Cu–Al–Ni alloys are one class of typical precipitation strengthening alloy, its mechanical properties are highly sensitive to temperature and strain. In this work, the strength-ductility cooperative effect is investigated through a thermomechanical treatment, i.e., unidirectional cold rolling, Split-Hopkinson-Pressure-Bar deformation, and aging treatment. The results show that a large number of dislocations and twin structures are introduced during Split-Hopkinson-Pressure-Bar deformation motivated by the high strain rate (2.5×103s−1). When the treatment temperature is slightly lower than the elongation peak (∼28.66%, which almost surpasses all existing Cu–Al–Ni alloys) aging temperature, a high strength (∼797.06 MPa) is also achieved. The strength-ductility optimization process mainly includes two mechanisms, twining/grain boundaries optimization, and second-phases optimization, which are closely related to dislocations movement and can contribute together without conflict. In addition, a phase-field-crystal method is used to dynamically display the interaction between twins and dislocations. Finally, the typical characteristics of this kind of high strength-ductility copper alloys are proposed, namely, small grain size, high twin density, and stable grain boundary, providing more space for the cooperative improvement of strength and ductility in Cu alloys. 

Cooperative effect of strength and ductility processed by thermomechanical treatment for Cu–Al–Ni alloy

An insight into dynamic properties of SAC305 lead-free solder under high strain rates and high temperatures

Effect of Y addition on microstructure evolution and precipitation of Cu-Co-Si alloy during hot deformation

Stainless steel 316L alloy with a complete austenite phase was manufactured using the Laser Engineered Net Shaping (LENS) technique. The microstructure of LENS-316L from the sub-millimeter to nanometer domains was analyzed using multi-scale characterization methods. The dynamic behavior of LENS-316L was studied by the Split Hopkinson Pressure Bar (SHPB) test. In this study, the dominating strengthening mechanism of the microstructure in LENS-316L was the dislocation strengthening mechanism, providing approximately 153 MPa. The molten pool deforms significantly after the material was dynamically compressed. When the strain rate reached 5000 s −1 , the material exhibited an adiabatic shear phenomenon and formed adiabatic shear bands. The width of the shear band decreased with the increase in the strain rate. When the strain rate increases from 3000 s −1 to 4000 s −1 , the dislocation density increases, the number of twins increases, and the twin thickness decreases. The effect of varying strain rates (3000, 4000, 5000, 6000 s −1 ) and varying temperatures (20, 150, 272, 450, 620 °C), on the stress–strain curves of the material were studied through the SHPB test. Additionally, the traditional Johnson–Cook (JC) constitutive model was modified. The modified constitutive model considers the effects of the strain rate and temperature softening coefficients in the strain hardening stage to predict the mechanical behavior of LENS-316L at high temperature and strain rates. Model predictions were in agreement with the experimental data. This study provides important insights for applying the LENS-316L complex construction in a dynamic load impact environment. • The microstructure strengthening mechanism of 316L manufactured by LENS technology is revealed. • The multi-scale research method is used to analyze the effect of strain rate on the microstructure evolution of LENS-316L. • The effects of high temperature and high strain rate on the dynamic mechanical properties of LENS-316L were studied. • A new constitutive model is established to predict the dynamic mechanical behavior of LENS-316L. 

Mechanical properties and microstructure evolution of additive manufactured 316L stainless steel under dynamic loading

Simple optimization for strength and conductivity of Cu-Ni-Si alloy with discontinuous precipitation

