits used in radio frequency transmission equipment helps to overcome those. However, those circuits were not designed to meet the same requirements as power converters. This paper summarizes the contributions in the recent years in the application of very high frequency (VHF) technologies in power electronics, which show the results of the recent advances and describes the remaining challenges. The presented results include a self-oscillating gate drive, air-core inductor optimizations, an offline LED driver with a power density of 8.9 W/cm
 3
, and a 120-MHz, 9-W dc powered LED driver with 89% efficiency as well as a bidirectional VHF converter. The challenges to be solved before VHF converters can be used effectively in industrial products are within those three categories: 1) components; 2) circuit architectures; and 3) reliability testing.

/pdf/evolution-of-very-high-frequency-power-supplies-2kptqzor0c.pdf

Evolution of Very High Frequency Power Supplies

Assemblies of power semiconductor switches and their associated drive circuits are at present available in modules. Upward into the multi-kilowatt range, mixed mode module construction is used. This incorporates monolithic, hybrid, surface mount, and wirebond technology. However, a close examination of the applications in motor drives and power supplies indicates that there has been no dramatic volume reduction of the subsystem. The power semiconductor modules have shrunk the power switching part of the converter, but the bulk of the subsystem volume still comprises the associated control, sensing, electromagnetic power passives (inductors, transformers, capacitors) and interconnects. This paper addresses the improvement of power processing technology through advanced integration of power electronics. The goal of a subsystem in a module necessitates this advanced integration, incorporating active switching stages, electromagnetic interference (EMI) filters, and electromagnetic power passives into modules by integration technology. The central philosophy of the technology development research in the National Science Foundation Engineering Research Center for Power Electronic Systems is to advance the state of the art by providing the concept of integrated power electronics modules (IPEMs) for all these functions. The technology underpinning such an IPEM approach is discussed.

Integrating active, passive and EMI-filter functions in power electronics systems:a case study of some technologies

An approach to the design and analysis of planar electromagnetic integrated reactive components based on transmission line theory is presented. It is shown that resonance can occur in a transmission line structure with dimensions much smaller than a quarter wavelength. These structures can find application in many high frequency resonant converter topologies. >

Application of transmission line principles to high frequency power converters

Technology for manufacture of integrated planar LC structures for power electronic applications

An integrated structure for the capacitor, inductor, and transformer of a series resonant power converter is presented. It is shown that the necessary capacitance can be achieved by using a bifilar primary, and the leakage inductance of the transformer replaces the physical inductor. By integrating three components into one, it is possible to save space, mass, volume, and cost. An integrated L-C-T structure has been constructed and operated in a series resonant converter. >

A new ultrasonic series resonant converter with integrated L-C-T

This paper presents a new approach to constructing an efficient integrated low profile DC/AC resonant link converter. The LC resonant circuit in the resonant DC-link converter is replaced by a planar integrated LC operating at high frequency and high power level, with an integrated passive voltage clamp. An extension of the capacitive bifilar winding of the integrated LC makes it possible to construct a very low impedance DC-link resonant busbar for the converter. Experimental results on a 3 kVA, 115 kHz prototype is presented. >

An integrated resonant DC-link converter, using planar ceramic capacitor technology

This paper presents an overview of the current state of the technology for electromagnetic integration of high power electronic converters. Some of the materials technologies needed for manufacture are described. As an example a completely integrated experimental multi-kilowatt resonant DC-DC power converter is discussed, together with some problems encountered and their solution. Experimental results are also given. A possible extension of the technology to hard switched, but snubbed and clamped power converters is discussed. Some of the thermal problems together with a thermal analysis are addressed. Conclusions about the technology are drawn and possible future developments investigated. >

Integrated technology and performance for multi-kilowatt power electronic converters-an evaluation

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