The development of wearable electronics, point-of-care testing, and soft robotics requires strain sensors that are highly sensitive, stretchable, capable of adhering conformably to arbitrary and complex surfaces, and preferably self-healable. Conductive hydrogels hold great promise as sensing materials for these applications. However, their sensitivities are generally low, and they suffer from signal hysteresis and fluctuation due to their viscoelastic property, which can compromise their sensing performance. We demonstrate that hydrogel composites incorporating MXene (Ti3C2T x ) outperform all reported hydrogels for strain sensors. The obtained composite hydrogel [MXene-based hydrogel (M-hydrogel)] exhibits outstanding tensile strain sensitivity with a gauge factor (GF) of 25, which is 10 times higher than that of pristine hydrogel. Furthermore, the M-hydrogel exhibits remarkable stretchability of more than 3400%, an instantaneous self-healing ability, excellent conformability, and adhesiveness to various surfaces, including human skin. The M-hydrogel composite exhibits much higher sensitivity under compressive strains (GF of 80) than under tensile strains. We exploit this asymmetrical strain sensitivity coupled with viscous deformation (self-recoverable residual deformation) to add new dimensions to the sensing capability of hydrogels. Consequently, both the direction and speed of motions on the hydrogel surface can be detected conveniently. Based on this effect, M-hydrogel demonstrates superior sensing performance in advanced sensing applications. Thus, the traditionally disadvantageous viscoelastic property of hydrogels can be transformed into an advantage for sensing, which reveals prospects for hydrogel sensors.

MXenes stretch hydrogel sensor performance to new limits

The rapid development of wearable smart devices has contributed to the enormous demands for smart flexible strain sensors. However, to date, the poor stretchability and sensitivity of conventional metals or inorganic semiconductor-based strain sensors have restricted their application in this field to some extent, and hence many efforts have been devoted to find suitable candidates to overcome these limitations. Recently, novel resistive-type electrically conductive polymer composites (ECPCs)-based strain sensors have attracted attention based on their merits of light weight, flexibility, stretchability, and easy processing, thus showing great potential applications in the fields of human movement detection, artificial muscles, human–machine interfaces, soft robotic skin, etc. For ECPCs-based strain sensors, the conductive filler type and the phase morphology design have important influences on the sensing property. Meanwhile, to achieve a successful application toward wearable devices, several imperative features, including a self-healing capability, superhydrophobicity, and good light transmission, need to be considered. The aim of the present review is to critically review the progress of ECPCs-based strain sensors and to foresee their future development.

Electrically conductive polymer composites for smart flexible strain sensors: a critical review

Soft electronics are intensively studied as the integration of electronics with dynamic nonplanar surfaces has become necessary. Here, a discussion of the strategies in materials innovation and structural design to build soft electronic devices and systems is provided. For each strategy, the presentation focuses on the fundamental materials science and mechanics, and example device applications are highlighted where possible. Finally, perspectives on the key challenges and future directions of this field are presented.

Materials and Structures toward Soft Electronics.

Recent progress on flexible and stretchable piezoresistive strain sensors: From design to application

Progress in achieving high-performance piezoresistive and capacitive flexible pressure sensors: A review

Detection of non-joint areas tiny strain and anti-interference voice recognition by micro-cracked metal thin film

Enormous advancement has been achieved in the field of one-dimensional (1D) semiconductor light-emitting devices (LEDs), however, LEDs based on 1D CdS nanostructures have been rarely reported. The fabrication of CdS@SiO2 core–shell nanorod array LEDs based on a Au–SiO2–CdS metal–insulator–semiconductor (MIS) structure is presented. The MIS LEDs exhibit strong yellow emission with a low threshold voltage of 2.7 V. Electroluminescence with a broad emission ranging from 450 nm to 800 nm and a shoulder peak at 700 nm is observed, which is related to the defects and surface states of the CdS nanorods. The influence of the SiO2 shell thickness on the electroluminescence intensity is systematically investigated. The devices have a high light-emitting spatial resolution of 1.5 μm and maintain an excellent emission property even after shelving at room temperature for at least three months. Moreover, the fabrication process is simple and cost effective and the MIS device could be fabricated on a flexible substrate, which holds great potential for application as a flexible light source. This prototype is expected to open up a new route towards the development of large-scale light-emitting devices with excellent attributes, such as high resolution, low cost, and good stability.

CdS@SiO2 Core-Shell Electroluminescent Nanorod Arrays Based on a Metal-Insulator-Semiconductor Structure.

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Detection of non-joint areas tiny strain and anti-interference voice recognition by micro-cracked metal thin film

CdS@SiO2 Core-Shell Electroluminescent Nanorod Arrays Based on a Metal-Insulator-Semiconductor Structure.