Li Weiping
8 Papers
5 Citations
Li Weiping is an academic researcher. The author has contributed to research in topics: Layer (electronics) & Dispersion (chemistry). The author has an hindex of 2, co-authored 8 publications.
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Papers
Patent
Anodic oxidation electrolyte, anodic oxidation method and aluminum or aluminum alloy comprising anodic oxide film
Liu Huicong,Ji Meng,Li Weiping,Chen Haining,Zhu Liqun +4 more
- 10 Sep 2019
TL;DR: In this paper, an anodic oxide film was used to replace chromic acid anodic oxidation in an aluminum or aluminum alloy, and the film formation accelerator was used as a solvent.
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Patent
Stain-resistant high-temperature liquid asphalt coating and preparation method thereof
Liu Huicong,Li Weiping,Chen Haining,Shao Yanjing,Zhu Liqun +4 more
- 27 Feb 2018
TL;DR: In this article, a stain-resistant high-temperature liquid asphalt coating and a preparation method belonging to the technical field of stain resistant coatings are presented. And the method consists of mixing a solvent, polyphenylene sulfide, a structural blending agent and an additive in proportion to prepare slurry; mixing the slurry with a hydrophobic modifier to prepare a coating; and coating the surface of a pre-treated substrate with the coating, and heating and preserving the temperature for a period of time and cooling to room temperature.
1
Patent
Organic-inorganic hybrid nanocapsule and preparation method thereof
Li Weiping,Xin Zhou,Chen Haining,Liu Huicong,Zhu Liqun +4 more
- 28 Sep 2018
TL;DR: In this article, an organic-inorganic hybrid nanocapsule and a preparation method for nanometer materials is described. But the preparation method has the advantages that organic groups are grafted onto the inorganic nanoparticle with high surface area to form the reaction type hybrid material; the reaction types hybrid material is applied into the wall material of the small-particle size microcapsule, so that the capsule wall is prevented, and the mechanical stability and thermal stability of the capsule walls are improved.
1
Patent
Nickel plating layer stress regulator and application thereof
Li Weiping,Liu Huicong,Zhang Chonghui,Chen Haining,Zhu Liqun +4 more
- 06 Nov 2018
TL;DR: In this article, a nickel plating layer stress regulator is proposed to improve the interface bonding of laminate plating layers and can be applied to aCu-Ni-Au multilayer plating on the surface of a space station electric transmission device.
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