Kiwook Lee
Amkor Technology
14 Papers
86 Citations
Kiwook Lee is an academic researcher from Amkor Technology. The author has contributed to research in topics: Kirkendall effect & Electromigration. The author has an hindex of 8, co-authored 14 publications.
Chat about Author
Papers
Application of through mold via (TMV) as PoP base package
Jinseong Kim,Kiwook Lee,Dongjoo Park,Tae-Kyung Hwang,Kwang Ho Kim,DaeByoung Kang,Jaedong Kim,Choonheung Lee,Christopher M. Scanlan,Christopher J. Berry,Curtis Zwenger,Lee J. Smith,Mahmoud Dreiza,Robert Francis Darveaux +13 more
- 27 May 2008
TL;DR: In this article, a package-on-package (PoP) base package with through mold vias (TMV) is proposed to address the challenges of next generation applications that will require reduced memory interface pitches, higher memory interface pincounts, reduced thickness, tight warpage control and higher levels of integration within the PoP base package.
190
Temperature Effect on Intermetallic Compound Growth Kinetics of Cu Pillar/Sn Bumps
TL;DR: In this paper, the in-situ intermetallic compound (IMC) growth in Cu pillar/sn bumps was investigated by isothermal annealing at 120°C, 150°C and 180°C using an in situ scanning electron microscope.
80
Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps
Myeong-Hyeok Jeong,Gi-Tae Lim,Byoung-Joon Kim,Kiwook Lee,Jaedong Kim,Young-Chang Joo,Young-Bae Park +6 more
TL;DR: In this article, thermal annealing and electromigration tests were performed with Cu pillar/Sn bumps to understand the growth mechanism of intermetallic compounds (IMCs). Annealing tests were carried out at both 100°C and 150°C.
25
Effect of isothermal aging on intermetallic compounds and Kirkendall void growth kinetics of Au stud bumps
TL;DR: In this paper, the Kirkendall void growth kinetics at various interfaces in Au stud bumps were studied in terms of isothermal aging at 120, 150, and 180 °C for 300 h.
17
Intermetallic compound and Kirkendall void growth in Cu pillar bump during annealing and current stressing
Byoung-Joon Kim,Gi-Tae Lim,Jaedong Kim,Kiwook Lee,Young-Bae Park,Young-Chang Joo +5 more
- 27 May 2008
TL;DR: In this paper, annealing of the Cu pillar bump with eutectic SnPb was performed and the micro structures were observed by scanning electron microscopy, and the activation energies of Cu6Sn5, Cu3Sn, and Kirkendall void growth were 1.77, 0.72, and 0.36 eV respectively.
15