This work describes a FAst Novel Thermal Analysis Simulation Tool for Integrated Circuits (FANTASTIC), which is fully automated and relies on an enhanced version of the Multi-Point Moment Matching algorithm. The tool provides a novel equivalent network suitable for use in SPICE-like circuit simulators to perform efficient thermal and electrothermal analyses. FANTASTIC requires much less CPU time and memory storage compared to commercial simulators. The thermal behavior of a state-of-the-art four-finger GaAs HBT is investigated as a case-study.

FAst Novel Thermal Analysis Simulation Tool for Integrated Circuits (FANTASTIC)

Integrated power electronics modules (IPEMs) represent an innovative typology of power electronics assemblies able to guarantee several advantages such as increasing of power density, better management of the thermal flows, and a significant reduction of the package sizes. Their characteristics make them suitable for applications like motor drives or power conditioning. IPEM usage in emerging fields like hybrid automotive traction and electric generation from renewable energy sources is continuously increasing. In this paper, we describe the implementation of a devised flow to generate the layer-based electrothermal PSpice model of an IPEM and the simulation flow of the model. The proposed modeling methodology allows reducing an electrothermal multidomain problem to an electrical single one. The general PSpice-like nature of the proposed model makes it suitable for a wide range of simulation frameworks where the integration of heterogeneous multiphysics models could be a difficult task. The outlining of both electrical and thermal PSpice layers is discussed, and the implementation into the final model, by the assistance of custom electronic-design-automation flow, is presented. Moreover, we describe the validation procedure of the proposed approach, and the results are compared with the ones obtained by a commercial finite-element-based package used as a benchmark. Two simulation approaches related to specific conversion systems, and related issues, are presented and discussed.

Electrothermal PSpice Modeling and Simulation of Power Modules

Heatsink design is critical for power density and reliability enhancement of power semiconductor modules. In this letter, an automated design and optimization methodology for air-cooled heatsinks are proposed based on genetic algorithm and finite element analysis. While the genetic algorithm generates a population of candidates with complex heatsink cross-section geometry in each iteration, finite element analysis is used to evaluate the fitness function of individual heatsink, i.e., junction temperature of semiconductor devices. With the rule of “survival of the fittest,” the proposed methodology eventually converges to an optimum heatsink design with the lowest device junction temperature. The optimized heatsink is fabricated through three-dimensional printing technology for thermal performance evaluation. Simulation and experimental evaluations have been conducted based on a 50-kW three-phase air-cooled inverter with the fabricated heatsinks. The comparative evaluation results show that the optimized heatsink is superior over a customized solution by 27% less in size and 6% lower in junction temperature.

Automated Heatsink Optimization for Air-Cooled Power Semiconductor Modules

A novel matrix reduction method for the efficient and automatic construction of boundary condition independent dynamic compact thermal models having a chosen accuracy, is proposed. The method is implemented in a code which allows constructing boundary condition independent dynamic compact thermal models of any multi-die package modeled within a 3-D commercial mesher. The proposed approach has many advantages with respect to previous approaches in terms of robustness, efficiency, and applicability. The method is validated through the analysis of a dual-flat no-leads 12-leads package.

Matrix reduction tool for creating boundary condition independent dynamic compact thermal models

It is shown how the objective function optimization approach fails in the construction of boundary condition independent compact thermal models of complex Systems On Silicon in which more than two powers are allowed to arbitrarily change. For such applications a novel matrix reduction approach is shown to lead to the efficient construction of accurate boundary condition independent compact thermal models whichever is the number of independent heat sources. Such matrix reduction approach is implemented in the FANTASTIC BCI software tool which is allow to analyze state-of-the art industrial applications.

Why matrix reduction is better than objective function based optimization in compact thermal model creation

Thermal measurement and modeling of multi-die packages became a hot topic recently in different fields like RAM chip packaging or LEDs / LED assemblies, resulting in vertical (stacked) and lateral arrangement. In our present study we show results for a mixed arrangement: an opto-coupler device has been investigated with 4 chips in lateral as well as vertical arrangement. In this paper we give an overview of measurement and modeling techniques and results for stacked and MCM structures, describe our present measurement results together with our structure function based methodology of validating the detailed model of the package being studied. Also, we show how to derive junction-to-pin thermal resistances with a technique using structure functions.

https://hal.archives-ouvertes.fr/hal-00171396/document

Thermal measurement and modeling of multi-die packages

One or more portions of the design (e.g., components, channels, or portions thereof) can be assigned instances of one or more component power domains (CPDs). Assigning an instance of a CPD to a design element (or to a portion thereof) can indicate, for example, whether the element can be switched on and off, or whether the element can operate over a range of voltages. The CPD instances can, in turn, be assigned to one or more design power domains (DPDs). Assignments of a CPD to a DPD can be evaluated according to a set of compatibility rules. Two or more electronic design elements can be connected by one or more signal paths. Organizing the CPD instances into DPDs can aid in finding signal paths that cross from a first DPD to a second DPD. To improve the reliability of signal paths traversing a DPD boundary, one or more power domain interface (PDI) components can be created to handle the signal paths at the boundary.

Automating power domains in electronic design automation

This article outlines a study to evaluate the feasibility and accuracy of using computational fluid dynamics techniques to numerically determine the loss coefficients for duct fittings. The success of the study may eliminate the need of laboratory fitting tests in compliance with ASHRAE Standard 120 (2008) and further facilitate the design process of duct and HVAC systems. In this article, computational fluid dynamics software was used to calculate the loss coefficients for two duct fittings, a flat-oval straight-body lateral and a flat-oval straight-body Tee. Two loss coefficients, namely Cs (main loss coefficient) and Cb (branch loss coefficient), were calculated for each fitting for both converging and diverging airflows at various flow splits and flow rates, with flow velocities in the main and branch sections ranging between 6 m/s and 20 m/s (1181 fpm and 3937 fpm). The configurations modeled replicated experimental test apparatus in compliance with ASHRAE Standard 120. The numerical simulation effor...

Prediction of duct fitting losses using computational fluid dynamics

Typical Heatsink design includes base and fin thickness, fin height, and fin gap optimization. In situations where material cost or mass of the heat sink are also a design priority further optimization with respect to mass removal can be significant. This paper discusses a method to further improve a heat sink topology by the systematic removal of heat sink mass where the Thermal BottleNeck (BN) Number was found to be lowest.

Subtractive design: A novel approach to heatsink improvement

A classical heatsink design approach entails an assumption of the heatsink area extending fin topology followed by a parametric optimisation to maximize thermal performance and potentially minimise mass. This paper presents an alternative approach whereby the fin topology is identified as part of the optimisation process. This involves a generative heatsink growth stage so as to minimise the overall heatsink thermal resistance followed by a heatsink mass reduction stage that seeks to remove mass without unduly affecting thermal performance. Application to an automotive audio amplifier is presented, resulting in an 18% reduction in heatsink mass with no detriment to thermal performance compared to an existing angled plate fin type topology.

Generative heatsink design for an automotive audio amplifier

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