Construction of 3D boron nitride nanosheets/silver networks in epoxy-based composites with high thermal conductivity via in-situ sintering of silver nanoparticles

The integrated circuits industry has been continuously producing microelectronic components with ever higher integration level, packaging density, and power density, which demand more stringent requirements for heat dissipation. Electronic packaging materials are used to pack these microelectronic components together, help to dissipate heat, redistribute stresses, and protect the whole system from the environment. They serve an important role in ensuring the performance and reliability of the electronic devices. Among various packaging materials, epoxy‐based underfills are often employed in flip‐chip packaging. However, widely used capillary underfill materials suffer from their low thermal conductivity, unable to meet the growing heat dissipation required of next‐generation IC chips with much higher power density. Many strategies have been proposed to improve the thermal conductivity of epoxy, but its application as underfill materials with complex performance requirements is still difficult. In fact, optimizing the combined thermal–electrical–mechanical–processing properties of underfill materials for flip‐chip packaging remains a great challenge. Herein, state‐of‐the‐art advances that have been made to satisfy the key requirements of capillary underfill materials are reviewed. Based on these studies, the perspectives for designing high‐performance underfill materials with novel microstructures in electronic packaging for high‐power density electronic devices are provided.

Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review

Epoxidized soybean oil (ESO)-derived epoxy thermosets are usually limited by their poor mechanical properties and non-reprocessability. Herein, we report sustainable epoxy vitrimers synthesized fac...

Sustainable Epoxy Vitrimers from Epoxidized Soybean Oil and Vanillin

Thermal conductive polymer composites attract lots of research due to the continuous miniaturization and multi-function of electronic equipment. As a common ceramic, Al2O3 owns relatively high thermal conductivity, high electrical resistivity and satisfactory cost performance, which is considered as the high-quality filler to prepare thermal conductive and electrical insulated composites. This paper reviews current progress in the development of Al2O3 reinforced polymer composites. We firstly summarize the preparation methods of spherical Al2O3, then heat conduction mechanisms and main factors affecting thermal conductivity are introduced. Next, we focus on the common research of Al2O3 in improving the thermal conductivity of polymers, including surface modification, filler hybridization and construction of Al2O3 network by various processing methods, and some emerging applications of thermal conductive polymer composites are introduced subsequently. After a critique of recent studies, we identify several outstanding issues must be addressed if higher thermal conductivity is fully realized.

Recent progress of thermal conductive ploymer composites: Al2O3 fillers, properties and applications

Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability

In this study, epoxy (EP)/binary spherical alumina (S-Al2O3) composites with a high loading of 50 vol% were fabricated by incorporating different sizes of S-Al2O3 into EP to increase the thermal conductivity and yet retain the flowability of the composites. Notably, a distinctly reduced viscosity (21.8 Pa·s) and a highly increased thermal conductivity (1.364 W/m·K) were achieved by a binary S-Al2O3 mixture with 80% 30 μm and 20% 5 μm alumina that would have a theoretical maximum packing volume, thus permitting larger available free volume for the motion of particles and hence reducing the friction between them. Also, these EP/S-Al2O3 binary composites possessed superior electrical insulation, high thermal stability, significantly reduced thermal expansion coefficient and good mechanical properties. These combined desirable properties indicate that binary S-Al2O3 mixtures with an optimized size distribution and maximum packing volume are best candidates to develop high-performance epoxy-based underfill materials which would improve the flip-chip reliability.

High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging

Investigation on the microstructure, texture and mechanical properties of Mg-Gd-Y(-Zn)-Zr alloys under indirect extrusion

Novel Eco-friendly Slurries for Chemical Mechanical Polishing of GCr15 Bearing Steel

Smooth surfaces are conducive to improving the lubrication of gears in mechanical systems. In this study, chemical mechanical polishing (CMP) was used to process 18CrNiMo7-6 case hardening steel, a typical material for gears. The results reveal that compared with formic acid and oxalic acid, citric acid can be used as a suitable complexing agent without causing apparent corrosion, probably due to the fact of its relatively stable adsorption. A synergistic effect exists between citric acid and H2O2. At pH 3, with 0.067 M citric acid and 1 wt% H2O2, a satisfactory CMP performance (i.e., a 514 nm/min material removal rate (MRR) and a 0.85 nm surface roughness Sa) was achieved. After polishing, no observable defects were found on the surface, and no discernible processing damage occurred to the substrate. In terms of the CMP’s mechanism, iron is first oxidized to Fe2+ and Fe3+, which then react with citric acid to form complexes. On the one hand, most of the complexes may stay on the surface to prevent further corrosion and, thus, the surface quality is excellent. On the other hand, the complexes may reduce the surface integrity and, thus, the MRR is high. The findings open new avenues for attaining ultra-smooth steel surfaces with CMP through controlling corrosive wear.

/pdf/attaining-ultra-smooth-18crnimo7-6-case-hardening-steel-767jcd2v.pdf

Attaining Ultra-Smooth 18CrNiMo7-6 Case Hardening Steel Surfaces with Chemical Mechanical Polishing

Epoxy/ionic liquid-like MWCNTs composites with improved processability and mechanical properties

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