Signal Integrity Simplified

Electromagnetic interference (EMI) in non-isolated power converters is regulated by extensive standards in many applications. EMI modeling and reduction research is key to develop solutions to achieve EMI compliance. For conducted EMI, there are lots of techniques to analyze noise sources, propagation paths, parasitic couplings, and so on, which are summarized in this survey. Fundamental and general techniques to investigate and to reduce conducted EMI are analyzed. Moreover, in the high switching frequency era and with increasing applications of wide bandgap devices, radiated EMI is becoming an inevitable challenge. Modeling and reduction of radiated EMI, therefore, is becoming an important topic. Recent advances in radiated EMI research for non-isolated power converters are summarized and analyzed. Future EMI research development is discussed.

Advances in Modeling and Reduction of Conducted and Radiated EMI in Non-isolated Power Converters

A fast and general partial element equivalent circuit (PEEC) method based on the fast Fourier transform (FFT) is proposed for the first time. The numerical tool only requires common CAD data input files (e.g., <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$.\text{stl}$</tex-math></inline-formula> format), then the discretization process is performed automatically by means of a fast voxelization technique based on ray intersection, thus, drastically reducing the human effort required to setup the model. The method allows for considering at the same time inductive and capacitive effects, and is focused on power electronics applications where propagation effects can be neglected, whereas all the other electromagnetic phenomena are considered. Specifically, the proposed method is particularly suited for problems where both electric and magnetic fields are equally important and, therefore, quasistatic approximations do not apply. An ad-hoc preconditioner which significantly speeds-up the solver is also proposed and, thanks to the FFT, both memory and computation time are significantly reduced, without the need of applying data compression. Both linear and nonlinear materials are considered by the proposed FFT-PEEC method. Sample implementation of the method is made publicly available. 

/pdf/fft-peec-a-fast-tool-from-cad-to-power-electronics-17676wlz.pdf

FFT-PEEC: A Fast Tool From CAD to Power Electronics Simulations

This article investigates the radiated electromagnetic interference (EMI) due to the voltage between input and output cables in a non-isolated power converter. The radiated EMI model of a non-isolated power converter is first developed and quantified based on the circuit topologies, printed circuit board (PCB) parasitics, switching waveforms, and transfer functions. Second, an antenna model is developed for converter cables based on the antenna impedance and the antenna transfer function. Third, a complete radiated EMI model is developed based on the converter&#x0027;s EMI model and the cable&#x0027;s antenna model. Fourth, the radiated EMI is analyzed based on the developed model. Finally, two radiated EMI noise reduction techniques, optimizing PCB layout and adding a cross capacitor, are proposed. The developed radiated EMI model and the proposed radiated EMI reduction techniques are verified with both simulations and experiments. The techniques are also extended to other two non-isolated power converter topologies when the radiated EMI is caused by the voltage between the input and output cables. 

Modeling, Analysis, and Reduction of Radiated EMI Due to the Voltage Across Input and Output Cables in an Automotive Non-Isolated Power Converter

The automatic layout design offers the potential to find out the optimal configuration of power packaging more quickly. However, its development is restrained substantially by the velocity and accuracy of the extraction of the parasitics, which increases the overshooting voltages and switching losses of the power device. In this paper, the "current-bunch" is defined to characterize the transient current distribution in the power packaging. The mathematical models are created to estimate the parasitics with the current-bunch concept. As a result, the parasitics of the power packaging can be extracted quickly and accurately by using the separated current bunches. Besides, the proposed current-bunch enables the optimal layout of power packaging to reduce parasitics. Compared with the traditional finite-element method and boundary element method, comprehensive assessments are presented to confirm the timesaving, efficiency, and accuracy advancements of the proposed current-bunch approach. With the aid of the proposed current-bunch approach, the layout of a multi-chip and multi-terminal power module is optimized, and the parasitics are reduced by 23.4%. The current-bunch is confirmed as an effective tool to boost the automated design of the next-generation power packaging.

Current-Bunch: A Fast and Accurate Tool to Extract and Optimize Parasitics of Power Packaging

Research on electromagnetic interference of high-frequency power converters remains a challenging and important topic, particularly in light of rapidly emerging wide band-gap power devices operating with ns level turn- on /turn- off times. Building on the substantial contributions that have been made on the formation mechanisms of common mode (CM) radiation, a new mechanism for an equivalent CM driving voltage source caused by imbalanced conductors or components is proposed. Applying this mechanism, the CM driving voltage source model of a nonisolated boost dc/dc power converter with input/output cables is introduced. The CM far-field electric strength algorithms of an asymmetric cable antenna are theoretically analyzed and derived in detail. Subsequently, a prototype for a low-power 30-MHz very-high-frequency boost power converter based on gallium nitride is built and its 10-m CM far-field radiation strength is predicted according to the proposed model. The radiation pattern characteristics are analyzed and several radiation suppression methods are also designed. The comparison with the measured radiation results shows that the proposed CM radiation model and the prediction method achieve good effect below 300 MHz.

Mechanism Model and Prediction Method of Common Mode Radiation for a Nonisolated Very-High-Frequency DC–DC Converter With Cables

Broadband circuit models and their parameters of passive components are an important part of the functional design and electromagnetic compatibility analysis of power electronic devices. In this article, we propose a novel concise physical lumped-parameter extraction method for the construction of effective broadband circuit models for printed circuit board inductive components. The method is based on PEEC theory and generalized eigenvalue theory. The frequency domain port impedance characteristics are kept as equal as possible during circuit model transformation processes. A partial equivalent element circuit (PEEC) model of a three-dimensional PCB inductive component with a large number of nodes is first of all introduced. This includes conductors and PCB dielectrics. Then, its port impedance matrix formula is deduced. After this, the polynomial form of the port impedance matrix and the circuit model order reduction method are presented in detail. We report on the construction of two typical coreless PCB planar components, a spiral planar inductor and a coreless planar transformer, whose broadband physical circuit models and parameters were extracted using the proposed method. The results of tests with these two planar components confirmed the validity of their models for a frequency range of up to 500 MHz.

A PEEC-Based Concise Broadband Physical Circuit Modeling Method With Parameter Extraction for PCB Inductive Components

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Mechanism Model and Prediction Method of Common Mode Radiation for a Nonisolated Very-High-Frequency DC–DC Converter With Cables

A PEEC-Based Concise Broadband Physical Circuit Modeling Method With Parameter Extraction for PCB Inductive Components