Ke Duan
5 Papers
Ke Duan is an academic researcher. The author has contributed to research in topics: Medicine & Metamaterial. The author has an hindex of 2, co-authored 4 publications.
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Papers
Three Dimensional Printing of Bioinspired Crossed-Lamellar Metamaterials with Superior Toughness for Syntactic Foam Substitution.
Hao Wu,Juzheng Chen,Ke Duan,Meng Zhu,Yuan Hou,Jingzhuo Zhou,Yukun Ren,Hongyuan Jiang,Rong Fan,Yang Lu +9 more
TL;DR: In this article , a novel bioinspired design strategy that combines regional particularity and overall cyclicity is proposed to innovate the connotation of long-range periodicity inside the metamaterial, in which the node constraint gradient and crossed-lamellar struts corresponding to the core features of conch shells are able to guide the deformation sequence with a self-strengthening response during compression.
17
Synergistic toughening on CFRP via in-depth stitched CNTs
TL;DR: In this article , a hierarchical structure for CFRP composites is proposed, within which carbon nanotubes (CNTs) in-depth stitched into the nano-channel between neighboring carbon fibers at the interlaminar region.
14
Gradient evolution in graphene reinforced carbon/carbon composites
TL;DR: Graphene-guided carbonization is an effective route to achieve carbon-reinforcement/carbon matrix composites with high mechanical performance at lower energy consumption, due to the reduced anneal temperatures required as mentioned in this paper .
8
In-situ interface characterization of mesophase pitch-based carbon fiber/epoxy composites
Xiaoran Wei,Hongbin Zhang,Jianzheng Cui,Jun Liu,Jiajia Cheng,Huang Wu,Chong Ye,Jinshui Yang,Jianwei Zhang,Suli Xing,Yonglyu He,Ke Duan +11 more
- 01 Dec 2025
Deep Elastic Strain Engineering of 2D Materials and Their Twisted Bilayers.
TL;DR: In this article , the authors demonstrated that ultralarge, uniform elastic strain in free-standing 2D monolayers can permit deep elastic strain engineering (DESE), which can result in fundamentally changed electronic and optoelectronic properties for unconventional device applications.