23 Papers
13 Citations
Jun Ma is an academic researcher from University of Illinois at Urbana–Champaign. The author has contributed to research in topics: Silicon & Thermal conductivity. The author has an hindex of 10, co-authored 23 publications. Previous affiliations of Jun Ma include Applied Materials.
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Papers
Flexible and Stretchable 3ω Sensors for Thermal Characterization of Human Skin
Limei Tian,Yuhang Li,Richard Chad Webb,Siddharth Krishnan,Zuguang Bian,Jizhou Song,Xin Ning,Kaitlyn E. Crawford,Jonas Kurniawan,Andrew P. Bonifas,Jun Ma,Yuhao Liu,Xu Xie,Jin Chen,Yuting Liu,Zhan Shi,Tianqi Wu,Rui Ning,Daizhen Li,Sanjiv Sinha,David G. Cahill,Yonggang Huang,John A. Rogers +22 more
TL;DR: In this article, a soft, stretchable thermal sensor based on the so-called three omega (i, 3ω) method is introduced for accurate characterization of the thermal conductivity and diffusivity of materials systems, such as the skin, which can be challenging to measure using established techniques.
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Ultralow Thermal Conductivity in Nanoporous Crystalline Fe3O4
Jin Gu Kang,Jin Gu Kang,Hyejin Jang,Hyejin Jang,Jun Ma,Qun Yang,Khalid Hattar,Zhu Diao,Renliang Yuan,Jian-Min Zuo,Sanjiv Sinha,David G. Cahill,Paul V. Braun +12 more
TL;DR: While there is no known fundamental lower limit to the thermal conductivity of a material, the lowest thermal conductivities are typically found in amorphous and strongly disordered materials.
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Hydrophobic recovery in ultrathin PDMS-coated long and short silicon nanowires
TL;DR: In this article, a simple and stable plasma treatment of polydimethylsiloxane (PDMS) on silicon nanowires (NWs) was used to modify the contact angle of water on silicon.
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Sensors: Flexible and Stretchable 3ω Sensors for Thermal Characterization of Human Skin (Adv. Funct. Mater. 26/2017)
Limei Tian,Yuhang Li,Richard Chad Webb,Siddharth Krishnan,Zuguang Bian,Jizhou Song,Xin Ning,Kaitlyn E. Crawford,Jonas Kurniawan,Andrew P. Bonifas,Jun Ma,Yuhao Liu,Xu Xie,Jin Chen,Yuting Liu,Zhan Shi,Tianqi Wu,Rui Ning,Daizhen Li,Sanjiv Sinha,David G. Cahill,Yonggang Huang,John A. Rogers +22 more
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Peak thermoelectric power factor of holey silicon films
TL;DR: In this paper, the authors show that at neck distances between 120 - 230 nm, the power factor at optimal doping is roughly 50 percent that of the bulk at comparable doping, which is consistent with loss of phonon drag.
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