Jeffrey A. Lev
Hewlett-Packard
84 Papers
839 Citations
Jeffrey A. Lev is an academic researcher from Hewlett-Packard. The author has contributed to research in topics: Heat sink & Heat pipe. The author has an hindex of 16, co-authored 84 publications.
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Papers
Patent
Heat dissipation structure for electronic apparatus component
Lawrence A. Stone,Jeffrey A. Lev,Curt L. Progl +2 more
- 28 Mar 2002
TL;DR: In this article, a computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess, with an evaporating end portion of the heat pipe overlying the die recess and being resiliently deflectable toward a phase change thermal pad mounted on the top side of the die and inset into the housing die.
65
Patent
Push-button latching mechanism
Jeffrey A. Lev
- 10 Sep 2004
TL;DR: A latching mechanism comprising a hook connected to a first component and a second component extending from the first component was described in this paper. But the hook was not connected to the second component.
41
Patent
Tablet Computers Having An Internal Antenna
Jeffrey A. Lev,Paul J. Doczy,Mark S. Tracy +2 more
- 07 Jul 2008
TL;DR: In this paper, a tablet computer including a display panel and a base comprising a metal-free zone adjacent its front edge, which is positioned adjacent the top edge of the display panel when the tablet computer is placed in a tablet mode orientation, wherein the metal free zone facilitates operation of the antenna.
39
Patent
Keyboard illumination system
Jeffrey A. Lev,Jonathan R. Harris +1 more
- 14 Jan 2009
TL;DR: A keyboard illumination system (12) comprises an electronic device (10) having a keyboard (22) with at least one keycap (24), the keycap having disposed thereon at least two different legends (30) visible in response to being illuminated with an ultraviolet (UV) light source (50).
37
Patent
Computer device cooling system
Mark S. Tracy,Paul J. Doczy,Jeffrey A. Lev +2 more
- 19 Oct 2005
TL;DR: A computer device comprises at least two operational components disposed within a housing of the computer device and a cooling system thermally coupled to these components, the cooling system configured to receive an airflow through at least one inlet and discharge the airflow through two outlets to dissipate thermal energy generated by the at least 2 operational components as discussed by the authors.
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