During soldering and service, intermetallic compounds (IMCs) have an important impact on the performance and reliability of electronic products. A thin and continuous intermetallic layer facilitates the formation of reliable solder joints and improves the creep and fatigue resistance of solder joints. However, if the IMCs overgrow, the coarse IMC becomes brittle and tends to crack under stress, leading to a decrease in solder joint reliability. Based on the latest developments in the field of lead-free solders at home and abroad, this paper comprehensively reviews the interfacial reaction between SnAgCu Pb-free solders and different substrates and the growth behavior of IMCs and clarifies the growth mechanism of interfacial IMCs. The effects of the modification measures of lead-free solder on the IMCs and reliability of SnAgCu/substrate interface are analyzed, which provide a theoretical basis for the development and application of new lead-free solder.

Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging

Metal-graphene interfaces in epitaxial and bulk systems: A review

Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review

Effects of Ni-decorated reduced graphene oxide nanosheets on the microstructural evolution and mechanical properties of Sn-3.0Ag-0.5Cu composite solders

Single-atom Catalysts for Next-generation Rechargeable Batteries and Fuel Cells

In this study, various weight percentages of Ag-nanoparticle-modified graphene (Ag-GNSs) were incorporated into Pb-free Sn-Ag-Cu (SAC) solder matrices via ball milling and mechanical mixing methods to form composite solders. Up to 0.2 wt% of the Ag-GNSs particles was successfully incorporated into the composite solders, and the microstructures and mechanical properties of the solders were investigated. The experimental results demonstrated that as the Ag-GNSs content increased, the number of intermetallic particles gradually decreased in size. In addition, the uniformity of the interfacial structure increased compared to that of the pure SAC solder. Furthermore, the melting points of the SAC/Ag-GNSs composite solders were unchanged compared to that of the pure SAC solder. The experimental results also revealed that the wettability of the composite solders on Cu substrates was greatly improved. Thermomechanical measurements showed that the thermal stability of the composite solders was also improved. In addition, tensile tests showed that the ultimate tensile strength of the composite solders was enhanced compared to that of the pure SAC solder, but the ductility of the composite solders was reduced. In particular, the tensile strength of the composite solders with low Ag-GNSs contents was increased, but the tensile strength then decreased once a critical Ag-GNSs content was reached. For the ball-milled solders, the reinforcement provided by the addition of Ag-GNSs particles was much better than that provided by unmodified graphene. By comparing the properties of solders fabricated with different preparation methods, it was determined that the ball-milled solders were superior to the mechanically mixed solders.

Design and performance of Ag nanoparticle-modified graphene/SnAgCu lead-free solders

Influence of Ag-modified graphene nanosheets addition into Sn–Ag–Cu solders on the formation and growth of intermetallic compound layers

The invention discloses a preparation method of tin-based silver graphene lead-free composite solder. The method comprises the steps that a certain amount of graphene and lauryl sodium sulfate are mixed, then a certain amount of dimethylformamide is added, ultrasonic treatment is performed for 2 h, a certain amount of silver nitrate is added into a mixed solution, ultrasonic treatment is performed continuously, and finally a self-made silver graphene nanosheets are obtained; and required solder matrix powder is weighed according to different graphene mass fractions and poured into a ball milling tank for ball milling for 5 h, the powder is placed into a stainless steel mold after being dried and placed under a hydraulic machine to be pressed and molded at the pressure of 500 Mpa, and then a cylinder obtained through cold pressing is placed into a high-vacuum tubular resistance furnace for vacuum sintering for 2 h at the temperature of 175 DEG C and placed under the hydraulic machine after being cooled to the room temperature to obtain a cylinder through impact extrusion. According to the preparation method, Ag-particle-modified graphene is selected as a strengthening material so as to improve load transmitting between the nano-silver-modified graphene and a Sn matrix, and therefore the better strengthening effect is achieved.

Preparation method for tin-based silver graphene lead-free composite solder

Effects of graphene nanosheets on interfacial reaction of Sn–Ag–Cu solder joints

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Design and performance of Ag nanoparticle-modified graphene/SnAgCu lead-free solders

Influence of Ag-modified graphene nanosheets addition into Sn–Ag–Cu solders on the formation and growth of intermetallic compound layers

Preparation method for tin-based silver graphene lead-free composite solder

Effects of graphene nanosheets on interfacial reaction of Sn–Ag–Cu solder joints