The invention relates to a high heat resistant epoxy resin and a preparation method thereof. The high heat resistant epoxy resin is obtained by curing of epoxy terminated modified oligomeric polyethersulfone and bisphenol A epoxy resin. By introducing the polyether sulfone structure with high heat resistance and good flexibility into the main chain of epoxy resin, the heat resistance and flexibility of the epoxy resin are greatly improved, and the obtained epoxy resin has the characteristics of low viscosity, good heat resistance and high flexibility, and can be widely applied to the field ofcarbon fiber composite materials with high heat resistance and high flexibility requirements.

High heat resistant epoxy resin and preparation method thereof

The invention provides epoxy compositions and a preparation method thereof, in particular to the epoxy compositions suitable for liquid molding. The compositions are prepared from the following components in parts by mass:100 parts of epoxy resin compositions and 40-55 parts of curing agent compositions, wherein the epoxy resin compositions comprise tetrafunctional epoxy resin, trifunctional epoxy resin and difunctional epoxy resin, and the ratio of the tetrafunctional epoxy resin to the trifunctional epoxy resin to the difunctional epoxy resin in parts by mass is (20-50):(20-50):(20-50); the curing agent compositions comprise an aromatic amine curing agent and an accelerant, and the ratio of the aromatic amine curing agent to the accelerant in parts by mass is (95-100):(0-5). The epoxy compositions provided by the invention are liquid, the mixing viscosity is low, and the operability is good.

Epoxy compositions suitable for liquid molding of composite material and preparation method thereof

The invention relates to a bisphenol A epoxy resin and a preparation method thereof, which belong to the field of polymer materials. The bisphenol A epoxy resin comprises the following components: 50to 70 parts by mass of bisphenol A epoxy resin, 15 to 25 parts by mass of a curing agent, and 10 to 20 parts by mass of thermoplastic polyether sulfone. The method comprises the following steps: adding the bisphenol A epoxy resin and thermoplastic polyether sulfone with a formula amount into an organic solvent with the appropriate amount for being mixed, wherein the temperature of a mixed solutionis controlled between 60 DEG C and 75 DEG C, stirring the materials until epoxy resin and thermoplastic polyether sulfone are completely dissolved, adding the aromatic amine curing agent with the formula amount to the above mixed solution, and stirring a mixture until a system is uniformly mixed, stirring the materials for 2.5-3h, pouring the uniformly stirred sample into an opened container andtransferring the material to a vacuum oven, vacuumizing at room temperature until the solvent is completely removed, and obtaining the modified bisphenol A epoxy resin. According to the invention, a bi-continuous phase epoxy resin blend is obtained through relatively simple process conditions, and the prepared bisphenol A epoxy resin modified material has good processability, mechanical properties, heat resistance, and toughness.

Bisphenol A epoxy resin and preparation method thereof

The invention relates to a high temperature-resistant resin matrix and a preparation method thereof, which belong to the field of a high-molecular material. The high temperature-resistant resin matrixcomprises the following raw materials in parts by mass: 65-80 parts of multi-functional epoxy resin, 8-15 parts of a flexibilizer, 10-25 parts of bisphenol-A epoxy resin, 15-30 parts of a curing agent, and 0.1-8 parts of a curing accelerator. The high temperature-resistant resin matrix designed by a formula has excellent manufacturability, a composite material prepared by the resin matrix has excellent performances of high heat resistance, high intensity, high impact strength, and high corrosion resistance, and the preparation method of the resin can avoid the risk of implosion of the multi-functional epoxy resin under high temperature.

High temperature-resistant resin matrix and preparation method thereof

The invention relates to the field of high molecular materials and in particular relates to colored resin and a production method of prepreg. The colored resin is prepared from the following raw materials in parts by weight: an epoxy resin matrix, a compound curing agent, color paste and an auxiliary agent according to the ratio of 100 to (10 to 20) to (5 to 80) to (0 to 50); the raw materials areadded into an iron bucket and are stirred and mixed. Liquid-state colored resin flows into a resin groove composed of two glue spreading rollers and a gap between the glue spreading rollers is adjusted; a fiber enhanced material is introduced between the two glue spreading rollers; the fiber enhanced material is immersed into the resin groove at a certain speed. Or the liquid-state colored resinis placed for 72h at room temperature until the resin is at a semi-solid state; after the formula resin is heated and melted, a certain amount of the resin is coated on one carrier according to specific requirements of the resin content of the prepreg; finally, the carrier coated with the resin is transferred into the fiber enhanced material and is immersed with the fiber enhanced material to formthe prepreg.

Colored resin and production method of prepreg

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Bisphenol A epoxy resin and preparation method thereof

High temperature-resistant resin matrix and preparation method thereof

Colored resin and production method of prepreg