Embodiments disclosed herein include a resin composition comprising two or more different kinds of thermosetting resins, wherein at least one of the two or more different kinds of the thermosetting resins is a multifunctional resin, and a core-shell particle having a core and a shell, wherein a composition of the core is different from a composition of the shell and the composition of the shell has a branched polymer structure comprising at least one main chain and at least one side chain, the main chain or the side chain containing at least one functional group that reacts with the thermosetting resin, a method of manufacturing the resin composition, and a composite comprising a reinforcing fiber and the resin composition.

Toughened fiber reinforced polymer composite with core-shell particles

An uncured assembly which comprises a fibrous reinforcement. Associated with said reinforcement is a resin material comprising at least one solid amine-terminated epoxy resin, at least one solid epoxy-terminated epoxy resin and optionally at least one cure catalyst.

Fibre reinforced assembly

Patches consisting of transparent or translucent shape memory material can be manufactured so as to affect repair of transparent or translucent parts that have been damaged. These patches can be used to cover cracks and holes or provide additional structural support for the damaged parts. The patches can vary greatly in size and properties depending on the desired application.

Method of making and using shape memory polymer patches

Producing a circuit board, by laminating, on a substrate, an adhesive film with a metal film, which comprises a water-soluble polymer release layer, a metal film layer and a curable resin composition layer, which are formed in this order on a support layer, and has a release property enabling detachment of said water-soluble polymer release layer from the support layer after curing of the curable resin composition layer, such that the curable resin composition layer contacts the substrate; curing the curable resin composition layer; detaching the support layer, and removing the water-soluble polymer release layer present on the metal film layer by dissolving the release layer in an aqueous solution, efficiently forms an insulating layer and a metal film layer superior in adhesiveness to the insulating layer and in uniformity. By this method, a metal film layer having high adhesiveness and high property uniformity can be formed on the surface without the need for roughening the surface of an insulating layer with an oxidant such as alkaline potassium permanganate solution and the like. Thus, etching for circuit formation can be performed under milder conditions, which in turn provides a superior effect on micro wiring on circuit boards such as multi-layer printed wiring boards, flexible printed wiring boards, and the like.

Process for producing circuit board

Films for metal film transfer, which contain (a) a support layer, (b) a release layer formed on the support layer, which is comprised of one or more kinds of water-soluble polymers selected from a water-soluble cellulose resin, a water-soluble polyester resin, and a water-soluble acrylic resin, and (c) a metal film layer formed on the release layer, show superior transferability of the metal film layer. Such films are useful for efficiently producing circuit boards by laminating the film for metal film transfer on a curable resin composition layer on a substrate such that the metal film layer is in contact with a surface of the curable resin composition layer, curing the curable resin composition layer, detaching the support layer, and removing the release layer on the metal film layer by dissolving the release layer in an aqueous solution.

Film for metal film transfer, method for transferring metal film, and method for manufacturing circuit board

Uncured composite materials (prepreg) are provided that are stable at room temperature over relatively long periods of time. The prepreg includes a solid epoxy resin matrix composed of a crystalline epoxy resin and a solid curing agent. The curing agent is preferably crystalline. The prepreg may include one or more property enhancement layers that increase the tackiness of the prepreg, increase the flexibility of the prepreg and/or reduce the amount of solid resin matrix that flakes from the prepreg during handling.

Room temperature stable epoxy prepregs

A fibre reinforced resin assembly comprising a fibrous web and a matrix resin
composition comprising a crystalline epoxy resin and a crystalline epoxy resin curing
agent, wherein the said epoxy resin curing agent is substantially uniformly dispersed in
the crystalline epoxy resin.

Fibre reinforced resin assembly

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Room temperature stable epoxy prepregs

Fibre reinforced resin assembly