Effects of strain rates on dynamic deformation behavior of Cu-20Ag alloy

Wire bonding is still the most popular chip interconnect technology in microelectronic packaging and will not be replaced by other interconnect methods for a long time in the future. Au bonding wire has been a mainstream semiconductor packaging material for many decades due to its unique chemical stability, reliable manufacturing, and operation properties. However, the drastic increasing price of Au bonding wire has motivated the industry to search for alternate bonding materials for use in microelectronic packaging such as Cu and Ag bonding wires. The main benefits of using Cu bonding wire over Au bonding wire are lower material cost, higher electrical and thermal conductivity that enables smaller diameter Cu bonding wire to carry identical current as an Au bonding wire without overheating, and lower reaction rates between Cu and Al that serve to improve the reliability performance in long periods of high temperature storage conditions. However, the high hardness, easy oxidation, and complex bonding process of Cu bonding wire make it not the best alternative for Au bonding wire. Therefore, Ag bonding wire as a new alternative with potential application comes to the packaging market; it has higher thermal conductivity and lower electric resistivity in comparison with Cu bonding wire, which makes it a good candidate for power electronics, and higher elastic modulus and hardness than Au bonding wire, but lower than Cu bonding wire, which makes it easier to bond. This paper begins with a brief introduction about the developing history of bonding wires. Next, manufacturability and reliability of Au, Cu, and Ag bonding wires are introduced. Furthermore, general comparisons on basic performance and applications between the three types of bonding wires are discussed. In the end, developing trends of bonding wire are provided. Hopefully, this review can be regarded as a useful complement to other reviews on wire bonding technology and applications.

Research Progress on Bonding Wire for Microelectronic Packaging

This study deals with the evolution of strength and microstructure in Cu–20Ag alloy during wire drawing from an initial diameter of 7.84 mm–0.02 mm. The final wire had a strength of 1670 MPa and 53.8% of the conductivity of international annealed copper standard (IACS). Electron backscattering diffraction (EBSD) and transmission electron microscope (TEM) were used for microstructural characterization in the later stages of deformation, we found that many boundaries resulting from the lamellar structures and the occurrence of nano-twins formed in the lamellar improved the strength of the wire. When the wire diameter is less than 2.95 mm，with an essentially constant dislocation density, the strength can be related solely to strengthening boundaries by a grain size refinement. The strengthening mechanism of the wire during cumulative strain is discussed. 

Strengthening mechanism of ultra-high strength Cu–20Ag alloy wire induced by cumulative strain

Abstract In this paper, the Cu-0.52Ag-0.22Cr alloy was prepared by hot horizontal continuous casting. The effects of aging process on micro-hardness, electrical conductivity, and nanoscale precipitates of Cu-0.52Ag-0.22Cr alloy were studied. The electrical conductivity and micro-hardness increase significantly in the early aging time. With the extension of aging time, the electrical conductivity is basically unchanged and remains at a high level. While, the micro-hardness increases slowly, the change trend is different at 623 K, 723 K, and 773 K. The optimisation of process parameters occurs in 723 K for 2 h. At this time, the electric conductivity is 95.8% IACS and the hardness is 104.1 HV0.1. The XRD result shows that the Ag and Cr are precipitated in elemental form copper matrix. Further TEM shows that, Cr exists at the sub-boundary in the form of larger nanoscale precipitates (100-200 nm). While a large number of Ag nanoscale precipitates (8-10 nm) is dispersed on the copper matrix. The synergistic effect of Ag and Cr nanoscale precipitates significantly improved the properties of the alloy.

/pdf/effect-of-aging-on-properties-and-nanoscale-precipitates-of-2kf3es8foh.pdf

Effect of aging on properties and nanoscale precipitates of Cu-Ag-Cr alloy

This paper provides a comprehensive review on copper (Cu) wire bonding. Firstly, it introduces the common types of Cu wire available in the market, including bare Cu wire, coated Cu wire, insulated Cu wire, and alloyed Cu wire. For each type, their characteristics and application areas are discussed. Additionally, we provide detailed insights into the impact of Free Air Ball (FAB) morphology on bonding reliability, including its effect on bond strength and formation mechanisms. Next, the reliability of Cu wire bonding is analyzed, with a focus on the impact of intermetallic compounds and corrosion on bonding reliability. Specifically, the formation, growth, and stability of intermetallic compounds at bonding interfaces are discussed, and their effects on bonding strength and reliability are evaluated. The detrimental mechanisms of corrosion on Cu wire bonding and corrosion inhibition methods are also analyzed. Subsequently, the applications of simulation in Cu wire bonding are presented, including finite element analysis and molecular dynamics simulations, which provide important tools for a deeper understanding of the bonding process and failure mechanisms. Finally, the current development status of Cu wire bonding is summarized, and future research directions are discussed.

Copper Wire Bonding: A Review

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