Bisphenol A diglycidylether (DGEBA) based low viscosity, liquid epoxy resins are widely used as basis for advanced polymers and nanocomposites, adhesives, protective coatings and encapsulation. We present “green” synthesis of nano-SiO2/epoxy polymer hybrids by a two-step chronological polymerization of inorganic and organic monomers without the use of diluents (solvents). Two types of liquid epoxy resins, D.E.R. 330 and D.E.R. 332, are used to demonstrate the influence of resin viscosity on microstructure, tensile strength and thermal stability of resulting hybrids. Obviously, differences in viscosity of two epoxy resins originate from variations in respective chain lengths, i.e. molar mass, which affect the overall crosslink density and properties of hybrids. In addition, grafting of nano-SiO2 phases with organosilane is performed to achieve inorganic–organic (IO) phase interlinking and to investigate its consequences. Nano-SiO2/epoxy hybrids are characterized by FTIR spectroscopy and XPS. AFM is used to study microstructure and surface properties of hybrids. AFM images show good distribution of nano-SiO2 phases within epoxy polymer. It is observed that the size of nano-SiO2 grows significantly, if resin viscosity is increased or if covalent IO phase interlinks are not present. Tensile measurements show considerable improvement in strength and modulus of nano-SiO2/epoxy polymer hybrids as compared to neat epoxy polymers. DSC and TGA also demonstrate an increase in glass transition temperature (Tg) and thermal stability. We observe that viscosity effects are evenly pronounced in solventless processing of nano-SiO2/epoxy polymer hybrids, and small changes in resin viscosity influence the miscibility of IO phases, the dispersion of SiO2 and the performance of resulting hybrids.

Exploring resin viscosity effects in solventless processing of nano-SiO2/epoxy polymer hybrids

New interconnection materials are always necessary as a result of evolving packaging technologies and increasing performance and environmental demands on electronic systems. In particular, anisotropic conductive adhesives (ACAs) have gained popularity as a potential replacement for solder interconnects. Despite numerous benefits, ACA-type packages pose several reliability problems. During the last 10 years, tremendous research and development efforts have been spent on improving the reliability of ACA joints. In this paper, the effects of the bonding process (including the bonding temperature, bonding pressure, curing conditions and reflow processes) on the reliability of ACA joints are presented. Then the effects of the environmental factors (including high temperature, humidity, thermal cycling, impact load, etc.) on the reliability of ACA joints are discussed. Finally, the effects of the properties of the components (including properties of substrates, ACAs, conductive particles and the bump height) on...

Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications

ing and non-profit use of the material is permitted with credit to the source. Statements and opinions expressed in the chapters are these of the individual contributors and not necessarily those of the editors or publisher. No responsibility is accepted for the accuracy of information contained in the published articles. Publisher assumes no responsibility liability for any damage or injury to persons or property arising out of the use of any materials, instructions, methods or ideas contained inside. After this work has been published by the In-Teh, authors have the right to republish it, in whole or part, in any publication of which they are an author or editor, and the make other personal use of the work.

/pdf/new-developments-in-liquid-crystals-44vqpqt5yh.pdf

New Developments in Liquid Crystals

Shear strength of anisotropic conductive adhesive joints under hygrothermal aging and thermal cycling

Small angle X-ray scattering measurements were performed on epoxies to determine their network structure. To provide the necessary scattering contrast the epoxy monomer used was a partially brominated diglycidyl ether of bisphenol A and the cross-linking agents were linear, low polydispersity, amine terminated poly(propylene oxide)s. Samples with both single and bimodal molecular weight distributions of cross-linking agent were prepared. A pronounced scattering maximum was observed in all networks and it can be interpreted in terms of correlation holes. Networks cured with a mixture of two cross-linking agents with different molecular weights, i.e. bimodal networks, exhibited scattering maxima at significantly lower scattering vector (q) than was observed for any single amine networks. In model bimodal epoxy graft copolymers with nearly identical chemical structure as the networks the shift to low q was barely perceptible. Experimental results from both epoxies and model graft copolymers are compared to a model calculation in order to establish a methodology to reduce molecular structure information from X-ray results.

/pdf/network-structure-of-bimodal-epoxies-a-small-angle-x-ray-2ddis5nxj2.pdf

Network Structure of Bimodal Epoxies - a Small Angle X-Ray Scattering Study | NIST

The effects of the functionality of an epoxy monomer on the composite properties and reliability of anisotropic conductive films (ACFs) in a flip-chip package were investigated. Three epoxy monomers with different functionalities (f=2–4) were considered. The ACFs prepared using epoxy monomers with higher functionality resulted in lower molecular weight between crosslinks (Mc). As the Mc decreased, the elastic modulus (E′) and coefficient of thermal expansion (CTE) were improved. These results were highly consistent with the rubber elasticity theory. The reliability performance of the flip chip on organic substrate assemblies using ACFs were also investigated as a function of epoxy functionality. The ACFs prepared by using higher functional epoxy monomers showed improved reliability performance.

Effects of Epoxy Functionality on the Properties and Reliability of the Anisotropic Conductive Films for Flip Chips on Organic Substrates

Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application

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Effects of Epoxy Functionality on the Properties and Reliability of the Anisotropic Conductive Films for Flip Chips on Organic Substrates

Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application