: This report presents the results of a study to develop quantitative and qualitative techniques for planning, monitoring and evaluating stress screening programs during electronic equipment development and production A screening and debugging optimization (SDO) model developed on a prior study, RADC-TR-78-55, was revised to include current thermal cycling and vibration screening experience and an adaptive feature was added to allow stress screening program changes based on screening results

Stress screening of electronic hardware

Environmental‐Stress Screening

This paper describes qualitative and quantitative techniques for planning, monitoring, and evaluating stress screening programs. The techniques were developed under a recent study for the Rome Air Development Center. A model for use by reliability managers to aid in planning and evaluating stress-screening programs is presented. Guidelines are outlined for determining the applicability of screens to different equipment types and for selecting the proper level of assembly at which to apply the screens. An example of how the techniques are applied to a production screening program is provided. While stress screening is now widely employed throughout the defense industry and many experiments and studies on the subject have been conducted, the precise information needed to plan an optimum production stress screening program is still unavailable. Planning must rely on sound judgment and available data from experience. With the proper selection and placement of screens the stress-screening model is a useful tool in screen parameter selection and in providing a quantitative anticipation of screen results. A comparison of actual and anticipated results allows an evaluation of initial assumptions regarding the initial quantity of defective parts, the number of induced defects, and the true screening strength. Consistent differences between actual and anticipated results serve as the basis for altering the screening parameters and maintaining the most effective screening for the resources invested.

Planning of Production Reliability Stress-Screening Programs

Die Aktivitaten zur Qualitats- und Zuverlassigkeitssicherung mussen auch in der Fertigungsphase weitergefuhrt werden. Schwerpunkte bilden hier die Uberwachung und Steuerung der Konfiguration und der Fertigungsprozesse bzw. -ablaufe, die Durchfuhrung von Zwischen- und Endprufungen, die Vorbehandlung der kritischen Bauteile und Baugruppen sowie die systematische Erfassung, Analyse und Korrektur der auftretenden Fehler und Ausfalle. Die letzgenannte Masnahme lost einen Lernprozes aus, der unter Berucksichtigung der Kosten und Termine zur optimalen Verbesserung der Qualitat und der Zuverlassigkeit fuhrt. In diesem Kapitel wird zuerst auf die allgemeinen Masnahmen zur Qualitats- und Zuverlassigkeitssicherung in der Fertigungsphase eingegangen. Danach werden Moglichkeiten und Grenzen der Prufung und Vorbehandlung von Bauteilen und bestuckten Leiterplatten behandelt. Entsprechende Strategien werden vorgestellt, und die Optimierung des Pruf- und Vorbehandlungsaufwands im Rahmen einer Eingangsprufung wird untersucht. Modelle fur die Analyse des Zuverlassigkeitszuwachses in der Fertigungsphase schliessen dieses Kapitel.

Hebung der Qualität und der Zuverlässigkeit in der Fertigungsphase

: This report presents the results of a quantitative investigation into the optimum selection of screening and debugging methods for the purpose of removing defects, and hence improving reliability, throughout the development process. A computerized optimization model has been developed which can be used to address three problem areas; (1) Select an optimum sequence of screens for a fixed dollar expenditure, (2) Select a sequence of screens which minimizes costs in the face of a fixed desired reliability improvement, and (3) Provide quantitative for performing screening/debugging tradeoffs. In order to implement the model it was necessary to obtain data to compute test strengths and test costs. The model includes four assembly levels, five types of screens (temperature cycling constant temperature, vibration constant power and power cycling), provides for introduction of defects at each assembly level and includes the rework cycle.

Electronic Equipment Screening and Debugging Techniques

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Electronic Equipment Screening and Debugging Techniques