Jing Zhou
Chinese Academy of Sciences
18 Papers
33 Citations
Jing Zhou is an academic researcher from Chinese Academy of Sciences. The author has contributed to research in topics: Signal integrity & Silicon. The author has an hindex of 4, co-authored 18 publications.
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Papers
Study of equivalent thermal modeling and simulation of 2.5D/3D stacked dies module
Fengwei Dai,Daquan Yu,Jing Zhou,He Ma,Xiaomeng Wu,Xiangmeng Jing,Chongshen Song,Hongwen He +7 more
- 01 Aug 2013
TL;DR: In this article, an equivalent modeling method is proposed to simplify thermal simulation model of 2.5D/3D stacked dies modules, which can not only obtain thermal characteristics of each part of the stacked dies module, but also can greatly simplify the calculation amount of numerical simulation.
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Nonlinear thermo-mechanical analysis of TSV interposer filling with solder, Cu and Cu-cored solder
Ran He,Huijuan Wang,Jing Zhou,Xueping Guo,Daquan Yu,Lixi Wan +5 more
- 03 Nov 2011
TL;DR: In this article, a Cu-cored solder via filling method was proposed to form a low-resistance via interconnect, which offers a rapid, low-cost process for TSV manufacturing.
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Accurate electrical simulation and design optimization for silicon interposer considering the MOS effect and eddy currents in the silicon substrate
Jing Zhou,Lixi Wan,Fengwei Dai,Huijuan Wang,Chongshen Song,Tianmin Du,Yanbiao Chu,Maoyun Pan,Daniel Guidotti,Liqiang Cao,Daquan Yu +10 more
- 30 Jul 2012
TL;DR: In this paper, a group of coplanar lines on a silicon dioxide insulating layer on a nominally doped silicon substrate is simulated and measured, and several optimized transmission line structures are designed and simulated.
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Nonlinear thermal stress & strain analysis of through silicon vias with different structures and polymer filling
Jing Zhou,Daquan Yu,Ran He,Feng WeiDai,Xueping Guo,Chongshen Song,Huijuan Wang,Daniel Guidotti,Liqiang Cao,Lixi Wan +9 more
- 01 Dec 2011
TL;DR: In this article, the role of via geometry on thermal stress relief is investigated in a finite element method (FEM) simulation software to analyze the influence of TSV shape on the nonlinear thermal stresses and strains generated under temperature cycling.
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An electrical design and fabrication of a 12-channel optical transceiver with SiP packaging technology
Wei Gao,Zhihua Li,Jian Song,Xu Zhang,Chen Feng,Fengman Liu,Yunyan Zhou,Jun Li,Haifei Xiang,Jing Zhou,Shuhua Liu,Yu Wang,Qidong Wang,Baoxia Li,Zhan Shi,Liqiang Cao,Lixi Wan +16 more
- 01 Jun 2010
TL;DR: In this paper, an electrical design of a 6.25Gbps×12-channel parallel optical transceiver with SiP packaging technology is presented, where a low impedance and low noise power distribution network (PDN) is designed to suppress simultaneous switching noise (SSN) and a novel embedded capacitor filter is used to replace the conventional power supply filter.
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