Karen Maex
Katholieke Universiteit Leuven
506 Papers
5.6K Citations
Karen Maex is an academic researcher from Katholieke Universiteit Leuven. The author has contributed to research in topics: Silicide & Dielectric. The author has an hindex of 49, co-authored 505 publications. Previous affiliations of Karen Maex include Catholic University of Leuven & IMEC.
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Papers
Integration of unlanded via in a non-etchback SOG direct-on-metal approach in 0.25 micron CMOS process
Teng Gao,Bart Coenegrachts,Joost Waeterloos,G. Beyer,H. Meynen,M. A. Van Hove,Karen Maex +6 more
- 01 Jun 1998
TL;DR: In this paper, a novel approach of via integration with nonetchback (NEB) SOG is investigated to improve performance of unlanded vias, which is a serious problem if zero-overlap metal lines are used.
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Mechanisms of arsenic segregation to the Ni2Si/SiO2 interface during Ni2Si formation
M. A. Pawlak,Tom Janssens,A. Lauwers,André Vantomme,Wilfried Vandervorst,Karen Maex,Jorge A. Kittl +6 more
TL;DR: In this article, the authors investigated the mechanisms of dopant redistribution during Ni2Si formation on polycrystalline Si∕SiO2 and amorphous SiO2 stacks on (100) Si by secondary ion mass spectroscopy measurements.
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Measurements of trace gaseous ambient impurities on an atmospheric pressure rapid thermal processor
TL;DR: In this paper, atmospheric ionization mass spectrometry (APIMS) was used to detect trace impurities in nitrogen ambient in the chamber of an atmospheric pressure rapid thermal processor, which allowed real-time monitoring of impurities during rapid thermal annealing.
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New closed-form formula for frequency-dependent resistance and inductance of IC interconnects on silicon substrate
TL;DR: In this article, a closed-form approximation of frequency-dependent mutual impedance per unit length of lossy silicon substrate coplanar-strip IC interconnects is developed based on a quasi-stationary full-wave analysis and Fourier integral transformation.
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Impact of LKD5109 TM low- k to cap/liner interfaces in single damascene process and performance
Francesca Iacopi,M. Patz,I. Vos,Zs. Tokei,B. Sijmus,Quoc Toan Le,Erik Sleeckx,B. Eyckens,Herbert Struyf,A. Das,Karen Maex +10 more
TL;DR: In this paper, the importance of interface quality in the single damascene integration process of LKD5109TM porous low-k films is investigated, and a strong correlation is observed between chemical mechanical planarization (CMP) performance and interfacial fracture energies.
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