Lee J. Smith
Amkor Technology
12 Papers
333 Citations
Lee J. Smith is an academic researcher from Amkor Technology. The author has contributed to research in topics: Semiconductor package & Wire bonding. The author has an hindex of 9, co-authored 11 publications.
Chat about Author
Papers
Application of through mold via (TMV) as PoP base package
Jinseong Kim,Kiwook Lee,Dongjoo Park,Tae-Kyung Hwang,Kwang Ho Kim,DaeByoung Kang,Jaedong Kim,Choonheung Lee,Christopher M. Scanlan,Christopher J. Berry,Curtis Zwenger,Lee J. Smith,Mahmoud Dreiza,Robert Francis Darveaux +13 more
- 27 May 2008
TL;DR: In this article, a package-on-package (PoP) base package with through mold vias (TMV) is proposed to address the challenges of next generation applications that will require reduced memory interface pitches, higher memory interface pincounts, reduced thickness, tight warpage control and higher levels of integration within the PoP base package.
190
Patent
Method of making a semiconductor package including stacked semiconductor dies
Thomas P. Glenn,Lee J. Smith,David A. Zoba,Kambhampati Ramakrishna,Vincent DiCaprio +4 more
- 20 Aug 2002
TL;DR: In this article, a method for making a semiconductor package with stacked dies that eliminates fracturing of the upper die(s) during the wire bonding process is presented, where a measured quantity of an uncured, fluid adhesive is dispensed onto the top surface of the first die, and the adhesive is squeezed toward the edges of the dies by pressing the bottom surfaces of the second die down onto the adhesive until the two dies are separated by a layer of the adhesive.
87
Patent
Semiconductor package including stacked semiconductor dies and bond wires
Thomas P. Glenn,Lee J. Smith,David A. Zoba,Kambhampati Ramakrishna,Vincent DiCaprio +4 more
- 20 Jul 2000
TL;DR: In this article, a method for making a semiconductor package with stacked dies that eliminates fracturing of the upper die(s) during the wire bonding process is presented, where a measured quantity of an uncured, fluid adhesive is dispensed onto the top surface of the first die, and the adhesive is squeezed toward the edges of the dies by pressing the bottom surfaces of the second die down onto the adhesive until the two dies are separated by a layer of the adhesive.
86
Patent
Ultra thin package and fabrication method
Sukianto Rusli,Ronald Patrick Huemoeller,Bob Shih-Wei Kuo,Lee J. Smith +3 more
- 24 Sep 2008
TL;DR: In this article, a stiffener is formed, the stiffener including via apertures having electrically conductive via aperture sidewalls and an electronic component opening, which is attached to the substrate layer.
74
Patent
Shielding for a semiconductor package
Roger D. St. Amand,Nozad Karim,Joseph Marco Longo,Lee J. Smith,Robert Francis Darveaux,Jong Ok Chun,Jingkun Mao +6 more
- 03 Dec 2008
TL;DR: In this article, a shield spacer having a first and second surface is provided wherein the second surface of the shield is attached to a first surface of a first die and a plurality of wirebonds are attached to the shield and to the substrate.
23